JPH03109331U - - Google Patents

Info

Publication number
JPH03109331U
JPH03109331U JP1739790U JP1739790U JPH03109331U JP H03109331 U JPH03109331 U JP H03109331U JP 1739790 U JP1739790 U JP 1739790U JP 1739790 U JP1739790 U JP 1739790U JP H03109331 U JPH03109331 U JP H03109331U
Authority
JP
Japan
Prior art keywords
cleaning
cleaning liquid
semiconductor wafer
circulation means
cleaning tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1739790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1739790U priority Critical patent/JPH03109331U/ja
Publication of JPH03109331U publication Critical patent/JPH03109331U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

添付の図面は本考案の半導体ウエハー洗浄装置
の一実施例を示す説明図である。 1……洗浄槽、2……洗浄液供給管、3……第
1の洗浄液排出部、4……第2の洗浄液排出部、
5……バルブ、6,7……ポンプ、8,9……濾
過フイルタ、10……スノコ、11……半導体ウ
エハー、12……キヤリア治具。
The attached drawings are explanatory diagrams showing one embodiment of the semiconductor wafer cleaning apparatus of the present invention. DESCRIPTION OF SYMBOLS 1... Cleaning tank, 2... Cleaning liquid supply pipe, 3... First cleaning liquid discharge part, 4... Second cleaning liquid discharge part,
5...Valve, 6,7...Pump, 8,9...Filtering filter, 10...Drain board, 11...Semiconductor wafer, 12...Carrier jig.

Claims (1)

【実用新案登録請求の範囲】 1 キヤリア治具に搭載された複数の半導体ウエ
ハーをキヤリア治具ごと洗浄槽内に設置し、洗浄
槽内の上面からオーバーフローする洗浄液を洗浄
槽に循環させる洗浄液循環手段を設けて、半導体
ウエハー表面に付着した異物粒子を除去する半導
体ウエハー洗浄装置において、 洗浄槽の上部から洗浄槽の内壁に沿つて下降す
る洗浄液流に含まれる異物粒子を除去するため、
洗浄槽の周囲に上記洗浄液循環手段とは別に第2
の洗浄液循環手段を設けたことを特徴とする半導
体ウエハー洗浄装置。 2 上記第2の洗浄液循環手段は、洗浄槽の周囲
に複数個設けられていることを特徴とする請求項
1記載の半導体ウエハー洗浄装置。 3 上記第2の洗浄液循環手段は、洗浄槽の中央
部分に複数個設けられた直径1mm程度の吸引管と
、洗浄槽内の洗浄液を上記複数の吸引管を介して
吸引するポンプとを含んで構成されることを特徴
とする請求項1記載の半導体ウエハー洗浄装置。
[Scope of Claim for Utility Model Registration] 1. A cleaning liquid circulation means in which a plurality of semiconductor wafers mounted on a carrier jig are installed together with the carrier jig in a cleaning tank, and cleaning liquid overflowing from the upper surface of the cleaning tank is circulated into the cleaning tank. In semiconductor wafer cleaning equipment that removes foreign particles adhering to the surface of semiconductor wafers, in order to remove foreign particles contained in the cleaning liquid flow that descends from the top of the cleaning tank along the inner wall of the cleaning tank,
In addition to the above-mentioned cleaning liquid circulation means, there is a second
1. A semiconductor wafer cleaning apparatus characterized in that a cleaning liquid circulation means is provided. 2. The semiconductor wafer cleaning apparatus according to claim 1, wherein a plurality of said second cleaning liquid circulation means are provided around the cleaning tank. 3 The second cleaning liquid circulation means includes a plurality of suction pipes each having a diameter of about 1 mm provided in the central part of the cleaning tank, and a pump that sucks the cleaning liquid in the cleaning tank through the plurality of suction pipes. 2. The semiconductor wafer cleaning apparatus according to claim 1, further comprising a semiconductor wafer cleaning apparatus.
JP1739790U 1990-02-26 1990-02-26 Pending JPH03109331U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1739790U JPH03109331U (en) 1990-02-26 1990-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1739790U JPH03109331U (en) 1990-02-26 1990-02-26

Publications (1)

Publication Number Publication Date
JPH03109331U true JPH03109331U (en) 1991-11-11

Family

ID=31520609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1739790U Pending JPH03109331U (en) 1990-02-26 1990-02-26

Country Status (1)

Country Link
JP (1) JPH03109331U (en)

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