JPH03110198A - Ic module for ic card - Google Patents
Ic module for ic cardInfo
- Publication number
- JPH03110198A JPH03110198A JP1247681A JP24768189A JPH03110198A JP H03110198 A JPH03110198 A JP H03110198A JP 1247681 A JP1247681 A JP 1247681A JP 24768189 A JP24768189 A JP 24768189A JP H03110198 A JPH03110198 A JP H03110198A
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- holes
- insulating substrate
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 41
- 238000007789 sealing Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 abstract description 2
- 229920003002 synthetic resin Polymers 0.000 description 20
- 239000000057 synthetic resin Substances 0.000 description 20
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野１
本発明はＩＣカードに内蔵されるＩＣモジュールに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to an IC module built into an IC card.
［従来の技術］
今日、マイクロコンピュータやメモリ等のＩＣチップを
内蔵したＩＣカードが実用化されつつあり、このＩＣカ
ードは従来の磁気ストライプカードに比較して記憶容量
が大きいことから種々の用途への利用が考えられている
。[Prior Art] Today, IC cards with built-in IC chips such as microcomputers and memory are being put into practical use.Since these IC cards have a larger storage capacity than conventional magnetic stripe cards, they are used for various purposes. is being considered for use.
このＩＣカードには、第１０図に示す様に絶縁基板３１
の上にＩＣチップ２１を実装し、該ＩＣチップ２１と絶
縁基板３１の下面に設けた電極板２５とを接続する金属
細線２３及び前記ＩＣチップ２１を覆う様に、トランス
ファーモールド加工により合成樹脂をもってＩＣチップ
２１等を封止し、以てＩＣチップ２１等を封止する封止
樹脂３８を成形することにより、ＩＣチップ２１等の絶
縁基板３１への固定を強化すると共に防湿等の効果を与
える様にしたＩＣモジュール２０が用いられることが多
く、第１１図に示す様に、前記ＩＣモジュール２０の大
きさと略等しい大きさの貫通孔１５を設けた塩化ビニー
ル等のＩＣカード基体１１を別途製造し、該ＩＣカード
基体１１の貫通孔１５に前記ＩＣモジュール２０を挿入
し、第１２図に示す様に、ＩＣモジュール２０の周囲に
エポキシ樹脂やシリコン樹脂等の緩衝剤１９を充填し、
以てＩＣモジュール２０をＩＣカード基体１１に固定し
た後、ＩＣカード基体１１の上下両面に約０．１■程度
の厚みを有するオーバーシー）１７を融着させ、下面の
オーバーシー）１７には透孔１８を設けておくことによ
りＩＣモジュール２０の下面に設けた電極板２５をＩＣ
カードｌＯの下面に露出させる様にしたものが多い。This IC card includes an insulating substrate 31 as shown in FIG.
An IC chip 21 is mounted on the top, and a synthetic resin is applied by transfer molding so as to cover the thin metal wire 23 connecting the IC chip 21 and the electrode plate 25 provided on the lower surface of the insulating substrate 31 and the IC chip 21. By sealing the IC chip 21 etc. and molding the sealing resin 38 that seals the IC chip 21 etc., the fixation of the IC chip 21 etc. to the insulating substrate 31 is strengthened and effects such as moisture proofing are provided. In many cases, an IC module 20 having a similar shape is used, and as shown in FIG. Then, the IC module 20 is inserted into the through hole 15 of the IC card base 11, and as shown in FIG. 12, a buffering agent 19 such as epoxy resin or silicone resin is filled around the IC module 20.
After fixing the IC module 20 to the IC card base 11, an oversea) 17 having a thickness of about 0.1 cm is fused to both the upper and lower surfaces of the IC card base 11, and the oversea) 17 on the lower surface is fused. By providing the through hole 18, the electrode plate 25 provided on the bottom surface of the IC module 20 can be connected to the IC.
Many of them are exposed on the bottom surface of the card IO.
尚、ＩＣカード基体１１は一枚で構成する場合のみでな
く、複数のカード基体用薄板を積層する場合も有る。Note that the IC card base 11 may not only be composed of a single sheet, but also a plurality of card base thin plates stacked together.
又、他の構造のＩＣカードｌＯとしては、ＩＣカード形
状をした空間を有する治具内にＩＣモジュール２０を載
置し、該空間に合成樹脂を注入した後、該合成樹脂に紫
外線を照射して該樹脂を硬化させるか、又は注入した合
成樹脂を加熱することにより該樹脂を硬化させてＩＣモ
ジュール２０とＩＣカード基体１１とを一体としたＩＣ
カード１０（例えば特開昭８０−２１７４９１号）が有
る。In addition, as an IC card IO having another structure, the IC module 20 is placed in a jig having an IC card-shaped space, a synthetic resin is injected into the space, and the synthetic resin is irradiated with ultraviolet rays. The IC module 20 and the IC card base 11 are integrated by curing the resin by heating the injected synthetic resin or by curing the resin by heating the injected synthetic resin.
There is a card 10 (for example, Japanese Patent Application Laid-Open No. 80-217491).
ところでＩＣカード１０は、その厚さが０．７８ｍｍと
薄く、従ってＩＣカードｌＯに内蔵されるＩＣモジュー
ル２Ｇは、その厚さが通常０．５ｍｍ前後とされ、−辺
がｌｃ嘗余りの薄肉平板状とされており、このＩＣカー
ド１０は機械的な折り曲げ力に耐えることが要求され、
外力が繰り返し加えられてもＩＣモジュール２０がＩＣ
カード基体１１から脱落しない様にしなければならない
。By the way, the IC card 10 has a thin thickness of 0.78 mm, so the IC module 2G built into the IC card 10 is usually a thin flat plate with a thickness of about 0.5 mm and a side of about 1 cm. This IC card 10 is required to withstand mechanical bending force.
Even if external force is repeatedly applied, the IC module 20 remains intact.
It must be ensured that it does not fall off from the card base 11.
従って材質の異なるＩＣモジュール２０とＩＣカード基
体１１との接合に際し、第１３図に示す様に、ＩＣモジ
ュール２０の外縁に段差を設ける様に封止樹脂３８の周
縁から水平に延出部３９を形成し、且つ、カード基体用
薄板１３を積層することにより積層構造のＩＣカード基
体１１とすることとし、以て封止樹脂３８の側面に設け
たＩＣモジュール２０の延出部３８を、ＩＣカード基体
１１を構成するカード基体用薄板１３とオーバーシー）
１７との間や、又はカード基体用薄板１３の相互間に挾
持する様にしてカード基体用薄板１３の貫通孔にＩＣモ
ジュール２０を挿入固定し、然る後、ＩＣカードｌＯの
大きさを該接層体から打ち抜くことによりＩＣカード１
０とし、以てＩＣモジュール２０とＩＣカード基体１１
と′の接合面積を増加させ、オーバーシート１７とＩＣ
モジュール２０上面とを接着剤層ｌＢにより接着するの
みでなく、ＩＣモジュール２０の周縁においてもＩＣカ
ード基体１１との接合力強化を図るもの（例えば実開昭
８１−１３５１７３号）がある。Therefore, when joining the IC module 20 and the IC card base 11, which are made of different materials, as shown in FIG. The IC card base 11 has a laminated structure by forming and laminating the thin plates 13 for card base. card base thin plate 13 and oversea that constitute the base 11)
The IC module 20 is inserted and fixed into the through hole of the card base thin plate 13 by being sandwiched between the card base thin plate 13 and the card base thin plate 17, and then the size of the IC card IO is adjusted to the appropriate size. IC card 1 is punched out from the contact layer.
0, which means that the IC module 20 and the IC card base 11
By increasing the bonding area between and ', oversheet 17 and IC
There is a device that not only bonds the upper surface of the module 20 with the adhesive layer IB, but also strengthens the bonding force with the IC card base 11 at the periphery of the IC module 20 (for example, Japanese Utility Model Application No. 81-135173).
更に、ＩＣモジュール２０とＩＣカード基体１１どの接
合力強化を図る他の構造としては、第１４図に示す様に
、電極を形成する為の金属板２７に凹凸を設け、以て該
金属板の一部をＩＣモジュール２０の下面に露出させて
電極板２５とし、且つ、ＩＣモジュール２０の側方にお
いて封止樹脂３８の周縁側方から外部に突出する延出端
部２８を形成しておき、該延出端部２８を多層としたＩ
Ｃカード基体１１の間に、又はＩＣカード基体１１とオ
ーバーシート１７との間に挾み込む様にしてＩＣモジュ
ール２０をＩＣカード基体１１に強固に固定するもの（
例えば特開昭８０−１５７８８号）が有る。Furthermore, as another structure for strengthening the bonding force between the IC module 20 and the IC card base 11, as shown in FIG. A portion is exposed on the lower surface of the IC module 20 to serve as the electrode plate 25, and an extending end portion 28 is formed on the side of the IC module 20 to protrude to the outside from the side of the peripheral edge of the sealing resin 38, I that the extending end portion 28 is multi-layered
A device that firmly fixes the IC module 20 to the IC card base 11 by being inserted between the C card base 11 or between the IC card base 11 and the oversheet 17 (
For example, there is Japanese Patent Application Laid-open No. 80-15788).
［発明が解決しようとする課題］
前述の様にＩＣカードはその厚さが０．７８ｍｍと薄く
、ＩＣモジュールの厚さは通常（１，５ｍｍ前後と制限
され、この様な薄い厚さに制限されたＩＣモジュールの
周縁部に段差を形成することは′困難な場合が多く、生
産性の向上が図れない欠点が有った。[Problem to be solved by the invention] As mentioned above, the IC card is thin at 0.78 mm, and the thickness of the IC module is usually limited to around 1.5 mm; It is often difficult to form a step at the periphery of the IC module, which has the disadvantage that productivity cannot be improved.
更に、ＩＣモジュールにおける封止樹脂の側方から金属
板を延出させて延出端部を形成するものにおいても、０
．数−１前後に制限された範囲で金属板に凹凸形状を施
す為、金属板の加工が困難であり、加工に手数を要する
欠点が有った。Furthermore, in an IC module in which a metal plate is extended from the side of the sealing resin to form an extended end, 0
．． Since the uneven shape is formed on the metal plate within a limited range of about -1, it is difficult to process the metal plate, and the process requires a lot of effort.
又、多層構造としたＩＣカード基体の相互の間やＩＣカ
ード基体とオーバーシートとの間に封止樹脂の延出部や
金属板の延出端部を挾み込むＩＣカードは、８１層作業
に手数を要し、生産性の向上を図り難い欠点が有った。In addition, IC cards that have a multilayer structure in which the extending portions of the sealing resin or the extending ends of the metal plates are sandwiched between the IC card substrates or between the IC card substrate and the oversheet require 81 layer work. The drawback was that it was time-consuming and difficult to improve productivity.
［課題を解決するための手段］
本発明は、絶縁基板上に実装されるＩＣチップが封止樹
脂によりモールドされているＩＣモジュールにおいて、
該ＩＣモジュールの上面からＩＣモジュールの下面に貫
通してＩＣモジュールの上下両面に開口する微小透孔を
複数個設け、この微小透孔が電極板を貫通する位置に形
成されるときは、電極板の部分における透孔の直径を絶
縁基板の部分における透孔の直径よりも僅かに大きくす
る。[Means for Solving the Problems] The present invention provides an IC module in which an IC chip mounted on an insulating substrate is molded with a sealing resin.
A plurality of microscopic holes are provided that penetrate from the top surface of the IC module to the bottom surface of the IC module and open on both upper and lower surfaces of the IC module, and when these microscopic holes are formed at positions that penetrate the electrode plate, the electrode plate The diameter of the hole in the portion of the insulating substrate is made slightly larger than the diameter of the hole in the portion of the insulating substrate.
又、微小透孔を電極板が形成されない箇所に設ける様に
してＩＣモジュールの上面から下面に貫通させて該微小
透孔をＩＣモジュールの上面及び下面に開口させること
も有る。Alternatively, minute through holes may be provided in locations where no electrode plate is formed, penetrating from the upper surface to the lower surface of the IC module, and the minute through holes may be opened at the upper and lower surfaces of the IC module.
［作用］
本発明に係るＩＣカード用ＩＣモジュールは、上面から
下面に貫通する微小透孔を設けている故、該ＩＣモジュ
ールを金型内に固定して溶融状態の合成樹脂を射出して
ＩＣカード基体を形成すれば、ＩＣカード基体となる溶
融樹脂の一部がＩＣモジュールに設けた微小透孔内に圧
入充填されることになる。[Function] Since the IC module for an IC card according to the present invention has minute through holes penetrating from the upper surface to the lower surface, the IC module is fixed in a mold and molten synthetic resin is injected to form the IC. Once the card base is formed, a portion of the molten resin that will become the IC card base is press-fitted into the microscopic holes provided in the IC module.
そして、微小透孔が電極板に形成される位置でその直径
を大きくしているときは、微小透孔に圧入充填される合
成樹脂の形状としては、電極板位置の高さである先端の
直径が円筒部分となる絶縁基板位置の高さの部分よりも
大きくなり、又、ＩＣモジュールの下面に電極板が形成
されない箇所に微小透孔を設けるときは、電極板相互間
等、電極板の厚さにより形成される間隙へ微小透孔に圧
入される合成樹脂の一部が押し出されることとなる。When the diameter of the micro-hole is increased at the position where the micro-hole is formed in the electrode plate, the shape of the synthetic resin that is press-fitted into the micro-hole is the diameter of the tip that is at the height of the electrode plate. is larger than the height of the insulating substrate that becomes the cylindrical part, and when providing minute through holes in areas where no electrode plate is formed on the bottom surface of the IC module, the thickness of the electrode plate may be increased, such as between the electrode plates. A portion of the synthetic resin that is press-fitted into the minute through-hole is forced out into the gap formed by this.
［実施例］
本発明に係るＩＣカード用ＩＣモジュールの第１実施例
は、第１図に示す様に、 ０．１ ａｍ前後の厚さを有
する絶縁基板３１の上にＩＣチップ２１を実装し、０．
０６６腸■後の厚さの銅板等により形成される電極板２
５とＩＣチップ２Ｉの端子とをスルーホール３７を通る
金属細線２３で接続し、この金属細線２３及び前記ＩＣ
チップ２１を封止樹脂３８によりモールドして全体の厚
みを約０．５■麿前後としたＩＣモジュール２０であり
、このＩＣモジュール２０における絶縁基板３１の周縁
部３３近くにおいて、第１図及び第２図に示す如く、Ｉ
Ｃモジュール２０の上面から下面に貫通する様に絶縁基
板３１及び電極板２５に同軸とした微小透孔３５を設け
るものであって、この微小透孔３５は、絶縁基板３１に
設ける透孔の直径を約０．５ｍｗ＋としてＩＣモジュー
ル２０の上面に開口させ、電極板２５に設ける透孔の直
径を約０．８腸■としてＩＣモジュール２０の下面に開
口させつつ電極板２５の部分における微小透孔３５の直
径を絶縁基板３１の部分における微小透孔３５の直径よ
りも僅かに大きく形成する。[Example] In a first example of the IC module for an IC card according to the present invention, as shown in FIG. 1, an IC chip 21 is mounted on an insulating substrate 31 having a thickness of about 0.1 am. ,0.
Electrode plate 2 formed of a copper plate or the like with a thickness of 066 mm
5 and the terminal of the IC chip 2I are connected by a thin metal wire 23 passing through a through hole 37, and this thin metal wire 23 and the terminal of the IC chip 2I are
This is an IC module 20 in which a chip 21 is molded with a sealing resin 38 to have a total thickness of approximately 0.5 mm. As shown in Figure 2, I
A coaxial minute through hole 35 is provided in the insulating substrate 31 and the electrode plate 25 so as to penetrate from the upper surface to the lower surface of the C module 20, and this minute through hole 35 has a diameter that is equal to the diameter of the through hole provided in the insulating substrate 31. The diameter of the through hole provided in the electrode plate 25 is set to approximately 0.5 mw+ and is opened at the upper surface of the IC module 20, and the diameter of the through hole provided in the electrode plate 25 is set to approximately 0.8 mw+ and is opened at the lower surface of the IC module 20. The diameter of the hole 35 is formed to be slightly larger than the diameter of the minute through hole 35 in the insulating substrate 31 portion.
この様に絶縁基板３１と電極板２５とを貫通してＩＣモ
ジュール２０の上面から下面に至る微小透孔３５を形成
したＩＣモジュール２０を、第６図に示す様に金型４０
のキャビティ４３内に載置し、吸引口４７により吸引を
施して下金型４５上の所定位置に固定し、上金型４１と
下金型４５とにより形成されるＩＣカードの形状とした
キャビティ４３へ溶融状態の合成樹脂を射出すれば、第
７図に示す様に、ＩＣカード基体１１となる合成樹脂の
中にＩＣモジュール２０が埋め込まれたＩＣカード１０
を射出成形により量産することができる。尚、ＩＣカー
ドｌＯとしては、ＩＣカード基体１１の上面に適宜オー
バーシート１７を添着することも有る。As shown in FIG.
The IC card-shaped cavity formed by the upper mold 41 and the lower mold 45 is fixed in a predetermined position on the lower mold 45 by applying suction through the suction port 47. 43, the IC card 10 with the IC module 20 embedded in the synthetic resin that becomes the IC card base 11 is created as shown in FIG.
can be mass-produced by injection molding. Incidentally, as the IC card 10, an oversheet 17 may be attached to the top surface of the IC card base 11 as appropriate.
そしてこのＩＣＣモジ−ル２０は、前述の様に絶縁基板
３１の周縁部３３にＩＣモジュール２０の上面から下面
に貫通して上面及び下面に開口する微小透孔３５を形成
している故、射出成形に際して、ＩＣカード基体１１と
なる溶融状態の合成樹脂が微小透孔３５内にも圧入充填
され、該微小透孔３５は絶縁基板３１の部分における直
径よりも電極板２５の部分における直径が僅かに大きく
形成されている故、該微小透孔３５に充填される合成樹
脂は第７図に示す様にその先端１２となる電極板２５の
高さ位置において直径を太くし、この微小透孔３５に充
填される合成樹脂はＩＣカード基体１１と一体である故
、該ＩＣモジュール２０はＩＣカード基体１１から脱落
することを確実に防止され、ＩＣカード基体１１へ強固
に接着埋設されることになる。As described above, this ICC module 20 has a micro through hole 35 formed in the peripheral edge 33 of the insulating substrate 31 that penetrates from the upper surface to the lower surface of the IC module 20 and opens to the upper and lower surfaces. During molding, the molten synthetic resin that will become the IC card base 11 is also press-filled into the minute through-holes 35, and the minute through-holes 35 have a diameter slightly smaller at the electrode plate 25 than at the insulating substrate 31. Therefore, the diameter of the synthetic resin filled in the minute through hole 35 is increased at the height of the electrode plate 25, which is the tip 12, as shown in FIG. Since the synthetic resin filled in is integral with the IC card base 11, the IC module 20 is reliably prevented from falling off from the IC card base 11, and is firmly adhesively embedded in the IC card base 11. .
尚、本実施例におけるＩＣモジュール２０は、ＩＣモジ
ュール２０の上面から下面に貫通する微小透孔３５を形
成している故、該微小透孔３５に圧入充填される合成樹
脂が電極板２５の下面に露出するも、該微小透孔３５を
ＩＣモジュール２０の周縁となる絶縁基板３１の周縁部
３３に形成しておけば、ＩＣカード用リーダーライター
等と電極板２５との接触を妨げることはない。Furthermore, since the IC module 20 in this embodiment has a minute through hole 35 that penetrates from the top surface to the bottom surface of the IC module 20, the synthetic resin that is press-fitted into the minute hole 35 is applied to the bottom surface of the electrode plate 25. However, if the minute through holes 35 are formed in the peripheral edge 33 of the insulating substrate 31 that forms the peripheral edge of the IC module 20, contact between the IC card reader/writer, etc. and the electrode plate 25 will not be hindered. .
又、他の実施例は、微小透孔３５をＩＣモジュール２０
の周縁部に設ける場合に限ることなく、第３図に示す様
に、電極板２５とリーダーライター等との接触を妨げな
い範囲で封止樹脂３８と絶縁基板３１と電極板２５とを
貫通する微小透孔３５をも設けるものであり、この封止
樹脂３８から電極板２５迄を貫通してＩＣモジュール２
０の上面から下面に至る様に形成した微小透孔３５も、
電極板２５の部分における直径を絶縁基板３１の部分に
おける直径よりも太きくすることにより微小透孔３５に
充填される合成樹脂の先端１２部分の直径を太くし、Ｉ
Ｃモジュール２０とＩＣカード基体１１との接合を確実
強固とすることができる。尚、封止樹脂３８に形成する
微小透孔３５の直径は、絶縁基板３１に形成する微小透
孔３５の直径と同一でも良く、又、該微小透孔３５への
溶融樹脂の圧入充填を容易とする為に、第９図に示す様
に絶縁基板３１に形成する部分の直径よりも封止樹脂３
８に形成する部分の直径を大きく形成しておくことも有
る。Further, in another embodiment, the minute through hole 35 is connected to the IC module 20.
As shown in FIG. 3, the sealing resin 38, the insulating substrate 31, and the electrode plate 25 are penetrated to the extent that it does not interfere with the contact between the electrode plate 25 and the reader/writer, etc. A minute through hole 35 is also provided, and the IC module 2 is passed through from the sealing resin 38 to the electrode plate 25.
The minute through holes 35 formed from the top surface to the bottom surface of the
By making the diameter of the electrode plate 25 larger than the diameter of the insulating substrate 31, the diameter of the tip 12 of the synthetic resin filled in the minute through hole 35 is increased, and the I
The bond between the C module 20 and the IC card base 11 can be reliably strengthened. The diameter of the micro-holes 35 formed in the sealing resin 38 may be the same as the diameter of the micro-holes 35 formed in the insulating substrate 31, and the molten resin can be easily press-filled into the micro-holes 35. In order to do this, as shown in FIG.
The diameter of the portion formed at 8 may be made larger.
又、上記実施例は、少なくとも絶縁基板３１と電極板２
５とを貫通してＩＣモジュール２０の上面から下面に貫
通する微小透孔３５を形成しているも、更に他の実施例
としては、第５図に示す様に、電極板２５の位置を外し
て絶縁基板３１を貫通する様にＩＣモジュール２０の上
面から下面に至る微小透孔３５を形成する場合が有る。Further, in the above embodiment, at least the insulating substrate 31 and the electrode plate 2
5 is formed to penetrate from the upper surface to the lower surface of the IC module 20. In yet another embodiment, as shown in FIG. 5, the position of the electrode plate 25 is removed. In some cases, a minute through hole 35 is formed from the top surface to the bottom surface of the IC module 20 so as to penetrate through the insulating substrate 31.
この実施例においても、該ＩＣモジュール２０を金型４
０のキャビティ４３内に載置固定すれば、電極板２５の
厚みにより絶縁基板３１の下面と下金型４５上面との間
に僅かな間隙が形成され、キャビティ４３内に溶融状態
の合成樹脂を射出すれば、溶融樹脂は微小透孔３５へ圧
入充填されると共にその一部が絶縁基板３１の下面と下
金型４５上面との間隙に押し出され、第８図に示す様に
、微小透孔３５に充填された合成樹脂の先端１２部分は
微小透孔３５を通り抜けてその直径を大きくし、該ＩＣ
モジュール２０とＩＣカード基体１１との接合を強固と
する。又、電極板２５を外して設ける微小透孔３５の位
置を絶縁基板３１の周縁部３３直近に形成する場合は、
第９図に示す様に、絶縁基板３１の周縁から電極板２５
相互の間隙に喰い込む合成樹脂と微小透孔３５を通って
電極板２５の間隙に押し出される合成樹脂とが接続され
、該ＩＣモジュール２０を一層強固にＩＣカード基体１
１に接合することができる。In this embodiment as well, the IC module 20 is placed in the mold 4.
0, a slight gap is formed between the lower surface of the insulating substrate 31 and the upper surface of the lower mold 45 due to the thickness of the electrode plate 25, and the molten synthetic resin is poured into the cavity 43. When injected, the molten resin is press-fitted into the minute through-holes 35 and a part of it is pushed out into the gap between the bottom surface of the insulating substrate 31 and the top surface of the lower mold 45, and as shown in FIG. The tip 12 of the synthetic resin filled in the IC passes through the minute hole 35 and increases its diameter.
To strengthen the bond between the module 20 and the IC card base 11. Moreover, when the position of the minute through-hole 35 provided by removing the electrode plate 25 is formed in the vicinity of the peripheral edge 33 of the insulating substrate 31,
As shown in FIG. 9, from the periphery of the insulating substrate 31 to the electrode plate 25
The synthetic resin that bites into the mutual gap and the synthetic resin that is pushed out into the gap between the electrode plates 25 through the minute holes 35 are connected, and the IC module 20 is further strengthened to the IC card base 1.
1 can be joined.
そして、この様なＩＣモジュール２０は、スルーホール
３７の形成に併せて絶縁基板３１に微小透孔３５を形成
し、絶縁基板３１の下面に接着した銅板等をエツチング
処理により分断して各電極板２５を形成するに際して電
極板２５に微小透孔３５を形成し、又は絶縁基板３１に
形成した微小透孔３５をＩＣモジュール２０の下面に開
口させ得る故、ＩＣモジュール２０の上面から下面に貫
通する微小透孔３５の形成が極めて容易である。In addition to forming the through holes 37, the IC module 20 is manufactured by forming minute holes 35 in the insulating substrate 31, and dividing the copper plate or the like bonded to the lower surface of the insulating substrate 31 by etching to form each electrode plate. When forming the IC module 25, the micro through holes 35 are formed in the electrode plate 25, or the micro through holes 35 formed in the insulating substrate 31 can be opened at the bottom surface of the IC module 20. Formation of the minute through holes 35 is extremely easy.
［発明の効果］
本発明に係るＩＣモジュールは、ＩＣモジュールの上面
から下面に貫通開口する微小透孔を設けたものであり、
該微小透孔が少なくとも絶縁基板と電極板とを貫通する
場合は電極板に形−成する微小透孔の直径を大きくする
様にし、又は電極板を形成しない箇所に微小透孔を設け
て絶縁基板に設ける微小透孔の一下端をＩＣモジュール
の下面に開口させるものであって、ＩＣモジュールに垂
直方向の微小透孔を設けるのみである故、製造が極めて
容易であり、該ＩＣモジュールを用いてＩＣモジュール
を覆う様にＩＣモジュールの周囲に溶融樹脂を射出して
ＩＣカード基体を形成すれば、該ＩＣモジュールに形成
した微小透孔にＩＣカード基体を形成する合成樹脂が充
填され、且つ、充填された合成樹脂における先端部分の
直径が僅かに大きく形成され、ＩＣモジュールとＩＣカ
ード基体とを容易且つ強固に接着することができる。[Effects of the Invention] The IC module according to the present invention is provided with a minute through hole that opens from the top surface to the bottom surface of the IC module,
If the micro-holes penetrate at least the insulating substrate and the electrode plate, the diameter of the micro-holes formed in the electrode plate should be increased, or the micro-holes should be provided in areas where the electrode plates are not formed to provide insulation. The lower end of the micro-hole provided in the substrate is opened on the bottom surface of the IC module, and since the IC module is only provided with a micro-hole in the vertical direction, it is extremely easy to manufacture. If a molten resin is injected around the IC module so as to cover the IC module to form an IC card base, the minute holes formed in the IC module are filled with the synthetic resin forming the IC card base, and The tip portion of the filled synthetic resin is formed to have a slightly larger diameter, so that the IC module and the IC card base can be easily and firmly bonded to each other.
従って本発明に係るＩＣモジュールは、ＩＣカードから
脱落する虞れの極めて少ないＩＣモジュールとして容易
に量産し得るものである。Therefore, the IC module according to the present invention can be easily mass-produced as an IC module with extremely low risk of falling off from an IC card.
第１図は本発明に係るＩＣモジュールの第１実施例を示
す垂直断面図にして、第２図は該実施例におけるＩＣモ
ジュールの下面図、第３図及び第４図は他の実施例を示
すＩＣモジュールの上面図及び垂直断面図であり、第５
図は更に別の実施例を示す下面図、第６図はＩＣカード
の製造方法を示す図にして、第７図は第１図に示したＩ
Ｃモジュールを用いたＩＣカードの要部断面図、第８図
は第５図に示したＩＣモジュールを用いたＩＣカードの
要部断面図、第９図は他のＩＣモジュールを用いたＩＣ
カードの要部を示す下面図であり、第１θ図は従来のＩ
Ｃモジュールを示す図、第１１図は従来のＩＣカード基
体の一例を示す因、第１２図は従来のＩＣカードにおけ
る部分断面図、第１３図及び第１４図は従来のＩＣカー
ドにおける要部断面図である。
１０＝ Ｉ Ｃカード、 １１＝ Ｉ Ｃカード基
体、１７＝オーバーシート、 ２０＝ Ｉ Ｃモジュ
ール、 ２１＝ Ｉ Ｃチップ、 ２３＝金属細線
、２５＝電極板、 ３１＝絶縁基板、 ３５＝微小
透孔、 ３８＝封止樹脂、 ４０＝金型。FIG. 1 is a vertical sectional view showing a first embodiment of an IC module according to the present invention, FIG. 2 is a bottom view of the IC module in this embodiment, and FIGS. 3 and 4 show other embodiments. FIG. 5 is a top view and a vertical cross-sectional view of the IC module shown in FIG.
The figure is a bottom view showing still another embodiment, FIG. 6 is a diagram showing a method of manufacturing an IC card, and FIG. 7 is a diagram showing the IC card manufacturing method shown in FIG.
Figure 8 is a cross-sectional view of the main parts of an IC card using the IC module shown in Figure 5. Figure 9 is a cross-sectional view of the main parts of an IC card using the IC module shown in Figure 5.
FIG. 1 is a bottom view showing the main parts of the card, and FIG.
Figure 11 shows an example of a conventional IC card substrate; Figure 12 is a partial cross-sectional view of a conventional IC card; Figures 13 and 14 are cross-sections of essential parts of a conventional IC card. It is a diagram. 10=IC card, 11=IC card base, 17=oversheet, 20=IC module, 21=IC chip, 23=thin metal wire, 25=electrode plate, 31=insulating substrate, 35=micro hole , 38=sealing resin, 40=mold.
Claims (2)
面の電極板とを接続する金属細線及び前記絶縁基板上の
ＩＣチップを封止樹脂によりモールドしたＩＣモジュー
ルにおいて、少なくとも絶縁基板と電極板とを貫通して
該ＩＣモジュールの上面及び下面に開口する微小透孔を
複数個設け、該微小透孔の直径は、絶縁基板部分の直径
よりも電極板部分の直径を僅かに大きくしたことを特徴
とするＩＣカード用ＩＣモジュール。(1) In an IC module in which a thin metal wire connects an IC chip mounted on an insulating substrate and an electrode plate on the lower surface of the insulating substrate, and an IC chip on the insulating substrate is molded with a sealing resin, at least the insulating substrate and the electrode plate are molded. A plurality of microscopic holes are provided that penetrate through the IC module and open on the upper and lower surfaces of the IC module, and the diameter of the microscopic holes is made so that the diameter of the electrode plate portion is slightly larger than the diameter of the insulating substrate portion. Features of IC module for IC cards.
面の電極板とを接続する金属細線及び前記絶縁基板上の
ＩＣチップを封止樹脂によりモールドしたＩＣモジュー
ルにおいて、絶縁基板の下面に電極板を形成しない箇所
に、ＩＣモジュールの上面から下面に貫通開口する微小
透孔を複数個設けたことを特徴とするＩＣカード用ＩＣ
モジュール。(2) In an IC module in which a thin metal wire connects an IC chip mounted on an insulating substrate and an electrode plate on the lower surface of the insulating substrate, and an IC chip on the insulating substrate is molded with a sealing resin, an electrode is placed on the lower surface of the insulating substrate. An IC for an IC card, characterized in that a plurality of minute through-holes that penetrate from the top surface to the bottom surface of the IC module are provided in locations where no plate is formed.
module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1247681A JPH03110198A (en) | 1989-09-22 | 1989-09-22 | Ic module for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1247681A JPH03110198A (en) | 1989-09-22 | 1989-09-22 | Ic module for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110198A true JPH03110198A (en) | 1991-05-10 |
Family
ID=17167070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1247681A Pending JPH03110198A (en) | 1989-09-22 | 1989-09-22 | Ic module for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110198A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005313656A (en) * | 2005-07-22 | 2005-11-10 | Kokusai Koryu Kaihatsu Kenkyu Center:Kk | Life calendar |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61500237A (en) * | 1983-10-24 | 1986-02-06 | ゲ−ア−オ− ゲゼルシヤフト フユ−ル アウトマチオン ウント オルガニザチオン エム ベ− ハ− | Data carrier having integrated circuit and manufacturing method thereof |
| JPS61222714A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
-
1989
- 1989-09-22 JP JP1247681A patent/JPH03110198A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61500237A (en) * | 1983-10-24 | 1986-02-06 | ゲ−ア−オ− ゲゼルシヤフト フユ−ル アウトマチオン ウント オルガニザチオン エム ベ− ハ− | Data carrier having integrated circuit and manufacturing method thereof |
| JPS61222714A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005313656A (en) * | 2005-07-22 | 2005-11-10 | Kokusai Koryu Kaihatsu Kenkyu Center:Kk | Life calendar |
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