JPH03110159A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPH03110159A JPH03110159A JP1250122A JP25012289A JPH03110159A JP H03110159 A JPH03110159 A JP H03110159A JP 1250122 A JP1250122 A JP 1250122A JP 25012289 A JP25012289 A JP 25012289A JP H03110159 A JPH03110159 A JP H03110159A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- prepreg
- laminated sheet
- continuously
- aftercuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004744 fabric Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 14
- 238000000465 moulding Methods 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 239000011888 foil Substances 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000010791 quenching Methods 0.000 abstract description 2
- 230000000171 quenching effect Effects 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 238000011437 continuous method Methods 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明は、プリント配線板として用いられる積層板の連
続工法による製造方法に関するものである。The present invention relates to a method for manufacturing a laminated board used as a printed wiring board by a continuous method.
積層板は通常、紙やプラス布などを基材としてこれに熱
硬化性樹脂を含浸乾燥することによってプリプレグを調
製すると共に、このプリプレグを所定の定寸法に切断し
、この定寸法に切断した複数枚のプリプレグ及び必要に
応じて銅箔などの金属箔を重ね、これをプレス装置にプ
レートを介して10〜14組重ねてセットし、上下の熱
盤によって所定時間加熱加圧する多段積層成形をおこな
うことによって、製造がおこなわれている。しかし、こ
のように多段積層成形で積層板を製造する場合は、バッ
チ作業となるために作業能率が悪く、生産性に多大の問
題を有する。
このために、本出願人によって積層板を連続工法で製造
する方法が特開昭60−189439号公報等によって
提供されている。すなわち、複数枚の長尺のプリプレグ
を重ねて連続的に送りつつ、必要に応じてさらに長尺の
金属箔を重ね、そしてこれをダブルベルトに連続的に通
してダブルベルトによって加熱加圧することによって、
積層板を連続して成形することがでさるようにしたもの
である。この方法によれば、連続した成形作業で積層板
を製造できるために生産能率がパッチ作業の多段積層成
形よりも飛躍的に向上する。Laminated boards are usually prepared by preparing prepreg by using paper or plastic cloth as a base material and impregnating it with a thermosetting resin and drying it.The prepreg is then cut into a predetermined size, and a plurality of sheets are cut into a predetermined size. Layer sheets of prepreg and metal foil such as copper foil as necessary, set 10 to 14 stacks of these in a press via plates, and perform multi-stage lamination molding by heating and pressing for a predetermined period of time using upper and lower heating plates. Manufacturing is carried out by this. However, when a laminate is manufactured by multi-stage lamination molding in this manner, the work efficiency is poor due to batch work, and there are many problems in productivity. For this purpose, the present applicant has proposed a method of manufacturing a laminate using a continuous method, such as in Japanese Patent Laid-Open No. 189439/1983. In other words, multiple sheets of long prepreg are piled up and continuously fed, and if necessary, a long metal foil is piled up, and this is continuously passed through a double belt and heated and pressurized by the double belt. ,
This allows continuous molding of laminated plates. According to this method, since the laminate can be manufactured by continuous molding operations, the production efficiency is dramatically improved compared to multi-stage lamination molding using patch operations.
一方、電子工業や通信、コンピュータなどの分野におい
て使用される周波数は高周波の領域にシフトされており
、このような高周波領域で用いられるプリント配線板の
積層板においては、信号の伝播遅延を短くするうえで誘
電率がより小さいことが要求されている。このためにこ
のような高周波特性が優れた積層板を得るために、積層
板を構成する樹脂、すなわちプリプレグの樹脂として周
波数特性に優れた例えば特許出願公表昭61−5004
34号のような芳香族ポリイソシアネートなどを用いる
ことがなされているが、高周波特性に優れた樹脂は一般
に高温(場合によっては250〜300℃)で長時間(
場合によっては1〜2時間)成形をおこなう必要がある
。
しかし、プリプレグを連続的にダブルベルトに通して加
熱加圧成形する場合には、高温で長時間成形を持続させ
ることができないために、このような高周波特性が優れ
た樹脂を用いて調製したプリプレグを使用して上記のよ
うなダブルベルトによる連続工法で積層板を製造するこ
とはできないものであり、高周波特性に優れた積層板を
連続工法で製造することは困難であるというのが現状で
ある。
本発明は上記の真に鑑みて為されたものであり、高周波
特性に優れた積層板を連続工法で製造することができ、
加えて寸法安定性を高めることができる積層板の製造方
法を提供することを目的とするものである。On the other hand, the frequencies used in fields such as the electronics industry, communications, and computers are being shifted to high-frequency regions, and printed wiring board laminates used in such high-frequency regions are designed to shorten signal propagation delays. Moreover, a smaller dielectric constant is required. For this reason, in order to obtain such a laminate with excellent high frequency characteristics, a resin constituting the laminate, that is, a prepreg resin, which has excellent frequency characteristics, such as a patent application published in 1988-5004, has been developed.
Aromatic polyisocyanates such as No. 34 have been used, but resins with excellent high frequency properties are generally used at high temperatures (250 to 300°C in some cases) for long periods of time (
In some cases, it may be necessary to perform molding for 1 to 2 hours. However, when the prepreg is continuously passed through a double belt and molded under heat and pressure, it is impossible to sustain the molding for a long time at high temperatures. It is not possible to manufacture laminates using the above-mentioned continuous method using double belts, and the current situation is that it is difficult to manufacture laminates with excellent high frequency characteristics using the continuous method. . The present invention has been made in view of the above-mentioned truth, and it is possible to manufacture a laminate with excellent high frequency characteristics by a continuous method,
In addition, it is an object of the present invention to provide a method for manufacturing a laminate that can improve dimensional stability.
本発明に係る積層板の製造方法は、フッ素樹脂布を基材
として調製した長尺のプリプレグ1を連続的に送りつつ
所要枚数のこのプリプレグ1,1・・・を重ね合わせ、
これをダブルベルト2に連続して送り込んで積層成形し
、所定寸法に切断した後にアフターキュアーすると共に
フッターキユアー後に急冷することを特徴とするもので
ある。
以下本発明の詳細な説明する。
プリプレグ1は基材に樹脂のワニスを含浸させて乾燥す
ることによって、長尺のものとして調製される。本発明
においてはこの基材として、フッ素樹脂(ポリテトラフ
ルオロエチレン)の布を用いるものである。フッ素樹脂
布はフッ素樹脂繊維の織布あるいは不織布として作成さ
れているものであり、例えばダイキン工業株式会社から
ボリプン布として市販されているものを用いることがで
きる。また本発明において、フッ素樹脂布に含浸させる
樹脂としては任意のものを用いることができるが、特に
エポキシ樹脂などの熱硬化性樹脂が好ましい。
そして第1図に示すように、このプリプレグ1をロール
状に巻いたものから巻き外して所定枚数を〃イドロール
6を経由させ連続的に送り、重ねロール7によって各プ
リプレグ1を連続的に重ね合わせる。一方、銅箔などの
金属箔10も長尺に形成してロール状に巻いておき、こ
れを巻き外して上記の重ね合わせたプリプレグ1の最外
層の外面に重ね合わせる。両面金属箔張り積層板を製造
する場合には、2枚の金属9i10を用いて重ね合わせ
たプリプレグ1の同量外層に重ねるようにし、また片面
金属箔張り積層板を製造する場合には、一方の最外層に
のみ金属箔10を重ねるようにすると共に他方の最外層
には7ツ素樹脂フイルム等の150℃以上の温度に耐え
ると共に高周波特性に優れたフィルムを重ねるようにす
る。ここで、金属箔10としては接着剤を塗布したもの
や、アルミニウムキャリヤーと極薄銅箔との組み合わせ
になっている箔など任意のものを使用することができる
。
このように複数枚のプリプレグ1及び必要に応じて金属
箔10を重ねた積層物5を連続して送りつつ、この積層
物5を予備加熱してプリプレグ1に含まれる樹脂を溶融
状態にした後に、ドラム9によって連続駆動される上下
のエンドレスベルト3.4によって構成されるダブルベ
ルト2に積層物5を連続して導入する。このように予備
加熱をおこなうにあたっては、積層物5を上下の高周波
印加電極8.8開に通して無圧下または接触圧下で誘電
加熱することによっておこなうのが好ましい。誘電加熱
すると加熱温度はプリプレグ1の表面部よりもむしろ内
部で高くなり、電熱などを用いて外部加熱をする場合の
ように表面部が高く加熱されてプリプレグ1の表面部の
樹脂の硬化反応が速(進行することがなく、ダブルベル
ト2で加圧してもプリプレグ1内から気泡が抜けきらな
くなって積層板にボイドが含まれるというようなことを
低減することができるのである。そして積層物5をダブ
ルベルト2に通して上下のエンドレスベルト3.4間で
積層物5を加圧するにあたって、各エンドレスベルト3
,4内には熱盤などの加圧加熱装置11.11が配設し
てあって、この加圧加熱装置11によって積層物5を加
熱加圧できるようにしてあり、プリプレグ1の樹脂を硬
化させると共に複数枚のプリプレグ1及び金属9i10
を積層接着させるものである。加圧は20 kg/ e
ta2〜30 kg/ cm2程度以下の低圧でおこな
われるものであり、場合によっては接触圧でおこなわれ
ることもある。このようにして積層された積層体はダブ
ルベルト2の駆動に伴って連続して導出されるものであ
り、〃イドローラ12に導いて切断機13で切断するこ
とによって、定寸法となった金属箔張りの積層板Aを得
ることができるものである。
上記のようにしてダブルベルト2による連続工法で積層
成形するにあたって、プリプレグ1の基材となる7ツ素
樹脂布は、その素材であるフッ素樹脂が低い誘電率を有
して高周波特性が優れているために、高い高周波特性を
有しているものであり、含浸させる樹脂として高周波特
性が優れたものを使用する必要なく、エポキシ樹脂など
積層板に一般に使用されるものを用いても、高周波特性
の高い積層板Aを製造することができる。従って高い高
周波数特性を有する樹脂を用いる場合のような、高温で
長時間の成形をおこなう必要がなくなり、従来から使用
されているダブルベルト2による連続工法をそのまま用
いて高周波特性の高い積層板Aを製造することが可能に
なるものである。
しかし、ダブルベルト2を用いた連続工法では低圧加圧
(場合によって接触圧程度)で短時間の加熱しかおこな
えないために、熱不足による樹脂の硬化が不十分な場合
があって積層板Aの寸法安定性は多段積層成形で製造し
たものには及ばず、反り等の変形が大きく生じるおそれ
がある。そこで、本発明ではダブルベルト2で連続成形
した後に所定寸法に切断した積層板Aをアフターキュア
ー炉に導入し、アフターキュアーをおこなうと共に、さ
らにこのようにしてアフターキュアーをした積層板Aを
フッターキユアー炉から取り出した直後に急冷するよう
にしている。アフターキュアーをおこなうことによって
積層板Aの樹脂の熱不足を補って積層板Aの寸法安定性
を高めることができ、さらにアフターキュアー後に急冷
することによって積層板Aの樹脂の結晶性を高めて積層
板Aの寸法安定性を一層向上させることができるのであ
る。
フッターキユアーをおこなうにあたって加熱温度は、ダ
ブルベルト2による加熱温度より10〜50℃程度低い
温度に設定するのが好ましく、加熱時間はダブルベルト
2による成形時間と同じ程度が好ましい。また、アフタ
ーキュアー後の急冷は水中(水温は約25℃程度の室温
)に積層板Aを浸漬させることによっておこなうことが
好ましく、60℃以下に冷却されたのちに水中から取り
出すようにするのが好ましい。The method for manufacturing a laminate according to the present invention involves continuously feeding a long prepreg 1 prepared using fluororesin cloth as a base material, and stacking a required number of prepregs 1, 1...
It is characterized in that it is continuously fed into a double belt 2 to be laminated and formed, and after being cut into a predetermined size, it is after-cured and rapidly cooled after footer curing. The present invention will be explained in detail below. The prepreg 1 is prepared as a long prepreg by impregnating a base material with a resin varnish and drying it. In the present invention, a fluororesin (polytetrafluoroethylene) cloth is used as the base material. The fluororesin cloth is made as a woven or non-woven fabric of fluororesin fibers, and for example, a polyurethane cloth commercially available from Daikin Industries, Ltd. can be used. Further, in the present invention, any resin can be used to impregnate the fluororesin cloth, but thermosetting resins such as epoxy resins are particularly preferred. Then, as shown in FIG. 1, this prepreg 1 is unwound from a roll, a predetermined number of sheets are continuously fed through an idle roll 6, and each prepreg 1 is continuously overlapped by a stacking roll 7. . On the other hand, a metal foil 10 such as a copper foil is also formed into a long length and wound into a roll, which is unwound and superimposed on the outer surface of the outermost layer of the above-mentioned superimposed prepregs 1. When manufacturing a double-sided metal foil-clad laminate, two sheets of metal 9i10 are used to overlap the same amount of the outer layer of the stacked prepreg 1, and when manufacturing a single-sided metal foil-clad laminate, one The metal foil 10 is layered only on the outermost layer, and a film such as a 7-layer resin film that can withstand temperatures of 150° C. or more and has excellent high frequency characteristics is layered on the other outermost layer. Here, any metal foil 10 can be used, such as one coated with an adhesive or a combination of an aluminum carrier and an ultra-thin copper foil. While continuously feeding the laminate 5 in which a plurality of prepregs 1 and metal foils 10 are piled up as necessary, the laminate 5 is preheated to melt the resin contained in the prepreg 1, and then , the laminate 5 is successively introduced into a double belt 2 constituted by upper and lower endless belts 3.4 which are continuously driven by a drum 9. Preheating is preferably carried out by dielectrically heating the laminate 5 under no pressure or under contact pressure by passing the laminate 5 through the upper and lower high frequency application electrodes 8.8. When dielectrically heated, the heating temperature is higher inside the prepreg 1 rather than on the surface, and as in the case of external heating using electric heating, the surface is heated to a high temperature and the curing reaction of the resin on the surface of the prepreg 1 is slowed down. It is possible to reduce the occurrence of voids in the laminate due to the air bubbles not being able to escape from the prepreg 1 even when pressurized by the double belt 2. is passed through the double belt 2 to pressurize the laminate 5 between the upper and lower endless belts 3.4.
, 4 is provided with a pressure/heating device 11.11 such as a heating plate, which can heat and press the laminate 5 to harden the resin of the prepreg 1. and a plurality of prepregs 1 and metal 9i10
This is a method for laminating and bonding. Pressure is 20 kg/e
It is carried out at a low pressure of about ta2 to 30 kg/cm2 or less, and in some cases it may be carried out at a contact pressure. The laminated body thus laminated is continuously drawn out as the double belt 2 is driven, and is led to the idle roller 12 and cut by the cutter 13, thereby cutting the metal foil into a fixed size. It is possible to obtain a laminate A with a high tension. In lamination molding using the continuous method using the double belt 2 as described above, the 7-component resin cloth that is the base material of the prepreg 1 has excellent high frequency characteristics because the fluororesin that is the material has a low dielectric constant. Therefore, it has high high frequency characteristics, so there is no need to use a resin with excellent high frequency characteristics as the impregnating resin, and even if you use a resin commonly used for laminates such as epoxy resin, It is possible to manufacture a laminate A with a high Therefore, there is no need for long-time molding at high temperatures, which is required when using resin with high high-frequency characteristics, and the conventional continuous method using double belts 2 can be used as is to produce laminate A with high high-frequency characteristics. This makes it possible to manufacture. However, in the continuous construction method using double belt 2, heating can only be performed for a short time with low pressure (at least contact pressure in some cases), so the curing of the resin may be insufficient due to insufficient heat, and the laminate A The dimensional stability is not as good as that produced by multi-stage lamination molding, and there is a risk of significant deformation such as warping. Therefore, in the present invention, the laminate A that has been continuously formed using the double belt 2 and then cut into a predetermined size is introduced into an after-cure furnace to perform after-curing, and the laminate A that has been after-cured in this way is then used as a footer cure. I try to quickly cool it down immediately after taking it out of the furnace. By performing after-curing, the dimensional stability of laminate A can be increased by compensating for the lack of heat in the resin of laminate A, and furthermore, by rapidly cooling after the after-curing, the crystallinity of the resin of laminate A can be increased and the laminated board can be laminated. The dimensional stability of plate A can be further improved. When performing footer curing, the heating temperature is preferably set to a temperature approximately 10 to 50° C. lower than the heating temperature by the double belt 2, and the heating time is preferably about the same as the forming time by the double belt 2. Further, it is preferable to rapidly cool the laminate A after the after-cure by immersing it in water (at a room temperature of about 25°C), and it is preferable to take it out of the water after it has been cooled to 60°C or less. preferable.
以下本発明を実施例によって具体的に説明する。
K1九
エポキシ当量520のブロム化エポキシ樹脂を520重
量部、ジシアンジアミドを9重量部、2−エチル−4−
メチルイミグゾールを0.5重量部それぞれ配合し、こ
れを溶剤に溶解してエポキシ樹脂ワニスを得た。このワ
ニスの160℃でのゲルタイムは10分であった。そし
て基材として0゜1mm厚のボリプン布(ダイキン工業
株式会社製ポリテトラブルオ・ロエチレン樹脂織布)を
用い、上記エポキシ樹脂ワニスを含浸して乾燥すること
によって、樹脂含量が50重量%、160℃でのデルタ
イムが180秒のプリプレグを得た。
次ぎに、このプリプレグを用いて第1図に示す連続工法
で積層板の製造をおこなった。すなわち、プリプレグ8
枚を重ねると共にその上下に厚さ0゜035amの銅箔
を重ね、発振周波数13.56MHzの高周波誘電加熱
装置を用いて積層物の中央部の温度が120〜125℃
になるように加熱し、プリプレグの樹脂を溶融状態にし
て0.1+o/分の速度で回転しているダブルベルトに
導入し、圧力25 kg/ am2、温度170℃の条
件で20分間ダブルベルトに通すことによって積層成形
をおこない、さらに1+*X1曽の寸法に切断すること
によって両面銅張りの積層板を得た。
次にこのように切断した直後の積層板を150℃のフッ
ターキユアー炉に20分間入れて、アフターキュアーを
おこなった。このようにフッターキユアー炉に入れて2
0分を経過した後、積層板をフッターキユアー炉から取
り出してそのまま25℃の水中に入れて急冷し、積層板
が60℃まで冷却された時点で水中から取り出した。
雌1九り
上記実施例と同様にしてダブルベルトによる連続工法で
両面銅張りの積層板を成形し、これをアフターキュアー
しないで室温下に放置して放冷させて比較例1とした。
K1に先
上記実施例と同様にしてダブルベルトによる連続工法で
両面銅張りの積層板を成形し、これを実施例と同様にし
てアフターキュアーし、アフターキュアー炉から取り出
した積層板を室温下に放置して放冷したものを比較例2
とした。
思米1」−
上記実施例で用いたエポキシ樹脂ワニスを205g/m
2のガラス布に含浸させて乾燥することによって、樹脂
含量が45重量%、160℃でのゲルタイムが180℃
のプリプレグを得た。このプリプレグをlmX1mの定
寸法に切断し、これを8枚重ね合わせると共に上下にさ
らに厚み0.035II11の銅箔を重ね、これを厚さ
1.5mmのステンレスプレートの間に挟むと共に多段
式油圧プレスの熱盤間に挿入し、170℃で25分間加
熱加圧して多段積層成形をおこなうことによって、両面
銅張りの積層板を得た。
上記実施例及び比較例1乃至3の積層板について、JI
S C6481に基づいて誘電率を測定した。また、
寸法安定性を測定するために、各積層板の対角線での最
大反り変形量を計測した。これらの結果を次表に示す。
表の結果にみられるように、プリプレグの基材としてフ
ッ素樹脂布を用いた実施例のものは、基材としてプラス
布を用いた比較例3のものよりも誘電率が低く、高周波
特性に優れることが確認される。また実施例のものはア
フターキュアーをおこなうと共に急冷をおこなうことに
よって、アフターキュアーをおこなわない比較例1のも
のよりも寸法安定性を大幅に高めることができ、ア7タ
ーキエ7−をおこなっても急冷をしない比較例2のもの
より寸法安定性を高めることができることが確認される
。The present invention will be explained in detail below using examples. 520 parts by weight of a brominated epoxy resin with a K19 epoxy equivalent of 520, 9 parts by weight of dicyandiamide, 2-ethyl-4-
0.5 parts by weight of methyl imiguzole was added and dissolved in a solvent to obtain an epoxy resin varnish. The gel time of this varnish at 160°C was 10 minutes. Then, using a 0°1 mm thick polyurethane cloth (polytetrafluoro-roethylene resin woven fabric manufactured by Daikin Industries, Ltd.) as a base material, the resin content was reduced to 50% by weight by impregnating it with the above epoxy resin varnish and drying it. A prepreg with a del time of 180 seconds at 160°C was obtained. Next, using this prepreg, a laminate was manufactured using the continuous construction method shown in FIG. That is, prepreg 8
At the same time, copper foil with a thickness of 0°035 am is placed on top and bottom of the stack, and a high frequency dielectric heating device with an oscillation frequency of 13.56 MHz is used to heat the center of the laminate to 120 to 125°C.
Heat the prepreg resin to a molten state and introduce it into a double belt rotating at a speed of 0.1+o/min. Laminate molding was carried out by passing the material through, and a laminate plate with copper cladding on both sides was obtained by cutting the material into a size of 1+*X1. Next, the laminate immediately after being cut in this manner was placed in a footer cure furnace at 150° C. for 20 minutes to perform after-curing. Put it in the footer cure furnace like this 2
After 0 minutes had elapsed, the laminate was taken out of the footer cure furnace and put into water at 25°C for quenching, and when the laminate had cooled to 60°C, it was taken out of the water. Female 19 A double-sided copper-clad laminate was formed using a continuous method using double belts in the same manner as in the above example, and was left to cool at room temperature without after-curing to obtain Comparative Example 1. For K1, a double-sided copper-clad laminate was formed using a continuous method using a double belt in the same manner as in the above example, and after-cured in the same manner as in the example.The laminate was taken out of the after-cure furnace and left at room temperature. Comparative example 2 is the one that was left to cool.
And so. 1” - 205g/m of the epoxy resin varnish used in the above example
By impregnating the glass cloth in Step 2 and drying it, the resin content was 45% by weight and the gel time at 160°C was 180°C.
prepreg was obtained. This prepreg was cut into regular dimensions of lm x 1m, 8 sheets were stacked together, and copper foil with a thickness of 0.035II11 was layered on top and bottom, and this was sandwiched between stainless steel plates with a thickness of 1.5mm, and a multistage hydraulic press was used. A double-sided copper-clad laminate was obtained by inserting the laminate between hot platens and heating and pressing at 170° C. for 25 minutes to perform multi-stage laminate molding. Regarding the laminates of the above Examples and Comparative Examples 1 to 3, JI
The dielectric constant was measured based on SC6481. Also,
In order to measure dimensional stability, the maximum amount of diagonal warp deformation of each laminate was measured. These results are shown in the table below. As seen in the results in the table, the prepreg of Example using fluororesin cloth as the base material has a lower dielectric constant and superior high frequency characteristics than Comparative Example 3 that uses plus cloth as the base material. This is confirmed. In addition, by performing after-curing and rapid cooling, the dimensional stability of the example was significantly improved compared to that of Comparative Example 1, which was not subjected to after-curing. It is confirmed that the dimensional stability can be improved compared to that of Comparative Example 2 which does not contain the above.
上述のように本発明にあっては、フッ素樹脂布を基材と
して調製した長尺のプリプレグを連続的に送りつつ所要
枚数のこのプリプレグを重ね合わせ、これをダブルベル
トに連続して送り込んで積層成形するようにしたので、
プリプレグの基材となるフッ素樹脂布は低い誘電率を有
して高周波特性が優れており、含浸させる樹脂として高
周波特性が優れたものを使用する必要なくエポキシ樹脂
など積層板に一般に使用されるものを用いても、高周波
特性の高い積層板を製造することができるものであり、
高温で長時間の成形をおこなう必要な(従来から使用さ
れている連続工法をそのまま用いて高周波特性の高い積
層板を製造することができるものである。しかも積層成
形して所定寸法に切断した後にフッターキエアーすると
共にフッターキユアー後に急冷するようにしたので、ア
フターキュアーで積層板内の樹脂の熱不足を補うと共に
急冷で積層板内の樹脂の結晶化を高めることができ、積
層板の寸法安定性を高めることができるものである。As described above, in the present invention, a long prepreg prepared using fluororesin cloth as a base material is continuously fed, a required number of prepregs are stacked, and the sheets are continuously fed to a double belt to be laminated. I decided to mold it, so
Fluororesin cloth, which is the base material for prepreg, has a low dielectric constant and excellent high-frequency properties, so there is no need to use a resin with excellent high-frequency properties as the impregnating resin, which is commonly used for laminates such as epoxy resin. It is possible to manufacture a laminate with high high frequency characteristics even by using
It is possible to manufacture laminates with high high frequency characteristics using the conventional continuous method that requires long-term forming at high temperatures.Moreover, after forming the laminate and cutting it to the specified size, Since the footer is cured and rapidly cooled after the footer cure, the after-cure compensates for the lack of heat in the resin in the laminate, and the rapid cooling increases the crystallization of the resin in the laminate, which improves the dimensions of the laminate. This can improve stability.
第1図は本発明に用いる装置の概略図であり、1はプリ
プレグ、2はダブルベルト、Aは積層板である。FIG. 1 is a schematic diagram of the apparatus used in the present invention, in which 1 is a prepreg, 2 is a double belt, and A is a laminate.
Claims (1)
レグを連続的に送りつつ所要枚数のこのプリプレグを重
ね合わせ、これをダブルベルトに連続して送り込んで積
層成形し、所定寸法に切断した後にアフターキュアーす
ると共にアフターキュアー後に急冷することを特徴とす
る積層板の製造方法。(1) A long prepreg prepared using fluororesin cloth as a base material was continuously fed, the required number of prepregs were stacked together, and this was continuously fed to a double belt to form a laminate, and then cut into a predetermined size. A method for manufacturing a laminate, which is characterized by performing after-curing and rapidly cooling after the after-curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250122A JPH03110159A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250122A JPH03110159A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110159A true JPH03110159A (en) | 1991-05-10 |
Family
ID=17203152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1250122A Pending JPH03110159A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110159A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019084781A (en) * | 2017-11-09 | 2019-06-06 | トヨタ自動車株式会社 | Method for joining fiber reinforced thermoplastic resin member and apparatus for joining fiber reinforced thermoplastic resin member |
-
1989
- 1989-09-26 JP JP1250122A patent/JPH03110159A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019084781A (en) * | 2017-11-09 | 2019-06-06 | トヨタ自動車株式会社 | Method for joining fiber reinforced thermoplastic resin member and apparatus for joining fiber reinforced thermoplastic resin member |
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