JPH03125960A - B scope image processing method in ultrasonic measurement equipment - Google Patents

Abstract

PURPOSE:To display an observed image easy to estimate the shape or flaw position of an object to be measured by detecting the echo position of the maximum value within an echo data range detecting the positions of both of a flaw echo and a bottom surface echo to subject the same to B-scope display. CONSTITUTION:In an ultrasonic flaw detector 20, an object to be inspected is scanned and the receiving signal of the echo obtained by the ultrasonic flaw detector is converted to a digital signal by an A/D converter circuit 3 to be stored in an RAM circuit part 5 as echo data corresponding to each measuring position. On the basis of the echo data, the positions of both of a flaw echo and a bottom surface echo are detected to form the B-scope display data of the object to be inspected and a B-scope image is displayed. At this time, when a B-scope measuring mode is set, the B-scope image operational processing is started with the completion of scanning due to an A-scope image operational processing program 61. On the basis of the data due to the program 61, the position of the echo of the max. peak value is detected from said data corresponding to each measuring position and subjected to B-scope display as display objective data.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a B-scope image processing method in an ultrasonic measurement device, and specifically, to eliminate images caused by multiple reflections when inspecting a thin object. The present invention relates to a B-scope image processing method for a portable digital ultrasound measuring instrument that can display a B-scope image that is easy to observe.

[Prior Art] A B-scope is a method for obtaining longitudinal cross-sectional images of objects or structures. Conventionally, when acquiring B-scope images with a portable digital ultrasonic measuring device, the first step is As shown in Fig. 3, the ultrasonic probe (hereinafter referred to as probe) 1 is moved in the direction of the arrow to scan the object 11, and in accordance with the depth displayed on the B scope, for example, from the maximum thickness. D with a slightly larger depth
Echo data in the range is A/D converted and collected as digital values corresponding to each measurement position (or measurement point), and a certain threshold TH is set for the collected echo data as shown in Figure 4. Display data is generated to indicate the position of echoes beyond this point, and a scope image is displayed on the screen as shown in FIG.

[Problem to be Solved] Here, the subject 11 shown in FIG. 3 has a stepped bottom surface.
d is the respective bottom surface, and the image shown as 12 in FIG. 5 is an image obtained corresponding to the stepped bottom surface 1 law 11bt 11ct 11d when the object 11 has no defects, and This is when a portion of the bottom echo is detected as echo data exceeding a predetermined threshold as shown in FIG. 4, and a display image is generated based on it.

In this case, as shown in FIG. 4, the displayed echo has a certain width in the portion exceeding the threshold TH, which appears as a thick line on the screen. In addition, in the image shown as 13 in FIG. 5, since the collection range of the B scope image is up to the depth D, the multiple reflected echo data is constant on the bottom surfaces 11c and 11d of the thin part of the subject 11. When the threshold value TH is exceeded, this is set as display data, and this is the state in which it is displayed.

Such multiple reflection echo levels can be eliminated in normal measurements by setting a certain threshold TH at a somewhat high level, but if the threshold is set too high, defective echoes may be missed. In addition, for thin specimens,
As for the bottom echo, the echo level due to multiple reflections is high, often resulting in an image that is difficult to observe as shown in FIG. Furthermore, in FIG. 5, the bottom echo appears as a thick line, making it difficult to grasp the exact positional relationship of the defect as seen from the bottom.

An object of the present invention is to solve the problems of the prior art, and to provide a B-scope image processing method in an ultrasonic measurement apparatus that can obtain a B-scope image that is easy to observe.

[Means for Solving the Problems] The configuration of the B-scope image processing method of the ultrasonic measuring device of the present invention to achieve such an object scans the object and detects the image from the ultrasonic probe or receiver. The received echo signal obtained is A/D converted and collected as echo data,
This is stored in correspondence to each measurement position of the scan, and the positions of defective echoes and bottom echoes are detected based on the stored echo data to generate display data for the B scope of the subject and display the B scope image. In an ultrasonic measurement device that detects the positions of defective echoes and bottom echoes, the position of the maximum echo within the range of echo data is detected for each measurement position and is displayed on the B scope as display target data. .

[Function] In this way, by collecting only the maximum value of the data collected for each measurement position and using it as the data to be displayed, it is possible to easily erase the reflected image from the B-scope image, and , the image lines of the bottom surface and defective areas can be displayed as clear, thin lines. Therefore, it is possible to display an observation image that allows the measurer to easily estimate the shape and defect position of the object from the B-scope image.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram of a portable ultrasonic flaw detector to which the B-scope image processing method of the ultrasonic measuring device of the present invention is applied, and FIG. 2 is an explanatory diagram of its display image.

In FIG. 1, 20 is a portable ultrasonic flaw detector, and 2 is its flaw detector section. The flaw detector section 2 is composed of a pulser receiver, etc., and receives a received signal from a connected probe 1, amplifies it, detects it, and converts it into an analog signal (echo reception signal) through an A/D conversion circuit. Output to 3.

The A/D conversion circuit 3 transmits a transmission wave 1 obtained from the flaw detector section 1.
Analog signals for surface reflected waves, defect reflected waves, etc. are sampled at a high frequency of, for example, about 20 MHz, and these analog outputs are converted into digital values to provide input data values that can be processed by the microprocessor (MPU) 4. The data is sent to the bus 14 as echo data).

Connected to the bus 14 are a dial-type numerical value setting circuit 9 having a gain dial, a cursor dial, etc., and a key input circuit 10 having sheet keys. Receives set values and various key human input signals.

Therefore, when the gain adjustment value for the flaw detector section 2 is input using the gain dial, the microprocessor 4 controls the gain (amplification factor) of the high frequency amplifier of the flaw detector section 2.
The gain of the high frequency amplifier is set to the gain corresponding to the gain adjustment value input using the gain dial.

5 is a RAM circuit unit connected to the bus 14 and having a RAM, which is specified by the echo data of the A/D-converted echo reception signal, various application engine processing programs loaded by the ROM card, and input keys. It also has a B scope display data storage area 5a.

6 is a ROM, which stores basic processing programs for the microprocessor 4 and the like. Also, 7 is RO
M card interface, which is installed in the device.
It is removably connected to the OM card through a connector, and sends information such as programs on the ROM card to the bus 14 under the control of the microprocessor 4.

Reference numeral 9 denotes a liquid crystal display W (LCD) that displays various measured values and set values in addition to the A scope image, the B scope image, etc.

Here, the ROMB contains various basic programs as well as
An A scope image calculation processing program 61, a B scope image calculation processing program 62 based on the maximum value, a display processing program 63, etc. are stored. When the measurement function key is input, the microprocessor 4 searches for the echo with the maximum peak value from the A scope display data in the RAM circuit 5, obtains its display position data, and displays it at each measurement position. Perform corresponding extraction processing. When there is the same display position at each measurement position, the continuous image display data (
The data of the display line indicating the bottom echo is processed as (corresponding processing) to generate display data, and these are stored in the B scope display data storage area 5a.

The A-scope image calculation processing program 61 calculates, stores, and displays the data of the echo part corresponding to defective echoes and bottom echoes and its display position from the echo data obtained by A/D converting the analog echo reception signal. The data is expanded into display data corresponding to the vertical and horizontal axes.

Note that the A scope image calculation processing program 61 and the B scope image calculation processing program 62 using the maximum value
, the display processing program 63, and the like may be stored in the area of the RAM circuit section 5 (and may be later transferred from the ROM card to the RAM circuit section 5 and stored therein).

Next, to explain its operation, first, a predetermined processing program stored in the ROM 6 is activated, the microprocessor 4 operates, and the gain is determined by the gain dial of the dial-type numerical setting circuit 9, and then the measurement conditions and measurement range are determined. etc. are input by the operator (measuring person) using the keys of the key input circuit 10. As a result, the microprocessor 4 operates according to the human input information and the processing program stored in the RoMB, and under its control, the gain of the flaw detector section 2 is set according to the gain dial, and the flaw detection function of the device itself is generated.

Therefore, by starting measurement by manually operating a predetermined key, a transmission pulse signal is sent from the flaw detector section 2 to the probe l, and in response to the transmission pulse signal sent from the flaw detector section 2, the probe 1 An echo reception signal (flaw detection waveform) is obtained corresponding to the echo from the obtained object (test material) 11. This echo reception signal is A/D converted via the A/D conversion circuit 3, and is converted into echo data via the bus 14 to be sent to the microprocessor 4 or the control circuit provided in the RAM circuit section 5 to be sent to the RAM circuit section 5. Stored in the echo data area.

The data stored in this way is data corresponding to the data displayed in the A scope. From this echo data, according to the A-scope image processing program 61, the microprocessor 4 extracts A-scope display data corresponding to the display position and peak value for the defective echo and bottom echo portion, and stores the data in a predetermined manner in the RAM circuit section 5. Store in area.

Here, as shown in FIG.
As the object 11 is scanned by moving its position in the direction of the arrow above, at the time when the A scope display data is extracted, an echo reception signal is subsequently collected for the next measurement position.
This echo data is temporarily stored in the echo data area of the RAM circuit section 5 in the same way as above, and the A scope display data is extracted and is the next data stored in the predetermined area of the RAM circuit section 5. stored in the location.

Such data processing is performed in response to scanning, and the A scope display data at each measurement position is sequentially extracted and sequentially stored in the RAM circuit section 5 so as to correspond to each measurement position.

In this case, if the function key for the A-scope measurement mode is input at the time of starting the measurement, the A-scope image processing program 61 generates the A-scope display data based on the A-scope display data at the same time as the A-scope display data is collected. , starts the display processing program 73. Therefore,
The A scope image is displayed on the LCD 8.

Here, it is assumed that the function key for the B scope measurement mode has been input at the time of starting measurement. In this case, move the probe 1 over the object 11 in FIG. 3 in the direction of the arrow from the left end to the right end as shown in the figure, and after completing the horizontal scanning of the object 11, When all the display data has been collected and the scanning is completed, the B-scope image calculation processing program 72 using the maximum value is activated together with the key to end the scanning.

The B scope image calculation processing program 72 based on the maximum value detects an echo corresponding to the maximum peak value from among the A scope display data obtained for each measurement position based on the A scope display data and displays the echo. Get location data. Then, display image data is generated from these, stored in the B scope display data storage area 5a of the RAM circuit section 5, and the display processing program 73 is activated.

When the measurement mode is the B scope measurement mode, the display processing program 73 displays on the LCD 8 according to the display data in the B scope display data storage area 5a. In this case, the display image generated by the maximum value B-scope image calculation processing program 72 is display data for one point corresponding to the maximum value, so the image becomes a scope image as shown in FIG. . In this case, if the length unit of each display position corresponds to one pixel, the display data can be displayed as narrow as one pixel. Furthermore, since the echo peak value of multiple reflected data is always smaller than that of non-reflected data, multiple reflected echo components are also eliminated by searching for the maximum value.

By extracting only the maximum value data from the A-scope display data in this way, multiple reflection images can be eliminated and a thin line image can be obtained, as shown in FIG. In this case, if there is a defect F that has a larger peak value than the bottom echo, as shown as 15 in the figure,
Although the bottom echo line will be missing, there is no problem because even if this part of the bottom surface is missing, it can be determined that it is the bottom surface based on the relationship between the left and right line displays. Furthermore, for missing parts, if you perform processing to determine whether the display line is missing and then perform line connection processing, it is possible to display the bottom surface status regardless of whether or not the display line is missing. If there are defects in the depth direction, only the defect with the maximum value (its echo) will be detected, but since the defect size and width are the same (they almost never overlap, this is not a big problem).

In addition, here, we collect echo data at a certain measurement position, collect the A scope display data, read the data according to the scan at a cycle corresponding to the measurement cycle, repeat this, and after completing the scan, we collect the A scope display data. Although we are trying to obtain scope display data, it is also possible to fix the probe 1 to the scanning mechanism and obtain the scanning position from a position detector installed in the scanning mechanism and obtain the A scope display data corresponding to the measurement position. good.

As explained above, in the embodiment, the maximum value is searched from the A scope display data to obtain its display position, but this is based on the digital echo reception signal (corresponding to the amplified and detected flaw detection signal). The B scope display data may be extracted by directly selecting the echo having the maximum value from the values (echo data) and calculating its propagation distance (display position).

Specifically, this is taken in from the probe 1 and sent to the A/D
The converted echo data stored in the RAM circuit section 5 -a is calculated by calculating the start address of the area where one period's worth of data is stored, and then the data is read out one by one from the start of the area and compared in the microprocessor 4. do. This is repeated several times for data of - period, and the maximum peak value and the number of pieces of data counted from the beginning of the area are memorized. In this way, the maximum peak value per cycle and the display position of the maximum peak value data are calculated.

By repeating this for each echo data (measurement data) obtained for each measurement position, the maximum peak value and its display position are extracted for each measurement position, and this is stored as B scope display data for each measurement position. It may be stored in the area 5a.

[Effect of the invention] As can be understood from the above explanation, this invention has the following effects:
By collecting only the maximum value of the data collected for each measurement position and using it as the data to be displayed, B
The reflected image can be easily erased from the scope image, and the image lines of the bottom surface and defective areas can be displayed as clear, thin lines. Therefore, it is possible to display an observation image that allows the measurer to easily estimate the shape and defect position of the object from the B-scope image.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a portable ultrasonic flaw detector to which the B-scope image processing method of the ultrasonic measurement device of the present invention is applied, FIG. 2 is an explanatory diagram of the displayed image, and FIG. FIG. 4 is an explanatory diagram of an example of a measurement state when obtaining a scope image. FIG. 4 is an explanatory diagram of how to collect data when obtaining conventional B-scope display data for the bottom echo. FIG. FIG. 2 is an explanatory diagram of a B-scope image displayed in FIG. 1... Ultrasonic probe, 2... Ultrasonic flaw detector section, 3...
... A/D conversion circuit, 4... Microprocessor (M
PU), 5...RAM circuit section, 6...-ROM. 7...ROM interface, 8...Liquid crystal display (
LCD), 9...Dial type numerical value setting circuit, 10.
... Key input circuit, 11... Subject, 20... Portable ultrasonic flaw detector, 61... A scope image calculation processing program, 62.
・・B scope image calculation processing program using maximum value,
63--Display processing program. Figure 2

Claims (1)

[Claims] (1) Scan the object, A/D convert the echo reception signal obtained from the ultrasound probe or receiver, collect it as echo data, and store it corresponding to each measurement position of the scan. Based on the stored echo data, the positions of the defect echo and the bottom echo are detected, and the B of the object is detected.
In an ultrasonic measurement device that generates scope display data and displays a B-scope image, detects the position of the maximum echo in the range of echo data corresponding to each measurement position to detect the positions of the defect echo and the bottom echo. A B-scope image processing method in an ultrasonic measuring device, characterized in that the B-scope image processing method is characterized in that the B-scope image processing method is characterized in that the B-scope image processing method is characterized in that the B-scope image processing method is characterized in that the data is displayed as display target data in the B-scope.