JPH03110896A - Electronic component mounting method - Google Patents

Abstract

PURPOSE:To execute a stable mounting operation under the same pressure without being affected even by a change in a distance from a suction nozzle to a substrate by a method wherein the distance between the suction nozzle and the substrate is measured and an optimum lowering stroke of the suction nozzle is computed. CONSTITUTION:When a distance from a substrate 5 to a suction nozzle at an upper limit is designated as L and a thickness of an electronic component 1 is designated as (a), L-a is a distance up to the substrate 5 to which the suction nozzle 2 is lowered; in addition, the suction nozzle 2 is lowered by (x) in order to exert a definite proper pressure. That is to say, L-a+x is an optimum lowering stroke value from an upper-limit position of the suction nozzle. In this manner, a distance-measuring sensor 15 is introduced and the distance L from a tip position of the nozzle 2 to the substrate 5 is measured; after that, the optimum lowering stroke value is computed by using an operation part 14. Thereby, even when an irregularity exists between individual mounting machines, a stable mounting operation can be executed under a definite pressure.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting method using a mounting machine that automatically mounts electronic components.

2. Description of the Related Art The operation of a conventional mounting machine shown in Japanese Patent Application No. 83-213061 will be explained below with reference to the drawings.

FIG. 4 is a perspective view of the main parts of the mounting machine. In Figure 4,
1 is an electronic component to be mounted. 2 is a suction nozzle that moves up and down when vacuum suctioning and mounting electronic components. 3 is a control section, 4 is an electronic component supply section, and 6 is a board. First, while the suction nozzle 2 is raised to the upper limit in the Z direction, it is moved onto the electronic component in the electronic component supply section 4 in the xY force direction. Next, the suction nozzle /I/2 descends to the lower limit in the Z direction by a certain stroke value and comes into contact with the electronic component 1, and then vacuum suction is performed and ascends to the upper limit in the Z direction while holding the electronic component 1, thereby mounting the component on the board 6. Move to position. The optimum downward stroke value of the suction nozzle is calculated from the thickness data of the electronic component 1 stored in the control unit 3 in advance, and the suction nozzle descends in the Z direction, stops vacuum suction, and rises to the upper limit in the Z direction, and the electronic component 1 is It was to be mounted at a desired position on the board ε.

Problems to be Solved by the Invention However, in the above mounting method, when the distance from the suction nozzle to the board is not constant due to changes in the thickness of the board to be mounted, warpage of the board, etc., it is difficult to mount components with the same pressure. The problem was that it couldn't be done.

Means for Solving the Problems The technical means of the present invention for solving the above problems is to use a distance sensor to measure the distance from the board to be mounted to the nozzle that is sucking the electronic components. This is a method to calculate and implement the optimal downward stroke value of the suction nozzle, and the first step is to store the thickness of the electronic component in the control unit, the second step is to supply the electronic component, and to create a suction nozzle that can move up and down. A third step of suctioning the electronic component, a fourth step of moving the electronic component from the supply unit after suction, a fifth step of measuring the distance from the predetermined position to the board, and the first step and the fifth step. An electronic component mounting method characterized by comprising a fifth step of calculating the optimal downward stroke value of the suction nozzle from the data obtained from the process, and a seventh step of mounting the electronic component on the board based on the optimal downward stroke value. It is.

For production The effect of this technical means is as follows.

That is, even when the distance from the suction nozzle to the substrate is not constant due to changes in substrate thickness, substrate warpage, etc., stable mounting is possible with the same pressure without being affected.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 is a flowchart showing the present invention.
A first step (6) in which the thickness of the electronic component is stored in the control unit, a second step (6) in which the electronic component is supplied, and a third step (8) in which the stain component is sucked by a suction nozzle that can move up and down. a fourth step (9) of sucking the electronic component and moving it from the supply section onto the board to be mounted; a fifth step (10) of measuring the distance from the suction nozzle to the board; 5
A fifth step (11) of calculating the optimum downward stroke value of the suction nozzle from the data obtained in each step, and a seventh step (11) of mounting the electronic component on the board using the optimum downward stroke value.
12). FIG. 2 shows a control configuration for realizing the present invention, which is composed of a storage device 13, an arithmetic device 14, a suction nozzle 2, and a distance measuring sensor 15. FIG. 3 is a diagram for explaining calculation of the optimal suction nozzle downward stroke value when mounting electronic components. 5 is a board on which electronic components are mounted, 2 is a suction nozzle, and 1 is an electronic component. L is the distance from the board 5 to the suction nozzle at the upper limit, and means the electronic component 1
The thickness is . When L-a is the distance from the suction nozzle 2 to the substrate 6, the suction nozzle 6 is lowered by X in order to apply running pressure. That is, L-a+x becomes the optimum downward stroke value from the suction nozzle upper limit position. Conventionally, the value of the thickness a of an electronic component is stored in a storage unit, and L
Based on the premise that the value of is constant υ due to the mechanical mechanism,
The downward stroke value is determined, and if the distance between the substrate and the suction nozzle is not constant, the spring mechanism built into the nozzle tip has no choice but to escape.

In this embodiment, as shown in FIG. 3, after introducing a distance sensor 1S and measuring the distance from the nozzle tip position to the substrate,
The calculation unit calculates the optimal downward stroke value. In addition, in the past, the downward stroke of the suction nozzle was constant, so it was necessary to make precise mechanical adjustments to match the height of the suction nozzle. It is now possible to implement a stable implementation. In addition, by changing the value of X, the mounting pressure can be arbitrarily controlled. Although this embodiment is based on an XY robot type mounting machine, it can be easily applied to a rotary head type mounting machine by attaching a distance measuring sensor to a non-rotating part near the rotary head.

Effects of the Invention As described above, according to the electronic component mounting method of the present invention, by measuring the distance between the suction nozzle and the board and calculating the optimal downward stroke value of the suction nozzle, changes in the thickness of the board and the thickness of the board can be avoided. Even if the distance from the suction nozzle to the substrate changes due to changes in the distance from the suction nozzle to the substrate, stable mounting is possible with the same pressure without being affected.

[Brief explanation of drawings]

FIG. 1 is a flowchart showing the control flow of an electronic component mounting method in an embodiment of the present invention, FIG. 2 is a block diagram, and FIG. 3 is an explanatory diagram for calculating the suction nozzle downward stroke value during electronic component mounting. FIG. 4 is a perspective view of the main parts of a conventional mounting machine. 2...Adsorption nozzle, 13...Storage device, 14...Arithmetic device, 16...Distance measurement sensor.

Claims (1)

[Claims] A method for sucking electronic components of different thicknesses from a supply unit using a suction nozzle and mounting the electronic components at a predetermined position on a board, the method comprising a first step of storing the thickness of the electronic components, and a second step of supplying the electronic components. a third step of sucking the electronic component with a suction nozzle that can move up and down; a fourth step of sucking the electronic component and then moving it from the supply unit onto the board to be mounted;
A fifth step of measuring the distance from the predetermined position to the substrate, a sixth step of calculating the optimal downward stroke value of the suction nozzle from the data obtained from the first step and the fifth step, and based on the optimal downward stroke value, An electronic component mounting method comprising a seventh step of mounting an electronic component onto a board.