JPH03141693A - Rigid flexible composite multilayer printed circuit board and manufacture thereof - Google Patents
Rigid flexible composite multilayer printed circuit board and manufacture thereofInfo
- Publication number
- JPH03141693A JPH03141693A JP27938789A JP27938789A JPH03141693A JP H03141693 A JPH03141693 A JP H03141693A JP 27938789 A JP27938789 A JP 27938789A JP 27938789 A JP27938789 A JP 27938789A JP H03141693 A JPH03141693 A JP H03141693A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible
- circuit board
- multilayer printed
- composite multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 125000006850 spacer group Chemical group 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 12
- 239000012778 molding material Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
く技術分野〉
本発明はリジッド−フレキシブル複合多層プリント配線
板とその製法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a rigid-flexible composite multilayer printed wiring board and a method for manufacturing the same.
く従来技術〉
従来、リジッド−フレキシブル複合多層プリント配線板
はフレキシブル配線板とリジッド配線板を個別に準備し
位置合せした後、接着して作られていた。従って工程が
複雑で作業能率が悪く、品質上の問題も多いなどの欠点
があり、殊に７レキシブルプリント配線板の両側、両面
にリジッド配線板を一体化した高密度の製品の生産は工
程がより複雑で、品質の確保が難しいものでおった。Prior Art Conventionally, a rigid-flexible composite multilayer printed wiring board has been made by separately preparing a flexible wiring board and a rigid wiring board, aligning them, and then bonding them together. Therefore, there are disadvantages such as complicated processes, low work efficiency, and many quality problems.In particular, the process is difficult to produce high-density products that integrate rigid wiring boards on both sides of a 7 flexible printed wiring board. It was more complex and difficult to ensure quality.
〈発明の目的〉
本発明は叙上の事情に鑑み検討された結果なされたもの
であって、高密度で高品質なリジッド−フレキシブル複
合多層プリント配線板とその製法を提供するものである
。<Objective of the Invention> The present invention was made as a result of studies in view of the above circumstances, and provides a high-density, high-quality rigid-flexible composite multilayer printed wiring board and a method for manufacturing the same.
〈発明の開示〉
本発明の要旨は前記の通りであり、以下詳細に説明する
。第１図〜第４図は本発明になるリジッド−７レキシブ
ル複合多層プリント配線板の製法を実施例で図示したも
ので、以下これに従い詳細に説明する。<Disclosure of the Invention> The gist of the present invention is as described above, and will be explained in detail below. FIGS. 1 to 4 illustrate a method for manufacturing a rigid-7 flexible composite multilayer printed wiring board according to an embodiment of the present invention, and will be described in detail below.
本発明になるリジッド−フレキシブル複合多層プリント
配線板を作成するに当っては、両面に内層回路（１ａ）
の形成されたフレキシブル配線板の上下に、絶縁層とし
てガラスクロス−エポキシ系のプリプレグ（２）を重ね
その外側に内層回路（３ａ）の形成された内層配線板（
３）、プリプレグ（２）ならびに銅箔（４）が重ねられ
たものを成形素材とし、熱圧成形して、成形板（５）を
得る。次いで外層回路（８）及び切欠溝（６）を設はリ
ジッド−フレキシブル複合多層プリント配線板用のプリ
ント配線板（９）を得る。In producing the rigid-flexible composite multilayer printed wiring board of the present invention, inner layer circuits (1a) are provided on both sides.
Glass cloth-epoxy prepreg (2) is layered as an insulating layer on the top and bottom of the flexible wiring board on which the inner layer circuit (3a) is formed.
3) A molding material in which prepreg (2) and copper foil (4) are stacked is subjected to hot pressure molding to obtain a molded plate (5). Next, an outer layer circuit (8) and a cutout groove (6) are provided to obtain a printed wiring board (9) for a rigid-flexible composite multilayer printed wiring board.
該フレキシブル配線板（１）の適所には剥離部（１ｂ）
が設けられていて、該成形板（５）の両側より表裏同一
の部分において該剥離部（１ｂ）に至る該切欠溝（６）
が設けられると、該切欠溝（６）で囲まれた部分はスペ
ーサー部分（７）として利用でき、該スペーサー部分（
７）を剥離し切欠帯（ロ）が設けられればリジッド−７
レキシプル複合多層プリント配線板α１に仕上げられる
。The flexible wiring board (1) has a peeling part (1b) at a suitable place.
are provided, and the cut groove (6) reaches the peeling portion (1b) from both sides of the molded plate (5) at the same portion on the front and back.
is provided, the part surrounded by the notch groove (6) can be used as a spacer part (7), and the spacer part (
If 7) is peeled off and a notch band (b) is provided, it becomes rigid-7.
Finished into Lexipulu composite multilayer printed wiring board α1.
該剥離部（１ｂ）は硬化性樹脂にシリコン系離型剤、フ
ッ素系離凰剤等の内部離壓剤の混入された樹脂組成物が
コートされ仕上げられたもの、表面が離型性のある接着
テープあるいは、紫外線硬化減樹脂成分と熱硬化型樹脂
成分ならびに硬化剤、光増感剤等の配合された樹脂組成
物が塗布され、紫外線照射されて半硬化状に調整され熱
圧時に流動化したり、プリプレグの樹脂成分と相溶しな
い性状に仕上げられたものなどが使用され、好ましくは
フレキシブル配線板の基材シートと剥離強度０．１〜０
．５ｋｇ／ｃ１１で剥離するものが適合する。The peeling part (1b) is finished by coating a curable resin with a resin composition mixed with an internal release agent such as a silicone-based mold release agent or a fluorine-based mold release agent, and the surface has mold release properties. An adhesive tape or a resin composition containing an ultraviolet curable reducing resin component, a thermosetting resin component, a curing agent, a photosensitizer, etc. is applied, and the material is adjusted to a semi-cured state by irradiation with ultraviolet rays and becomes fluidized when heated and pressed. or a material finished with properties that are incompatible with the resin component of the prepreg, and preferably has a peel strength of 0.1 to 0 with respect to the base sheet of the flexible wiring board.
．． One that peels off at 5kg/c11 is suitable.
ｏ、１ｋｆ／ｃｓ以下ではスペーサー部分の保持力が不
十分で、実装工程においてスペーサー部分が脱離してし
まうため不適当であり、逆に剥離強度がｏ、 ｓ ｋｇ
／ ａｓ以上ではスペーサー部分の剥離性が劣り作業
性が低下し好ましくない。If it is less than o, 1 kf/cs, the holding force of the spacer part is insufficient and the spacer part will come off during the mounting process, so it is unsuitable, and conversely, the peel strength is o, s kg.
/as or more is not preferable because the releasability of the spacer portion is poor and workability is lowered.
なお剥離部の形態は液状、ペースト状又はシート状であ
り、フレキシブル配線板の表裏に付着され、その状態も
しくは処理されて使用される。また各種の繊維から作ら
れた紙、不織布等の多孔質な基材に樹脂成分が塗布又は
含浸されたものが使用されてもよい。Note that the peeling portion is in the form of a liquid, a paste, or a sheet, and is attached to the front and back sides of the flexible wiring board, and used in that state or after being processed. Alternatively, a porous base material such as paper or nonwoven fabric made of various fibers coated or impregnated with a resin component may be used.
フレキシブル配線板にはポリイミド樹脂、ポリエステル
樹脂停の合成樹脂シートもしくは各種センイから作られ
た紙、不織布等の基材、エポキシ樹脂、ウレタン樹脂、
ポリエステル樹脂等の含浸処理され成形されたシート基
材に回路形成され九ものが使用される。プリプレグには
パルプ、ガラスセンイ等の各種センイから作られた紙、
不織布等の多孔質な基材にエポキシ樹脂等の熱硬化性樹
脂が含浸処理されて半硬化状態とされたものがシート状
で配置使用される。Flexible wiring boards are made of polyimide resin, polyester resin, synthetic resin sheet, paper made from various fibers, non-woven fabric, etc., epoxy resin, urethane resin, etc.
A circuit is formed on a sheet base material impregnated with polyester resin or the like and molded, and nine types are used. Prepreg includes pulp, paper made from various types of fibers such as glass fibers,
A porous base material such as a non-woven fabric is impregnated with a thermosetting resin such as an epoxy resin to form a semi-cured state, and then used in the form of a sheet.
第１図は積層状態の１例であって、内層回路板が３枚以
上になるケースや、既製の多層板が使用されるケース等
がある。また銅箔に替えて銅貼積層板、回路形成された
外層配線板等が使用されてもよい。回路形成、ンルダー
レジストのコートならびに切欠溝の加工等については公
知の技術が採用される。FIG. 1 shows an example of a laminated state, and there are cases where there are three or more inner layer circuit boards, cases where ready-made multilayer boards are used, etc. Further, instead of copper foil, a copper-clad laminate, an outer layer wiring board on which a circuit is formed, etc. may be used. Known techniques are used for circuit formation, coating of a resist resist, processing of notched grooves, and the like.
〈発明の効果〉
本発明になるリジッド−フレキシブル複合多層プリント
配線板の製法においては、両面適所に回路及び剥離部の
設けられたフレキシブル配線板の上下にプリプレグを介
し内層回路板、銅箔等を重ね成形した成形体に該剥離部
において切欠溝及び該切（Ｐ１！溝により囲まれるスペ
ーサー部を設ける工程を採用するものであるから、該ス
ペーサー部を剥離するだけでフレキシブル部分が形成さ
れリジッド−フレキシブル複合多層プリント配線板に仕
上げることができる。<Effects of the Invention> In the method for manufacturing a rigid-flexible composite multilayer printed wiring board according to the present invention, an inner layer circuit board, copper foil, etc. are placed on the upper and lower sides of a flexible wiring board with circuits and peeling parts provided at appropriate locations on both sides via prepreg. Since the process of providing a notch groove and a spacer portion surrounded by the notch (P1! groove) in the peeled portion of the overmolded molded body is adopted, a flexible portion is formed simply by peeling off the spacer portion, and a rigid portion is formed. It can be finished into a flexible composite multilayer printed wiring board.
しかも電子部品等の実装工程においてスペーサー部を装
着した状態で作業が行われ、工程終了後、スペーサー部
が剥離されればフレキシブル部分を損なうことがない。Moreover, in the process of mounting electronic components, etc., work is carried out with the spacer part attached, and if the spacer part is peeled off after the process is completed, the flexible part will not be damaged.
またこのようにして作られ九すジッドー７レキシプル複
合多層プリント配線板は適所にフレキシブル部分が存在
するため、フレキシブル部分で折り曲り゛が可能であり
、各種電子機器の小屋化に貢献できるものである。In addition, since the Kusujido 7 Lexiple composite multilayer printed wiring board made in this way has flexible parts at appropriate locations, it is possible to bend the flexible parts, which can contribute to the construction of various electronic devices. .
第１図はフレキシブル配線板（１）の上下にプリプレグ
（２）、内層配線板（３）、銅箔（４）等が重ねられ配
置された状態図、第２図はフレキシブル配線板（１）、
内層配線板（３）、銅箔（４）等がプリプレグを介し成
形された成形板（５）の断面図、第３図は該成形板（５
）に切欠溝（６）及び核切欠溝（６）で囲まれたスペー
サー部分（７）の設けられたリジッド−フレキシブル複
合多層用のプリント配線板（９）の断面図、第４図はス
ベサ一部分（７）が剥離され仕上げられたリジッド−フ
レキシブル複合多層プリント配線板α１の断面図である
。
１・・・フレキシブル配線板 １ａ、３ａ・・・内層回
路１ｂ・・・剥離部 ２・・・プリプレグ３
・・・内層配線板 ４・・・銅箔５・・・成形
板 ６・・・切欠溝７・・・スペーサー部
分 ８・・・外層回路９・・・プリント配線板
１０・・・リジッド−フレキシブル複合多層プリント配
線板Figure 1 is a state diagram in which prepreg (2), inner layer wiring board (3), copper foil (4), etc. are stacked and arranged above and below a flexible wiring board (1), and Figure 2 is a diagram of the flexible wiring board (1). ,
FIG. 3 is a sectional view of a molded board (5) on which an inner layer wiring board (3), copper foil (4), etc. are molded via prepreg.
) is a cross-sectional view of a printed wiring board (9) for a rigid-flexible composite multilayer in which a spacer portion (7) surrounded by a notch groove (6) and a core notch groove (6) is provided. (7) is a sectional view of the finished rigid-flexible composite multilayer printed wiring board α1 after being peeled off. 1...Flexible wiring board 1a, 3a...Inner layer circuit 1b...Peeling part 2...Prepreg 3
...Inner layer wiring board 4...Copper foil 5...Molded plate 6...Notch groove 7...Spacer portion 8...Outer layer circuit 9...Printed wiring board 10...Rigid-flexible Composite multilayer printed wiring board
Claims (1)
ブル配線板を中心にして、その上下に絶縁層を介し内層
配線板、外層回路が設けられるとともに、該剥離部に至
る切欠帯が表裏同一の部分において設けられていること
を特徴とするリジッド−フレキシブル複合多層プリント
配線板（２）回路形成され、かつ剥離部の設けられたフ
レキシブル配線板の上下に絶縁層を介し内層配線板、銅
箔等を重ねた成形素材を熱圧成形し、該剥離部に至る切
欠溝を設け、該切欠溝で囲まれるスペーサー部分を剥離
して仕上げることを特徴とするリジッド−フレキシブル
複合多層プリント配線板の製法(1) Centering around a flexible wiring board on which a circuit is formed and a peeling part is provided, an inner layer wiring board and an outer layer circuit are provided above and below through an insulating layer, and the notch strips leading to the peeling part are the same on both front and back sides. Rigid-flexible composite multilayer printed wiring board (2) A rigid-flexible composite multilayer printed wiring board characterized in that it is provided with an inner layer wiring board, a copper foil, and an insulating layer above and below the flexible wiring board on which a circuit is formed and a peeling part is provided. A method for manufacturing a rigid-flexible composite multilayer printed wiring board, which is characterized by hot-pressing a molding material in which layers such as the like are piled up, providing a notched groove leading to the peeled portion, and finishing by peeling off the spacer portion surrounded by the notched groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27938789A JPH03141693A (en) | 1989-10-26 | 1989-10-26 | Rigid flexible composite multilayer printed circuit board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27938789A JPH03141693A (en) | 1989-10-26 | 1989-10-26 | Rigid flexible composite multilayer printed circuit board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03141693A true JPH03141693A (en) | 1991-06-17 |
Family
ID=17610428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27938789A Pending JPH03141693A (en) | 1989-10-26 | 1989-10-26 | Rigid flexible composite multilayer printed circuit board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03141693A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0513958A (en) * | 1991-07-04 | 1993-01-22 | Nippon Avionics Co Ltd | Flexible rigid printed board |
| JPH05191050A (en) * | 1992-01-13 | 1993-07-30 | Hitachi Chem Co Ltd | Manufacture of rigid flex wiring board |
| JPH05243737A (en) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | Flexible rigid printed wiring board |
| JP2012204749A (en) * | 2011-03-28 | 2012-10-22 | Nec Toppan Circuit Solutions Inc | Rigid flexible printed wiring board and method of manufacturing the same |
| CN104703405A (en) * | 2015-03-13 | 2015-06-10 | 广州杰赛科技股份有限公司 | Rigidity-flexibility combined slab and manufacturing method thereof |
| US20160007442A1 (en) * | 2014-07-01 | 2016-01-07 | Isola Usa Corp. | Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs |
| CN106686896A (en) * | 2017-01-19 | 2017-05-17 | 广州美维电子有限公司 | Preparation method of ladder board and ladder board obtained through method |
| CN106793582A (en) * | 2016-11-25 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of preparation method of rigid-flex combined board |
| CN106961809A (en) * | 2017-04-06 | 2017-07-18 | 台山市精诚达电路有限公司 | A kind of preparation method of Rigid Flex |
| KR20180005300A (en) * | 2016-07-05 | 2018-01-16 | 주식회사 우영 | Manufacturing Method of Rigid-Flexible Multi-Layer Printed Circuit Board |
| KR20180025345A (en) * | 2016-08-29 | 2018-03-09 | 주식회사 코리아써키트 | Rigid flexible circuit board manufacturing method |
| CN110602882A (en) * | 2019-10-25 | 2019-12-20 | 珠海杰赛科技有限公司 | Blind slot printed circuit board and processing method thereof |
-
1989
- 1989-10-26 JP JP27938789A patent/JPH03141693A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0513958A (en) * | 1991-07-04 | 1993-01-22 | Nippon Avionics Co Ltd | Flexible rigid printed board |
| JPH05191050A (en) * | 1992-01-13 | 1993-07-30 | Hitachi Chem Co Ltd | Manufacture of rigid flex wiring board |
| JPH05243737A (en) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | Flexible rigid printed wiring board |
| JP2012204749A (en) * | 2011-03-28 | 2012-10-22 | Nec Toppan Circuit Solutions Inc | Rigid flexible printed wiring board and method of manufacturing the same |
| US9764532B2 (en) * | 2014-07-01 | 2017-09-19 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
| US20160007442A1 (en) * | 2014-07-01 | 2016-01-07 | Isola Usa Corp. | Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs |
| US10307989B2 (en) | 2014-07-01 | 2019-06-04 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
| CN104703405A (en) * | 2015-03-13 | 2015-06-10 | 广州杰赛科技股份有限公司 | Rigidity-flexibility combined slab and manufacturing method thereof |
| KR20180005300A (en) * | 2016-07-05 | 2018-01-16 | 주식회사 우영 | Manufacturing Method of Rigid-Flexible Multi-Layer Printed Circuit Board |
| KR20180025345A (en) * | 2016-08-29 | 2018-03-09 | 주식회사 코리아써키트 | Rigid flexible circuit board manufacturing method |
| CN106793582A (en) * | 2016-11-25 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of preparation method of rigid-flex combined board |
| CN106686896A (en) * | 2017-01-19 | 2017-05-17 | 广州美维电子有限公司 | Preparation method of ladder board and ladder board obtained through method |
| CN106961809A (en) * | 2017-04-06 | 2017-07-18 | 台山市精诚达电路有限公司 | A kind of preparation method of Rigid Flex |
| CN110602882A (en) * | 2019-10-25 | 2019-12-20 | 珠海杰赛科技有限公司 | Blind slot printed circuit board and processing method thereof |
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