JPH0314063Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Technical Field) This invention relates to a gauge for detecting incorrect wiring in a multilayer printed wiring board circuit.

(Prior Art) Generally, as a measure to prevent incorrect wiring on a printed wiring board, a circuit diagram is compared with a pattern on a printed wiring board drawing. This was done by checking one point on the circuit diagram route and the corresponding line on the pattern diagram, and sequentially filling it in with a colored pencil.

(The problem that the idea attempts to solve) First, the structure of the multilayer printed wiring board will be explained.

FIG. 2 shows an example of a multilayer printed wiring board. The printed wiring board is composed of a component side substrate 4, an intermediate layer substrate 5, and a solder side substrate 6. A component surface 4a is formed on the upper surface of the component surface substrate 4. The middle layer substrate 5 has a power supply surface 5a on its upper surface and a ground surface 5b on its lower surface. A solder surface 6a is formed on the lower surface of the solder surface substrate 6.

The power supply surface 5a has a clearance 7 (7-
1, 7-2, 7-3...) or through-hole lands 3 connected to through-holes are wired in a grid pattern at a constant pitch. This is provided with clearances 7 at locations where the component surface 4a and solder surface 6a and power source surface 5a are not connected, and through-hole lands 3 at locations where they are connected.

However, when designing a multilayer printed wiring board, for example, designing the power layer 5a, in a drawing that is twice the size of the multilayer printed wiring board, the clearance 7 is not drawn and points are marked only for the positions of the through hole lands 3. Therefore, the through-hole land 3 that should be provided on the lattice point, for example, drawn at the midpoint of two lattice points.
Sometimes I misplaced the position. This may cause shorts in the power supply, ground, etc.

In the case of design errors such as incorrect positioning of through-hole lands in the middle layer, there is a problem in that it is not easy to check in the above verification process because multilayer printed wiring boards are formed in multiple layers as described above. Ta.

In order to solve these problems, the present invention aims to provide a gauge for detecting incorrect wiring in a multilayer printed wiring board circuit, which can easily visually check for incorrect positions of through-hole lands.

(Means for Solving the Problem) In order to achieve the above object, this invention consists of a transparent film that corresponds to the shape of the object to be detected, and is placed at a position corresponding to the clearance of the object to be detected and the lattice points formed by the through-hole lands. , an opaque portion having a shape corresponding to the clearance is provided to constitute a miswiring detection gauge for a multilayer printed wiring board circuit.

Note that the object to be detected refers to a printed wiring board or a drawing of a printed wiring board to be checked.

(Function) The detection gauge according to this invention is used by being superimposed on the object to be detected so that the lattice points formed by the clearance and through-hole land of the object are hidden by the opaque portion. When the through-hole land is visible from the transparent part in this overlapping state, it can be seen that the through-hole land is provided in the wrong position.

(Example) Here, an example of the invention will be described using the drawings.

FIG. 1a is a partial plan view of a first embodiment of the invention. A detection gauge 1 shown in the figure is a film provided in the same size as a printed wiring board, which is an object to be detected. In this case, the clearance of the printed wiring board and the lattice points formed by the through-hole lands are
Assuming that it is provided with a pitch of 2.54 mm,
Correspondingly, the film has circular opaque areas 2 arranged on a transparent background at a pitch of 2.54 mm. To give an example of the production of such a film, first, grid points with a pitch of 2.54 mm are plotted with a CPU, and then a film with a diameter of 1.6 mm as shown in Figure 1a can be produced using a photoprinter using the MT. can.

Next, the operation of this detection gauge 1 will be explained.

First, the detection gauge 1 is placed on the object to be detected so that the opaque region 2 is located on the grid point formed by the clearance of the object and the through-hole land.

In this state, the lattice points are hidden by the opaque area 2, so if the through-hole land 3' comes to a transparent area other than the opaque area 2, it will be known that the position is incorrect. In other words, if the through hole land 3' is provided in the wrong position,
Since the through-hole land 3' appears to protrude from the opaque portion 2, it can be identified at a glance.

FIG. 1b is a partial plan view of a second embodiment of the present invention. The detection gauge 1' shown in the figure is a film having the same size as the printed wiring board which is the object to be detected, as in the first embodiment, and the transparent portion and the opaque portion are reversed. That is, a circular transparent portion 2' is provided on the film at a position shifted by half a pitch vertically and horizontally with respect to the lattice points formed by the clearance of the object to be detected and the through-hole land.
They are arranged at a pitch of 2.54 mm, and the surrounding area is made opaque.

This effect will be explained. First, the detection gauge 1' is placed on the object to be detected so that the opaque portion is on the grid point formed by the clearance of the object and the through-hole land. In other words, the transparent parts 2' are overlapped with each other by being shifted by half a pitch vertically and horizontally from the lattice points of the printed wiring board, and a visual check can be performed in the same manner as in the embodiment shown in FIG. 1a.

In these embodiments, an example was shown in which a printed wiring board is directly checked, but it goes without saying that a wiring detection gauge that checks a printed wiring board drawing is also possible.

(Effects of the invention) As explained above, this invention provides a new gage for detecting incorrect wiring on multilayer printed wiring boards. This has the effect of making it easy to visually check for erroneous positions.

[Brief explanation of the drawing]

FIG. 1a is a partial plan view of the first embodiment of the invention.
FIG. 1b is a partial plan view of a second embodiment of the invention. FIG. 2 is an exploded perspective view showing an example of a multilayer printed wiring board. 1, 1'... Miswiring detection gauge, 2... Opaque area, 2'... Transparent area, 3'... Through-hole land provided at incorrect position.

Claims (1)

[Claims for Utility Model Registration] (1) A transparent film corresponding to the shape of the object to be detected, with a shape corresponding to the clearance at a position corresponding to the clearance of the object to be detected and the lattice points formed by the through-hole lands. A gage for detecting incorrect wiring in multilayer printed wiring circuits, characterized by the provision of opaque parts. (2) A miswiring detection gauge for a multilayer printed wiring board circuit according to claim 1 of the utility model registration, characterized in that the opaque portion is circular. (3) Utility model registration claim 1 characterized in that the film is provided with the same dimensions as the object to be detected
2. Miswiring detection gauge for a multilayer printed wiring board circuit according to item 1 or 2.