JPH0312554Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an electronic component structure including an IC (integrated circuit) built into an IC card.

[Technical background of the invention and its problems]

In recent years, electronic components such as wiring patterns and integrated circuits are formed on printed circuit boards.
An IC card with a built-in IC module was developed,
It is about to be put into practical use. The surface of the printed circuit board of the IC module is formed with a wiring pattern made of copper foil and plating layer of about 35 μm.In particular, the structure used for this purpose is such that the IC is installed in a hole drilled in the printed circuit board. Efforts have been made to make the entire structure flat and thin. This is for the purpose of integrating with the plastic card, and the thickness of the plastic card is
It is assumed that it will be about 0.7mm to 2mm,
This is because the thickness of this structure needs to be about 0.5 mm to 1 mm.

In addition to being flat and thin as described above, the structure consisting of electronic components such as ICs and conductor arrays must be sealed, and the surface of the structure should be flat. is required.

Here, the reason why the above is required will be described. The reason why is required is that the structure integrated into the plastic card is used as an example of its use.
Each individual carries the card on a daily basis, and it can serve as a substitute for money using the card's functions, or it can serve as a substitute for document records using the same functions. Generally speaking, they are often used for purposes that are frequently used by individuals. Therefore, this structure will not only function normally when the card is used in its daily natural environment, but also in unexpected situations, such as when the card is submerged in water or exposed to a high temperature and high humidity environment for a long period of time. The cards and structures themselves require protection that allows them to function properly.

The reason why this is required arises from the structure of integrating the structure with the plastic card. An example of its structure is as shown in Figure 2.
The integrated structure is either enclosed in a plastic card (FIG. 1A) or installed and fixed in a recess provided in the card (FIG. 2B) through means such as adhesion with a plastic card. In this case, at least one surface of the structure is in contact with the laminate of plastic sheets forming the card. For integration, means such as adhesive bonding are used, in which case at least one of the necessary pressure or the necessary heat for the adhesive,
Or both can be added. Even if the surface of the component has a wiring pattern of about 35 μm thick on the surface of the printed circuit board, this unevenness will affect the laminated plastic sheet of the card during integration, and as a result, the back side of the surface facing the uneven surface will be affected. In other words, this uneven pattern appears on the surface of the card, seriously detracting from the appearance of the card and making it impossible to obtain a high quality card.

[Purpose of invention]

The purpose of the present invention is to solve the above-mentioned problems of the conventional technology, and not only to make the IC card flat and thin, but also to make the IC card and other electronic components installed on the printed circuit board hermetically sealed. Moreover, it is an object of the present invention to provide an electronic component structure that is configured so that no unevenness occurs on the surface of the IC card when it is built into the IC card.

[Summary of the idea]

The present invention, which has been made to achieve the above object, is an electronic component structure housed in an IC card in which a wiring pattern and electronic components are installed on the surface of a printed circuit board, wherein the surface of the electronic component structure is heat-cured. This is an electronic component structure made by laminating plastic films.

[Example of idea]

FIG. 1 shows an example of the electronic component structure of the present invention. Reference numeral 5 denotes a printed circuit board on which wiring patterns 6 are formed on both sides, and a hole 12 for mounting an electronic component 4 such as an IC is provided in a part of the printed circuit board. The electronic component 4 is fitted into the hole 12, fixed to the printed circuit board 5, and then connected to the wiring pattern 6 of the printed circuit board 5 by means such as wire bonding. Note that 10 is a terminal formed on the surface of the printed circuit board 5 for making an electrical connection with an external device.

In this state, thermosetting resin films 11 and 13 are laminated on both sides of the printed circuit board 5. A hole 14 is provided in the thermosetting resin film 11 at a position corresponding to the electronic component 4, and the thermosetting resin film 1
A hole 15 is also provided at a position corresponding to the terminal 10 of No. 3. Such a thermosetting resin film 1
Any suitable adhesive can be used to bond the printed circuit board 5 to the printed circuit board 5, preferably a thermosetting resin adhesive such as an epoxy resin, an acrylic resin, or a urethane resin. is good. Note that this adhesive layer is omitted in FIG. 1.

Further, as the thermosetting resin films 11 and 13, glass epoxy film, epoxy film,
BT resin or the like can be used, and good results have been obtained by setting the thickness to around 100 μm, as will be described later.

After that, a filler 9, for example, an epoxy resin filler, is poured into the holes 14 of the thermosetting resin film 11 to fill the holes 12, thereby completely covering the electronic component 4, and further thermosetting the surface of the filler 9. A process such as grinding is performed so that the surface is flush with the surface of the plastic film 11.

As shown in FIGS. 2a and 2b, the electronic component structure thus formed is embedded or fitted into the card to complete the IC card.
In addition, in the card of the form shown in FIG. 2a, a hole is formed at a position corresponding to the terminal 10 of the electronic component structure of the plastic sheet 3 located on the front surface, and a hole is formed for making an electrical connection with an external device. , second
In the form of FIG. b, the terminal 10 of the electronic component structure
The electronic component structure is fitted into the recess of the card so that it is exposed on the card surface.

According to the IC card incorporating the electronic component structure according to the present invention, an extremely thin thermosetting resin film (100 μm thick) is coated on the surface of the electronic component structure.
The IC card itself can be made thinner because the two layers (front and back) are laminated.

In addition, since this thermosetting resin film is adhered to almost the entire surface of the printed circuit board, it is possible to seal the electronic components and wiring patterns, and to effectively protect them.

Furthermore, the unevenness on the surface of the printed circuit board is completely blocked by the thermosetting resin film, and even when this electronic component structure is sandwiched between plastic sheets and heated and pressurized when making a card, the thermosetting resin film remains thermoplastic. Unlike resin, the surface of the electronic component structure maintains its flatness without softening or deforming, so no uneven patterns appear on the card surface.
You can create beautiful cards.

The above explanation is for one embodiment of the present invention; for example, in devices that do not require external connection terminals, such as contactless IC cards, a hole for this purpose is provided in the thermosetting resin film. The present invention is not limited to the above-mentioned embodiments, such as that it is not necessary to provide such a material and that the entire surface of the structure may be covered.

[Effects of the invention] As described above, according to the electronic component structure of the present invention, the card itself can be made thin, the electronic components and wiring patterns are well protected, and the electronic component structure can be made thinner. To provide a beautiful card with an elegant appearance without causing unevenness on the surface of the card in a portion corresponding to the body.

[Brief explanation of drawings]

FIG. 1 is an explanatory view showing a cross section of an electronic component structure according to the present invention, and FIGS. 2a and 2b are explanatory views of an IC card including the electronic component structure. 4...Electronic parts, 5...Printed circuit board, 6...
Wiring pattern, 11, 13...Thermosetting resin film.

Claims (1)

[Scope of utility model registration request] An electronic component structure that is built into an IC card and has electronic components installed on a printed circuit board on which a wiring pattern is formed, characterized in that a thermosetting resin film is laminated on the surface of the electronic component structure. construct.