JPH0313751B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technology for drying electronic components, and in particular to a technology that is effective when applied to drying elongated rod-shaped two-terminal electronic components.

[Conventional technology]

Generally, when marking a two-terminal electronic component such as a diode and then drying the mark, it is conceivable to place the diode on a conveyor chain and dry it while passing it through a drying oven.

[Problem to be solved by the invention]

However, in this case, the diode remains stationary on the conveyor chain, and the surface of the diode that primarily receives the drying action from the drying oven remains unchanged. As a result, some surfaces are more dry and others are less dry, and uneven drying results in uneven mark strength after drying, as well as marks becoming more likely to disappear or become smudged.

In addition, electronic components such as diodes are lightweight and small, and are susceptible to problems such as falling off the conveyance line or bending of lead wires during conveyance.

An object of the present invention is to provide a drying technique for electronic components that can uniformly dry the entire portion of the electronic component to be dried.

Another object of the present invention is to provide a technique that can reliably transport and rotate electronic components and, in turn, dry them.

The above and other objects and novel features of the present invention will become clear from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, a pair of conveyor belts perform endless rotation while holding both ends of an elongated rod-shaped electronic component, and a drive means that causes each of these endless conveyor belts to perform endless rotation in the electronic component conveyance direction at mutually different speeds. This is what we have in place.

[Effect]

According to the above-mentioned electronic component drying apparatus of the present invention, since the electronic components are conveyed while being held at both ends by a pair of endless conveyor belts, bends, etc. exist in the sandwiched portions of the electronic components. However, since the pair of endless conveyor belts each perform endless rotational motion at different speeds, the electronic components being transported are reliably rotated and are not a source of drying of the electronic components. This ensures that the exposed area always changes, allowing for uniform drying throughout.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 3 and 4.

FIG. 3 is a schematic sectional view showing an embodiment of the electronic component drying apparatus according to the present invention, and FIG. 4 is an enlarged explanatory view of the conveyor belt.

In this embodiment, 1 is a drying oven body, and within this oven body 1, a drying source 2 is provided approximately in the center. The drying source 2 can be composed of various types, such as an infrared heater, an ultraviolet heater, or a hot air heater, and in this embodiment, it is composed of an infrared heater as an example.

Therefore, a reflector plate 3 having a substantially semicircular cross-section is provided from the periphery of the drying source 2 upwards, and a heat insulating plate 4 inclined obliquely toward the center is provided at the lower peripheral portion of the reflector plate 3.
is provided. An opening 5 for passing infrared rays is formed in the center of the heat insulating plate 4.

An electronic component to be dried, for example a diode 6 having an elongated rod-like structure, is conveyed immediately below the opening of the heat insulating plate 4.

That is, the diode 6 of this embodiment has a sealed body part 6a in which a semiconductor diode element is sealed, for example, in the center, and lead wire parts 6b are arranged in a straight line at both ends of the sealed body part 6a in the axial direction. It has an elongated rod-like shape that extends from . Then, the mark 6c on the surface of the sealing body portion 6a of the diode 6 is dried, for example.

This diode 6 has a sealed body portion 6a located immediately below the opening 5 of the heat insulating plate 4, and is conveyed with the lead wire portions 6b on both sides thereof being sandwiched between a pair of endless conveyor belts 13a and 14a. . Each conveyor belt 13a, 14a is endlessly rotated in the electronic component conveyance direction by drive rollers (drive means) 13b, 14b, respectively.

In this embodiment, each pair of endless conveyor belts 1
3a and 14a function not only as diode transport means but also as diode rotation means.

Therefore, each of the pair of endless conveyor belts 13a, 14a in this embodiment is endlessly rotated at different speeds, and the difference in speed causes the diode 6 being conveyed to rotate around its axis.

That is, each pair of conveyor belts 13a and 1
4a is conveyed by sandwiching the lead wire portions 6b at both ends of the diode 6 between them, but the drive roller 13b
and 14b, for example, the roller 13b rotates about 1.5 times faster than the roller 14b, so the diode 6 is rotated due to the speed difference between the conveyor belts 13a and 14a, and the drying source 2 of the sealed body portion 6a is rotated. The surface area facing the surface changes constantly,
The mark 6c is dried uniformly throughout.

Note that the lower side of the sealed body portion 6a of the diode 6 is guided by a diode receiver 9.

Next, the operation of this embodiment will be explained.

First, a diode, which is an electronic component to be dried, is held at both ends by a pair of endless conveyor belts 13a, 14a in a drying oven body 1 by a delivery means (not shown).
As the endless rotation movement of 4a progresses, the electronic component transport direction changes;
For example, it is transported in the direction of the arrow in FIG.

At this time, the drive rollers 13b and 14b have different speeds, for example, the former 13b is faster than the latter 14b.
Since the diode 6 is rotated at a speed 1.5 times faster than the rotation speed of the drive roller 13b, in this case, the diode 6 is transported while being rotated in the same direction as the rotation of the drive roller 13b at a frequency corresponding to the speed difference between both rollers.

As a result, the surface area of the diode 6 facing the drying source 2 changes constantly during conveyance by the endless conveyor belts 13a, 14a, and the entire surface of the sealed body part 6a of the diode 6 to be dried is uniformly distributed. Can be dried.

Furthermore, since both ends of the diode 6 being conveyed are held between the pair of endless conveyor belts 13a and 14a, even if the lead wire portion 6b is slightly bent, the diode 6 will not fall. Transport and rotation can be carried out reliably without any problems.

Hereinafter, a reference example of an electronic component drying apparatus according to the present invention will be explained based on FIGS. 1 and 2.

Reference Example 1 FIG. 1 is a schematic sectional view showing Reference Example 1 of the electronic component drying apparatus according to the present invention.

In this reference example 1, the diode 6 has a sealing body portion 6a for sealing a semiconductor element connected to the heat insulating plate 4.
The lead wire portions 6b located immediately below the opening 5 and on both sides thereof are successively supported on the endless conveyor chain 7 on the chain guide 8 at predetermined intervals. In this reference example, the diode 6 is conveyed from the front side to the other side in FIG.
The mark 6c placed on the top a is dried by infrared rays from the drying source 2.

Further, in this reference example 1, diode rotating plates 10 as rotating means are provided on the outside of the conveyor chain 7 on both sides. This diode rotary plate 10 is preferably rotated, for example, by 180 degrees at the drying position of the diode 6, to change the drying surface of the sealed body portion 6a of the diode 6, that is, the surface portion facing the drying source 2, and to dry the sealed body portion 6a of the diode 6. This is to ensure that the entire circumference is dried evenly. Note that the diode rotating plate 10 can also be used in common with the diode receiver 9.

Therefore, the upper end of the diode rotating plate 10 extends upward enough to contact the lead wire portion 6b of the diode 6 and rotate the diode 6 by a predetermined angle. The diode rotating plate 10 is preferably made of a non-magnetic material such as stainless steel or aluminum so that the magnetic lead wire portion 6b is not attracted.

Next, the operation of this reference example will be explained.

First, the lead wire portion 6b of the diode 6 with the mark 6c marked on the sealing body portion 6a is placed on two rows of conveyor chains 7, and as the conveyor chain 7 moves, the diode 6 is conveyed below the drying source 2. The infrared rays from the drying source 2 are irradiated onto the sealing body portion 6a of the diode 6 through the opening 5 of the heat insulating plate 4 to dry the side of the mark 6c facing the drying source 2.

In this way, when the diode 6 whose drying source 2 side of the mark 6c has been dried further moves, the lead wire portion 6b of the diode 6 is connected to the diode rotating plate 1.
0, the diode 6 rotates due to friction at that time, and the surface area of the sealing body part 6a facing the drying source 2 is displaced from the already dried area in the rotation direction, and the undried side of the mark 6c is It is sufficiently dried by infrared rays from the drying source 2.

Therefore, according to this reference example, diode 6
By rotating with the diode rotary plate 10, the surface area of the sealing body part 6a facing the drying source 2 can be changed, so that the marks 6c etc. are dried uniformly over the entire surface, eliminating uneven drying and improving the mark strength. Uniformity can be achieved, and defects such as erasure of marks and stains can be prevented.

Reference Example 2 FIG. 2 is a schematic sectional view showing Reference Example 2 of the electronic component drying apparatus according to the present invention.

In this reference example 2, as a rotation means for rotating the diode 6, a rubber roller 11 (friction roller) as a rotation means for contacting the lead wire portion 6b and rotating the diode 6 by the frictional force at that time is attached to the roller support base 12. supported above.

Therefore, in Reference Example 2 as well, the surface to be dried changes successively as the diode 6 rotates in contact with the rubber roller 11, so that the entire surface of the mark 6c of the sealing body portion 6a is uniformly dried.

〔Effect of the invention〕

(1) According to the present invention, both ends of the electronic component are conveyed while being sandwiched between each pair of endless conveyor belts, and the speeds of each of the pair of endless conveyor belts are made different from each other, so that electronic components are transported at the drying position. By rotating the parts, the part of the surface to be dried facing the drying source is constantly changed, so that the entire surface to be dried can be uniformly dried without uneven drying.

(2) According to (1) above, the strength of dry marks and the like is improved and made uniform.

(3) Furthermore, since electronic components are conveyed by being held at both ends by a pair of endless conveyor belts,
Even if the electronic components are bent at both ends, they can be reliably conveyed without falling off the endless conveyor belt.

(4) Due to (1) and (3) above, lightweight and small electronic components can be transported and rotated extremely reliably.

(5) With (3) and (4) above, it is possible to prevent problems such as bending of lead wires of electronic components during transportation and rotation.

As above, the invention made by the present inventor has been specifically explained based on examples, but the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say.

For example, it is possible to use a drying source for electronic components, a transport structure, etc. other than those in the above embodiments.

In the above description, the invention made by the present inventor was mainly applied to the field of use of the invention, which is drying marks on diodes. However, the present invention is not limited thereto. It can be widely applied to drying techniques other than mark drying.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view of Reference Example 1 of an electronic component drying apparatus according to the present invention, FIG. 2 is a schematic cross-sectional view of Reference Example 2 of the present invention, and FIG. 3 is a schematic cross-sectional view of a reference example 2 of an electronic component drying apparatus according to the present invention. A schematic sectional view of the embodiment, and FIG. 4 is an enlarged explanatory view of the conveyor belt. DESCRIPTION OF SYMBOLS 1... Drying oven body, 2... Drying source, 6... Diode (electronic component), 6a... Sealing body part, 6b... Lead wire part, 6c... Mark, 7... Conveyor chain, 10
... Diode rotating plate (rotating means), 11... Rubber roller (rotating means), 13a, 14a... Endless conveyor belt, 13b, 14b... Drive roller (driving means).

Claims (1)

[Scope of Claims] 1. A device that dries elongated rod-shaped electronic components while conveying them, comprising: a drying section provided in a drying area for drying the electronic components; and an endless rotating motion with both ends of the electronic component being held. What is claimed is: 1. A drying device for electronic components, comprising: a pair of endless conveyor belts; and a drive means for endlessly rotating each of the pair of endless conveyor belts in an electronic component conveying direction at different speeds. 2. Claim 1, wherein the electronic component is a two-terminal electronic component consisting of a sealed body portion which is a drying portion and a lead wire portion extending linearly at both ends of the sealed body portion. Drying equipment for electronic components as described in Section 1. 3. The electronic component drying apparatus according to claim 2, wherein the two-terminal electronic component is a diode.