JPH0312453B2 - - Google Patents
Info
- Publication number
- JPH0312453B2 JPH0312453B2 JP57023819A JP2381982A JPH0312453B2 JP H0312453 B2 JPH0312453 B2 JP H0312453B2 JP 57023819 A JP57023819 A JP 57023819A JP 2381982 A JP2381982 A JP 2381982A JP H0312453 B2 JPH0312453 B2 JP H0312453B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- chamber pressure
- pressure
- etching chamber
- end point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57023819A JPS58140123A (ja) | 1982-02-16 | 1982-02-16 | ドライエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57023819A JPS58140123A (ja) | 1982-02-16 | 1982-02-16 | ドライエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58140123A JPS58140123A (ja) | 1983-08-19 |
| JPH0312453B2 true JPH0312453B2 (2) | 1991-02-20 |
Family
ID=12120958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57023819A Granted JPS58140123A (ja) | 1982-02-16 | 1982-02-16 | ドライエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58140123A (2) |
-
1982
- 1982-02-16 JP JP57023819A patent/JPS58140123A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58140123A (ja) | 1983-08-19 |
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