JPH0310547U - - Google Patents
Info
- Publication number
- JPH0310547U JPH0310547U JP1989072219U JP7221989U JPH0310547U JP H0310547 U JPH0310547 U JP H0310547U JP 1989072219 U JP1989072219 U JP 1989072219U JP 7221989 U JP7221989 U JP 7221989U JP H0310547 U JPH0310547 U JP H0310547U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor
- sink member
- contact
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
Description
第１図ａ，ｂ，ｃは本考案による半導体放熱用
ヒートシンク部材の実施例を示す斜視図、第２図
は本考案のヒートシンク部材を用いた半導体組立
工程を示す正面図、第３図は半導体組立状態の同
上図、第４図は従来の半導体組立工程を示す正面
図である。 １……基板、２……ヒートシンク部材、３……
半導体素子、４，５……鑞材、Ｊ……加熱治具。
ヒートシンク部材の実施例を示す斜視図、第２図
は本考案のヒートシンク部材を用いた半導体組立
工程を示す正面図、第３図は半導体組立状態の同
上図、第４図は従来の半導体組立工程を示す正面
図である。 １……基板、２……ヒートシンク部材、３……
半導体素子、４，５……鑞材、Ｊ……加熱治具。
Claims (1)
- 半導体放熱用のヒートシンク部材において、該
ヒートシンク部材が半導体と接する面、及び、該
ヒートシンク部材が基板と接する面のうち、片面
又は両面に予じめ鑞材が一体化されていることを
特徴とする半導体放熱用ヒートシンク部材。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989072219U JPH0310547U (ja) | 1989-06-20 | 1989-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989072219U JPH0310547U (ja) | 1989-06-20 | 1989-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310547U true JPH0310547U (ja) | 1991-01-31 |
Family
ID=31609964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989072219U Pending JPH0310547U (ja) | 1989-06-20 | 1989-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310547U (ja) |
-
1989
- 1989-06-20 JP JP1989072219U patent/JPH0310547U/ja active Pending