JPS63105331U - - Google Patents

Info

Publication number
JPS63105331U
JPS63105331U JP1986204064U JP20406486U JPS63105331U JP S63105331 U JPS63105331 U JP S63105331U JP 1986204064 U JP1986204064 U JP 1986204064U JP 20406486 U JP20406486 U JP 20406486U JP S63105331 U JPS63105331 U JP S63105331U
Authority
JP
Japan
Prior art keywords
semiconductor device
soldering
mesh member
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986204064U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986204064U priority Critical patent/JPS63105331U/ja
Publication of JPS63105331U publication Critical patent/JPS63105331U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例による半導体装置の組立
構成図、第２図は第１図におけるメツシユ部材を
含む半田材料の斜視図である。各図において、 １：基板、２：電子部品、３：ヒートシンク、
４：半田層、５：メツシユ部材。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１） 基板ないしヒートシンク上に搭載した電
    子部品を半田付け接合法により固定して成る半導
    体装置において、互いに接合し合う部品相互間の
    面域にメツシユ部材を含む半田材料を介挿して半
    田付け接合したことを特徴とする半導体装置。
  2. （２） 実用新案登録請求の範囲第１項記載の半
    導体装置において、メツシユ部材が半田よりも熱
    伝導性の高い金属材で作られていることを特徴と
    する半導体装置。
JP1986204064U 1986-12-24 1986-12-24 Pending JPS63105331U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986204064U JPS63105331U (ja) 1986-12-24 1986-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986204064U JPS63105331U (ja) 1986-12-24 1986-12-24

Publications (1)

Publication Number Publication Date
JPS63105331U true JPS63105331U (ja) 1988-07-08

Family

ID=31169973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986204064U Pending JPS63105331U (ja) 1986-12-24 1986-12-24

Country Status (1)

Country Link
JP (1) JPS63105331U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012064845A (ja) * 2010-09-17 2012-03-29 Mitsubishi Electric Corp 半導体装置とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012064845A (ja) * 2010-09-17 2012-03-29 Mitsubishi Electric Corp 半導体装置とその製造方法

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