JPH01104663U - - Google Patents
Info
- Publication number
- JPH01104663U JPH01104663U JP20045387U JP20045387U JPH01104663U JP H01104663 U JPH01104663 U JP H01104663U JP 20045387 U JP20045387 U JP 20045387U JP 20045387 U JP20045387 U JP 20045387U JP H01104663 U JPH01104663 U JP H01104663U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- clip
- board
- land
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は、本考案の実施例を示す回路基板の一
部クリツプリードを分解した斜視図、第２図は、
同回路基板をマザーボードに搭載した状態の側面
図、第３図は、クリツプリードの他の実施態様を
示す斜視図、第４図は、同クリツプリードを使用
した回路基板の要部平面図、第５図は、第４図の
Ａ―Ａ線断面図、第６図と第７図は、従来例を示
す回路基板をマザーボードに搭載した状態の側面
図である。
FIG. 1 is an exploded perspective view of a partial clip lead of a circuit board showing an embodiment of the present invention, and FIG.
FIG. 3 is a side view of the circuit board mounted on the motherboard; FIG. 3 is a perspective view showing another embodiment of the clip lead; FIG. 5 is a sectional view taken along the line AA in FIG. 4, and FIGS. 6 and 7 are side views of a conventional circuit board mounted on a motherboard.
Claims (1)
形成し、前記基板のリードランドの部分を両側か
らクリツプリードのクリツプ部で挟み、該クリツ
プ部を前記リードランドに導電固着した回路基板
に於て、前記基板のリードランドの近傍に、該基
板の一辺側に開口し、同辺と直交する細長い切込
み溝を設け、コ字形のクリツプ部の少なくとも一
片からその面に沿つて延設されたリード部を有す
るリードクリツプを用い、該クリツプ部を前記切
込み溝に差し込むと共に、同クリツプ部で基板を
挟み込み、かつこれを前記リードランドに導電固
着してなることを特徴とする回路配線基板。 In a circuit board, a lead land is formed on one side of a board on which a circuit is formed, the lead land portion of the board is sandwiched between clip parts of a clip lead from both sides, and the clip part is conductively fixed to the lead land, A long and narrow cut groove is provided in the vicinity of the lead land of the board and is open on one side of the board and perpendicular to the same side, and a lead part is provided extending from at least one side of the U-shaped clip part along that surface. What is claimed is: 1. A circuit wiring board characterized in that a lead clip having a lead clip is used, the clip part is inserted into the cut groove, a board is sandwiched between the clip part, and this is conductively fixed to the lead land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20045387U JPH01104663U (en) | 1987-12-30 | 1987-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20045387U JPH01104663U (en) | 1987-12-30 | 1987-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104663U true JPH01104663U (en) | 1989-07-14 |
Family
ID=31490859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20045387U Pending JPH01104663U (en) | 1987-12-30 | 1987-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104663U (en) |
-
1987
- 1987-12-30 JP JP20045387U patent/JPH01104663U/ja active Pending
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