JPH03116048U - - Google Patents

Info

Publication number
JPH03116048U
JPH03116048U JP1990025245U JP2524590U JPH03116048U JP H03116048 U JPH03116048 U JP H03116048U JP 1990025245 U JP1990025245 U JP 1990025245U JP 2524590 U JP2524590 U JP 2524590U JP H03116048 U JPH03116048 U JP H03116048U
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
power semiconductor
output
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990025245U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990025245U priority Critical patent/JPH03116048U/ja
Publication of JPH03116048U publication Critical patent/JPH03116048U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Emergency Protection Circuit Devices (AREA)
  • Protection Of Static Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例ａおよび過電流保護
回路との接続ｂを示す図、第２図は別の実施例で
ａは平面図、ｂは半導体素子の等価回路、第３図
ａは従来例、ｂは過電流保護回路との接続を示す
図である。 ３Ａ……ドレインリード、３Ｂ……ドレインワ
イヤ、５Ａ……ソースリード、５Ｂ……ソースワ
イヤ、５Ｃ……ソースパツド、１２Ａ……ソース
電位検出リード、１２Ｂ……ソース電位検出ワイ
ヤ、１４Ａ……ドレイン電位検出リード、１４Ｂ
……ドレイン電位検出ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 出力電極と接地電極との間を流れる出力電流が
    制御電極によつて変動的に制御される電力用半導
    体素子において、出力電極または接地電極の少な
    くともいずれか一方の電極は、外部リードとの間
    でワイヤ接続がなされるとともに、該電極の電位
    検出のための設けた外部リードとの接続がとられ
    ていることを特徴とする電力用半導体素子。
JP1990025245U 1990-03-12 1990-03-12 Pending JPH03116048U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990025245U JPH03116048U (ja) 1990-03-12 1990-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990025245U JPH03116048U (ja) 1990-03-12 1990-03-12

Publications (1)

Publication Number Publication Date
JPH03116048U true JPH03116048U (ja) 1991-12-02

Family

ID=31528183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990025245U Pending JPH03116048U (ja) 1990-03-12 1990-03-12

Country Status (1)

Country Link
JP (1) JPH03116048U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4856273B1 (ja) * 2010-11-29 2012-01-18 智江 加藤 靴擦れ防止パッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4856273B1 (ja) * 2010-11-29 2012-01-18 智江 加藤 靴擦れ防止パッド

Similar Documents

Publication Publication Date Title
JPH0363217U (ja)
JPH0279137U (ja)
JPS6197771U (ja)
JPH02110940U (ja)
JPH01128181U (ja)
JPS6149527U (ja)
JPH01135811U (ja)
JPS6327882U (ja)
JPS62103267U (ja)
JPS6433669U (ja)
JPS63195754U (ja)
JPH0345657U (ja)
JPS62204347U (ja)
JPS6351441U (ja)
JPH0260317U (ja)
JPH0480237U (ja)
JPS6228452U (ja)
JPH04759U (ja)
JPS6233682U (ja)
JPS6228451U (ja)
JPH048450U (ja)
JPS6412438U (ja)
JPH0210786U (ja)
JPS6399420U (ja)
JPS647323U (ja)