JPS6237939U - - Google Patents

Info

Publication number
JPS6237939U
JPS6237939U JP1985130089U JP13008985U JPS6237939U JP S6237939 U JPS6237939 U JP S6237939U JP 1985130089 U JP1985130089 U JP 1985130089U JP 13008985 U JP13008985 U JP 13008985U JP S6237939 U JPS6237939 U JP S6237939U
Authority
JP
Japan
Prior art keywords
electronic component
conductive pattern
component device
substrate
insulating adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985130089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130089U priority Critical patent/JPS6237939U/ja
Publication of JPS6237939U publication Critical patent/JPS6237939U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案電子部品装置の一実施例を示す
断面図、第２図は本考案の一実施例の要部断面図
、第３図は本考案の一実施例で使用できるポリイ
ミド基板上の導電パターンの凸状部の形成工程図
、第４図〜第６図は夫々本考案の説明に供する線
図、第７図は従来例を示す断面図、第８図及び第
９図は夫々従来例の説明に供する線図、第１０図
及び第１１図は夫々従来例の要部拡大断面図であ
る。 １は半導体集積回路チツプ、２はボンデイング
パツド、３はパツシベーシヨン膜、４はポリイミ
ド基板、５は導電パターン、６は半田金属粒子、
７は絶縁性接着剤である。 Fig. 1 is a sectional view showing an embodiment of the electronic component device of the present invention, Fig. 2 is a sectional view of essential parts of an embodiment of the invention, and Fig. 3 is a polyimide substrate that can be used in an embodiment of the invention. FIGS. 4 to 6 are line diagrams for explaining the present invention, FIG. 7 is a sectional view showing a conventional example, and FIGS. Diagrams for explaining the conventional example, FIGS. 10 and 11, are enlarged sectional views of essential parts of the conventional example, respectively. 1 is a semiconductor integrated circuit chip, 2 is a bonding pad, 3 is a passivation film, 4 is a polyimide substrate, 5 is a conductive pattern, 6 is a solder metal particle,
7 is an insulating adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電パターンが設けられた基板と該基板上に配
された電子部品とが導電性粒子を分散させた絶縁
性接着剤を介して接続されてなる電子部品装置に
おいて、上記導電パターンの上記電子部品の電極
との接続部分を凸状に形成したことを特徴とする
電子部品装置。 In an electronic component device in which a substrate provided with a conductive pattern and an electronic component arranged on the substrate are connected via an insulating adhesive in which conductive particles are dispersed, the electronic component of the conductive pattern is An electronic component device characterized in that a connection portion with an electrode is formed in a convex shape.
JP1985130089U 1985-08-27 1985-08-27 Pending JPS6237939U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130089U JPS6237939U (en) 1985-08-27 1985-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130089U JPS6237939U (en) 1985-08-27 1985-08-27

Publications (1)

Publication Number Publication Date
JPS6237939U true JPS6237939U (en) 1987-03-06

Family

ID=31027254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130089U Pending JPS6237939U (en) 1985-08-27 1985-08-27

Country Status (1)

Country Link
JP (1) JPS6237939U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227444A (en) * 1988-03-07 1989-09-11 Sharp Corp Connection structure
WO1996036992A1 (en) * 1995-05-18 1996-11-21 Hitachi, Ltd. Semiconductor device and its manufacture
WO1996042107A1 (en) * 1995-06-13 1996-12-27 Hitachi Chemical Company, Ltd. Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device
JP2007150374A (en) * 1997-03-21 2007-06-14 Seiko Epson Corp Semiconductor device, film carrier tape, and manufacturing method thereof
US12070224B2 (en) 2009-12-22 2024-08-27 Cook Medical Technologies Llc Medical devices with detachable pivotable jaws

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227444A (en) * 1988-03-07 1989-09-11 Sharp Corp Connection structure
WO1996036992A1 (en) * 1995-05-18 1996-11-21 Hitachi, Ltd. Semiconductor device and its manufacture
WO1996042107A1 (en) * 1995-06-13 1996-12-27 Hitachi Chemical Company, Ltd. Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device
US6223429B1 (en) 1995-06-13 2001-05-01 Hitachi Chemical Company, Ltd. Method of production of semiconductor device
JP2007150374A (en) * 1997-03-21 2007-06-14 Seiko Epson Corp Semiconductor device, film carrier tape, and manufacturing method thereof
US12070224B2 (en) 2009-12-22 2024-08-27 Cook Medical Technologies Llc Medical devices with detachable pivotable jaws

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