JPH0310544U - - Google Patents

Info

Publication number
JPH0310544U
JPH0310544U JP6904089U JP6904089U JPH0310544U JP H0310544 U JPH0310544 U JP H0310544U JP 6904089 U JP6904089 U JP 6904089U JP 6904089 U JP6904089 U JP 6904089U JP H0310544 U JPH0310544 U JP H0310544U
Authority
JP
Japan
Prior art keywords
header
integrated circuit
circuit package
chip
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6904089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6904089U priority Critical patent/JPH0310544U/ja
Publication of JPH0310544U publication Critical patent/JPH0310544U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る集積回路パツケージの一
実施例を示す断面図、第２図は集積回路パツケー
ジに振動を加えている様子を示す図、第３図は集
積回路パツケージに加速度を加えている様子を示
す図である。 １……ヘツダ、２……絶縁基板、３……ＩＣチ
ツプ、４……リード線、５……ボンデイングワイ
ヤ、６……カバー、７……開口部、８……集積回
路パツケージ、９……ゲル状コート剤。 FIG. 1 is a cross-sectional view showing an embodiment of an integrated circuit package according to the present invention, FIG. 2 is a view showing vibrations being applied to the integrated circuit package, and FIG. 3 is a view showing applying acceleration to the integrated circuit package. FIG. DESCRIPTION OF SYMBOLS 1... Header, 2... Insulating substrate, 3... IC chip, 4... Lead wire, 5... Bonding wire, 6... Cover, 7... Opening, 8... Integrated circuit package, 9... Gel coating agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヘツダ内にＩＣチツプを収納し、このヘツダの
開口部を、内面にゲル状コート剤を塗布したカバ
ーによつて気密封止したことを特徴とする集積回
路パツケージ。 An integrated circuit package characterized in that an IC chip is housed in a header, and the opening of the header is hermetically sealed with a cover whose inner surface is coated with a gel-like coating agent.
JP6904089U 1989-06-15 1989-06-15 Pending JPH0310544U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6904089U JPH0310544U (en) 1989-06-15 1989-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6904089U JPH0310544U (en) 1989-06-15 1989-06-15

Publications (1)

Publication Number Publication Date
JPH0310544U true JPH0310544U (en) 1991-01-31

Family

ID=31604006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6904089U Pending JPH0310544U (en) 1989-06-15 1989-06-15

Country Status (1)

Country Link
JP (1) JPH0310544U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345841A (en) * 1986-08-13 1988-02-26 Hitachi Hokkai Semiconductor Ltd semiconductor equipment
JPS647643A (en) * 1987-06-30 1989-01-11 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345841A (en) * 1986-08-13 1988-02-26 Hitachi Hokkai Semiconductor Ltd semiconductor equipment
JPS647643A (en) * 1987-06-30 1989-01-11 Nec Corp Semiconductor device

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