JPH03109367U - - Google Patents
Info
- Publication number
- JPH03109367U JPH03109367U JP1854790U JP1854790U JPH03109367U JP H03109367 U JPH03109367 U JP H03109367U JP 1854790 U JP1854790 U JP 1854790U JP 1854790 U JP1854790 U JP 1854790U JP H03109367 U JPH03109367 U JP H03109367U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- metal core
- insulating resin
- resin layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるプリント配
線板素材の平面図、第２図は第１図の−線に
沿つた断面図、第３図は第１図のプリント配線板
素材から切り取つた基板の平面図、第４図はこの
考案の他の実施例によるプリント配線板素材から
切り取つた基板の平面図、第５図はこの考案のさ
らに他の実施例によるプリント配線板素材から切
り取つた基板の平面図、第６図は従来のプリント
配線板素材の平面図、第７図は第６図のプリント
配線板素材から切り取つた基板の平面図、第８図
は第７図の−線に沿つた断面図である。
図において、１はプリント配線板素材、２ａ，
３ａは外形線、２ｂ，３ｂはプリント配線基板、
４は導体層、５は絶縁樹脂層、６は金属芯、７は
切欠き、８は溝、９は穴、１０は溝部。なお、図
中、同一符号は同一、又は相当部分を示す。
Figure 1 is a plan view of a printed wiring board material according to an embodiment of this invention, Figure 2 is a sectional view taken along the - line in Figure 1, and Figure 3 is a diagram cut out from the printed wiring board material shown in Figure 1. FIG. 4 is a plan view of a board cut from a printed wiring board material according to another embodiment of this invention, and FIG. 5 is a plan view of a board cut from a printed wiring board material according to yet another embodiment of this invention. FIG. 6 is a plan view of a conventional printed wiring board material, FIG. 7 is a plan view of a board cut from the printed wiring board material of FIG. 6, and FIG. 8 is a plan view taken along the - line in FIG. It is a sectional view of the ivy. In the figure, 1 is a printed wiring board material, 2a,
3a is the outline, 2b and 3b are printed wiring boards,
4 is a conductor layer, 5 is an insulating resin layer, 6 is a metal core, 7 is a notch, 8 is a groove, 9 is a hole, and 10 is a groove portion. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
な寸法の金属芯と、この金属芯の両面に設けた絶
縁樹脂層と、この絶縁樹脂層上に設けた導体層と
を備えた金属芯入りプリント配線板素材において
、前記プリント配線基板間の切断線に沿つて前記
金属芯に設けられた切欠きと、この切欠きに沿つ
て前記絶縁樹脂層に設けられた溝とを備えたこと
を特徴とする金属芯入りプリント配線板素材。 A printed wiring board with a metal core, which includes a metal core with dimensions that allow cutting out multiple printed wiring boards, an insulating resin layer provided on both sides of the metal core, and a conductor layer provided on the insulating resin layer. A metal material characterized in that the material includes a notch provided in the metal core along the cutting line between the printed wiring boards, and a groove provided in the insulating resin layer along the notch. Core printed wiring board material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1854790U JPH03109367U (en) | 1990-02-26 | 1990-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1854790U JPH03109367U (en) | 1990-02-26 | 1990-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109367U true JPH03109367U (en) | 1991-11-11 |
Family
ID=31521704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1854790U Pending JPH03109367U (en) | 1990-02-26 | 1990-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109367U (en) |
-
1990
- 1990-02-26 JP JP1854790U patent/JPH03109367U/ja active Pending