JPH03112934U - - Google Patents
Info
- Publication number
- JPH03112934U JPH03112934U JP1990020768U JP2076890U JPH03112934U JP H03112934 U JPH03112934 U JP H03112934U JP 1990020768 U JP1990020768 U JP 1990020768U JP 2076890 U JP2076890 U JP 2076890U JP H03112934 U JPH03112934 U JP H03112934U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- supplied
- coating resin
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990020768U JPH03112934U (da) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990020768U JPH03112934U (da) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112934U true JPH03112934U (da) | 1991-11-19 |
Family
ID=31523854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990020768U Pending JPH03112934U (da) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112934U (da) |
-
1990
- 1990-02-28 JP JP1990020768U patent/JPH03112934U/ja active Pending
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