JPH0312434U - - Google Patents

Info

Publication number
JPH0312434U
JPH0312434U JP1989071736U JP7173689U JPH0312434U JP H0312434 U JPH0312434 U JP H0312434U JP 1989071736 U JP1989071736 U JP 1989071736U JP 7173689 U JP7173689 U JP 7173689U JP H0312434 U JPH0312434 U JP H0312434U
Authority
JP
Japan
Prior art keywords
metal lead
bonding structure
superimposed
bonded
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989071736U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989071736U priority Critical patent/JPH0312434U/ja
Publication of JPH0312434U publication Critical patent/JPH0312434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図はこの考案の第１実施例を
示し、第１図は半導体チツプとフイルム基板のボ
ンデング構造を示す要部平面図、第２図はそのＡ
−Ａ拡大断面図、第３図および第４図は第２実施
例を示し、第３図は液晶表示パネルとフイルム基
板のボンデイング構造を示す要部平面図、第４図
はそのＢ−Ｂ拡大断面図である。 １……半導体チツプ、２，１１……フイルム基
板、３……電極パツド、７，１７…フインガリー
ド、８，１９……溶融金属、１０……液晶表示パ
ネル、１４……接続端子。 1 and 2 show a first embodiment of this invention, FIG. 1 is a plan view of the main part showing the bonding structure of a semiconductor chip and a film substrate, and FIG.
-A enlarged sectional view, Figures 3 and 4 show the second embodiment, Figure 3 is a plan view of the main part showing the bonding structure of the liquid crystal display panel and film substrate, and Figure 4 is an enlarged B-B FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2, 11... Film substrate, 3... Electrode pad, 7, 17... Finger lead, 8, 19... Molten metal, 10... Liquid crystal display panel, 14... Connection terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品の接続端子上に突出状の金属リードを
重ね合わせてワイヤボンデイングのキヤピラリ内
に形成した溶融金属によりボンデイングしたこと
を特徴とする金属リードのボンデイング構造。 A metal lead bonding structure characterized in that a protruding metal lead is superimposed on a connecting terminal of an electronic component and bonded with molten metal formed in a wire bonding capillary.
JP1989071736U 1989-06-21 1989-06-21 Pending JPH0312434U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071736U JPH0312434U (en) 1989-06-21 1989-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071736U JPH0312434U (en) 1989-06-21 1989-06-21

Publications (1)

Publication Number Publication Date
JPH0312434U true JPH0312434U (en) 1991-02-07

Family

ID=31609038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071736U Pending JPH0312434U (en) 1989-06-21 1989-06-21

Country Status (1)

Country Link
JP (1) JPH0312434U (en)

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