JPH0362591A - Manufacture of rigid-flexible compound multilayer printed wiring board - Google Patents
Manufacture of rigid-flexible compound multilayer printed wiring boardInfo
- Publication number
- JPH0362591A JPH0362591A JP1197866A JP19786689A JPH0362591A JP H0362591 A JPH0362591 A JP H0362591A JP 1197866 A JP1197866 A JP 1197866A JP 19786689 A JP19786689 A JP 19786689A JP H0362591 A JPH0362591 A JP H0362591A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible
- sheet
- rigid
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 150000001875 compounds Chemical class 0.000 title abstract description 3
- 125000006850 spacer group Chemical group 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 239000011889 copper foil Substances 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 241000238413 Octopus Species 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- -1 benzyl dimethyl ketal Chemical compound 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
く技術分野〉
本発明はりジッド−フレキシブル複合多層プリント配線
板の製法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method for manufacturing a rigid-flexible composite multilayer printed wiring board.
〈従来技術〉
従来、リジッド−フレキシブル複合プリント配線板はフ
レキシブル配線基板を完成させてからリジッド配線基板
に位置合せし、接着させて作られていた。従ってフレキ
シブル配線基板とリジッド配線基板とを必要とした。ま
た部品実装にはリジッド配線基板の実装材は使用でき々
い欠点がある。<Prior Art> Conventionally, a rigid-flexible composite printed wiring board has been made by completing a flexible wiring board, aligning it with a rigid wiring board, and bonding the board. Therefore, a flexible wiring board and a rigid wiring board were required. Another disadvantage is that mounting materials for rigid wiring boards cannot be used for component mounting.
また、この他に７レキシプル配線基板にスペーサーを裏
打ちして実装に対応する製法も検討されているが、スペ
ーサーをパンチング加工したものであるため、パンチン
グ加工時の基板の屑の発生により不良の原因になってい
た。ｌたこの場合、スペーサーをテープで固定する必要
があり作業工数が多くなる欠点があった。In addition, a manufacturing method is being considered in which a 7-lexiple wiring board is lined with spacers for mounting, but since the spacers are punched, the generation of board debris during the punching process may cause defects. It had become. In the case of an octopus, it is necessary to fix the spacer with tape, which has the drawback of increasing the number of man-hours.
〈発明の目的〉
本発明は叙上の事情に鑑み検討された結果なされたもの
であって、高品質なりジッド−フレキシブル複合多層プ
リント配線板を作業能率よく生産できる製法を提供する
ものである。<Objective of the Invention> The present invention was developed as a result of studies in view of the above circumstances, and it is an object of the present invention to provide a manufacturing method that can efficiently produce a high quality JID-flexible composite multilayer printed wiring board.
〈発明の開示〉
本発明の要旨は前記の通りであり、以下詳細に説明する
。第１図〜第４図は本発明になるリジ、ノド−フレキシ
ブル複合多層プリント配線板の製法本発明に々るリジッ
ド−フレキシブル複合多層プリント配線板を底形するに
当っては、内層回路（６）の形成された内層配線板（４
）の上下にガ２スクロスーエボキシ樹脂系のプリプレグ
（３］を重ね、その上下に７し今シブル銅張シート（１
）、銅箔（５）を配置したのち熱圧成形して成形板（７
）を得る。<Disclosure of the Invention> The gist of the present invention is as described above, and will be explained in detail below. Figures 1 to 4 show a method for manufacturing a rigid-node-flexible composite multilayer printed wiring board according to the present invention. ) formed on the inner layer wiring board (4
) are layered with gas-cross-epoxy resin prepreg (3), and above and below is a copper-clad sheet (1)
), after placing the copper foil (5), heat-pressing is performed to form a molded plate (7).
).
＃７レキシブル銅張シート（１）はポリイミド樹脂シー
） （ｌｂ）に銅箔（１ａ）が積層されたものて、その
裏面の適所にはエポキシアクリレート樹脂５０重量部、
トリメチロールプロパントリアクリレート５０重量部及
びベンジルジメチルケタール１重量部が配合された剥離
性樹脂組成物が塗工されたのち、紫外線照射によシ硬化
した剥離性部分（２）が設けられている。該剥ＩＩＩＩ
性部分（２）は該成形板（７）に成形板、誼ボリイズド
樹脂シー） （ｌｂ）との界面で０．１〜ｏ、 ｓ ＆
９／ａＩＩの剥離強度を持ち、駁プリプレグ（３）に対
し良好な密着性を持つものである。#7 Flexible copper-clad sheet (1) is a polyimide resin sheet (lb) with copper foil (1a) laminated, and 50 parts by weight of epoxy acrylate resin is placed on the back side of the sheet (1a).
After a releasable resin composition containing 50 parts by weight of trimethylolpropane triacrylate and 1 part by weight of benzyl dimethyl ketal is applied, a releasable portion (2) is provided which is cured by ultraviolet irradiation. The peeling III
The elastic part (2) is attached to the molded plate (7) at an interface between the molded plate and the volized resin sheet (lb).
It has a peel strength of 9/aII and has good adhesion to the 駁 prepreg (3).
該成形板（７）には次いで大明け、スルホールメッキ、
外層回路等が施され、次いでソルダーレジスト（８）が
コートされるとともに該剥離性部分（２）の周辺にかい
てルータ−加工により切欠溝αｑが設けられてスペーサ
一部分αＤが形成される。更にスルホール（２）等に電
子部品０が実装されるとともに、該スペーサ一部分０か
剥離されリジクドー７レキシブル複合多層プリント配線
板（１）に仕上げられる。The molded plate (7) was then plated with through-hole plating,
An outer layer circuit, etc. is applied, and then a solder resist (8) is coated, and notch grooves αq are provided around the peelable portion (2) by router machining to form a spacer portion αD. Further, electronic components 0 are mounted in the through holes (2) and the like, and a portion of the spacer 0 is peeled off to form a Rigid-7 flexible composite multilayer printed wiring board (1).
前記実施例では回路形成された内層配線板が１枚のみで
あったが、本発明の製法にかいては複数枚の内層配線板
が使用され九夛、回路形成された多層配線板にフレキシ
ブル銅張シート又はフレキシブル回路シートμ積層され
てもよい。In the above embodiment, there was only one inner layer wiring board on which a circuit was formed, but in the manufacturing method of the present invention, a plurality of inner layer wiring boards were used. A stretched sheet or a flexible circuit sheet μ may be laminated.
外層に配置される７レキシプル銅張シート又は片面もし
くは両面に回路形成されるフレキシブル回路シートの基
材に使用されるｐ）には各種繊維から作られた紙、不織
布等の基材に可撓性Ｏある合成樹脂が処理されたものや
、前記の如くポリイミド樹脂シート等のフレキシブルな
合成樹脂シートが単体で使用される。p) Used as a base material for a 7-lexiple copper-clad sheet placed on the outer layer or a flexible circuit sheet with circuits formed on one or both sides, flexible base materials such as paper and nonwoven fabric made from various fibers are used. A synthetic resin sheet treated with a certain synthetic resin or a flexible synthetic resin sheet such as a polyimide resin sheet as described above is used alone.
剥離性部分とはフレキシブル銅張シート、フレキシブル
回路シートの基材シートもしくは硬化したプリプレグ表
面又は樹脂層の表面と剥離強度ｏ、 １〜ｏ、 ｓ ＃
／ｃＭ剥離するものが適合する。０．１〜／傷以下では
スペーサ一部分の保持力に欠け、実装工程においてスペ
ーサ一部分が脱離するため不適当であり、逆に剥離強度
がｏ、 ｓ ｋｇ７ｅｓ以上ではスペーサ一部分の剥離
性が劣υ、作業性が劣ったり、製品不良の原因になるな
ど好１しくない。A peelable part is a flexible copper clad sheet, a base sheet of a flexible circuit sheet, a cured prepreg surface, or a resin layer surface and a peel strength of o, 1 to o, s #
/cM peeling is suitable. If the peel strength is less than 0.1~/scratch, the holding force for part of the spacer will be lacking, and part of the spacer will come off during the mounting process, making it unsuitable.On the other hand, if the peel strength is more than 7 es, the peelability of part of the spacer will be poor. This is not desirable as it may lead to poor workability or cause product defects.
当範囲の剥離強度を実現する手段として、樹脂配合物中
に内部離型剤を混入、調節する方法、被着体と組成物と
の接着適性を対比選定し、調節する方法等がある。As means for achieving the peel strength within this range, there are methods such as mixing and adjusting an internal mold release agent into the resin compound, and comparing and selecting the adhesion suitability between the adherend and the composition.
なお骸剥離性部分を形成する剥離性樹脂組成物ハ液状、
ペースト状又はシート状で７レキシプル銅張シート、フ
レキシブル回路シートの裏面に付着され、前記の如く紫
外線照射又は加熱によう（半）ゲル状態とされ熱圧時に
流動化したシ、グリプレグ輿脂層の成分と相溶しない性
状で好筐しくはプリプレグ又は樹脂層と密着する剥離性
部分とされる０なシ剥離性樹脂組威物は各種の繊維から
作られた紙、不織布等の多孔質な基材に塗布もしくは含
浸され前記と同様な方法で（半）グル状態とされて剥離
性部分とされてもよい。Note that the releasable resin composition forming the removable part is liquid;
It is attached in paste or sheet form to the back side of a 7lexipulus copper-clad sheet or flexible circuit sheet, and is made into a (semi-)gel state by ultraviolet irradiation or heating as described above, and becomes fluidized by hot pressing. A removable resin composition is a porous base such as paper or nonwoven fabric made from various fibers, and is considered to be a removable part that is in close contact with the casing or prepreg or resin layer because of its properties that are incompatible with other components. The material may be coated or impregnated into a (semi-) glued state in the same manner as described above to form a releasable part.
プリプレグにはパルプ、ガクス繊維等各種繊維から作ら
れた紙、不織布等の多孔質な基材にエポキシ樹脂、不飽
和ポリエステル樹脂等の＃硬化性樹脂が含浸処理されて
半硬化状態とされたもの−よシート状で配置使用される
。樹脂層はエポキシ樹脂、不飽和ポリエステル樹脂等の
熱硬化性樹脂、もしくはナイロン樹脂、ポリエステル樹
脂等の熱可塑性樹脂が液状又はシート状で塗布もしくは
配置されて使用される。Prepreg is a porous base material such as paper or nonwoven fabric made from various fibers such as pulp or gax fiber, which is impregnated with #curable resin such as epoxy resin or unsaturated polyester resin to a semi-cured state. - Used in sheet form. For the resin layer, a thermosetting resin such as an epoxy resin or an unsaturated polyester resin, or a thermoplastic resin such as a nylon resin or a polyester resin is applied or arranged in liquid or sheet form.
第１図は積層の構成状態の１例であって、積層の構成状
態には７し今シプル銅張シート又はフレキシブル回路シ
ートが片側の外層に使用され、他方の外層に銅張積層板
が配置されて積層成形され第４図と同様に片側からスペ
ーサ一部分が設けられる例、あるいは７レキシプル銅張
シート又はフレキシブル回路シートが両側の外層に配置
されて積層成形され、両側からスペーサ一部分が設けら
れる例がある。Figure 1 shows an example of a laminated structure in which a 7-inch copper-clad sheet or flexible circuit sheet is used as one outer layer, and a copper-clad laminate is placed on the other outer layer. An example in which a part of the spacer is provided from one side as shown in FIG. 4, or an example in which a 7-lexiple copper-clad sheet or a flexible circuit sheet is placed as the outer layer on both sides and is laminated and molded, and a part of the spacer is provided from both sides. There is.
回路形成、ソルダーレジストのコー）＆ らびにルータ
−加工等の作業工程については公知の技術の方法が採用
される。For work steps such as circuit formation, solder resist coating, and router processing, known techniques are employed.
１＞ルータ−加工による切欠溝ならびにスペーサ一部分
の形状等については第５図の如く横断的に設けられる形
状、第６図の如く、一端又は両端本発明になるリジッド
−フレキシブル複合多層プリント配線板の製法にかいて
は、内層配線板等にプリプレグ等を介し、裏面適所に剥
離性部分を形成させたフレキシブル銅張シート又はフレ
キシブル回路シートを重ね成形した成形板に回路形成、
ソルダーレジストのコート、ルータ−加土によるスペー
サ一部分の形成を経て適宜電子部品の実装を行い、その
後、スペーサ一部分を剥離する工程を採用するものであ
るため、通常のリジッド配線レジストのコート後である
ことから、従来の製法に比較して作業工程を簡略化でき
、著しく生産能率を向上させること水でき８貿向上に役
立つものである。同時に工程の簡略化にともない信頼性
の高い製品が得られる。1> Regarding the shape of the cutout groove and part of the spacer by router processing, as shown in FIG. 5, the shape is provided transversely, and as shown in FIG. Regarding the manufacturing method, a circuit is formed on a molded board by overlapping a flexible copper-clad sheet or a flexible circuit sheet with a removable part formed on the back side at the appropriate place via prepreg etc. on an inner layer wiring board, etc.
The process involves coating a solder resist, forming a portion of the spacer using router-adding soil, mounting electronic components as appropriate, and then peeling off a portion of the spacer, which is done after coating with a normal rigid wiring resist. Therefore, compared to conventional manufacturing methods, the work process can be simplified, significantly improving production efficiency, and helping to improve trade. At the same time, a highly reliable product can be obtained by simplifying the process.
４、図面ｏｍｍなａｑ
第１図は回路形成された内層配線板（４）の上下にプリ
プレグ（３）、該プリプレグ（３）の上下に離型性部分
（２）の形成されたフレキシブル銅張シート（１）及び
銅箔（５）を配置した状態−１第２図は第１図の如く配
置されたものを熱圧成形した成形板（７）の部分断面図
、第３図は＃成形板（７）に回路形成、ルータ−加工に
よる切欠溝００及びスペーサ一部分０の形成ならびにソ
ルダーレジスト（８）のコートが施された状態の部分断
面図、第４図はスペーサ一部分αＤが剥離されてフレキ
シブル配線板部分な１）とリジッド配線板部分＠とか形
成されたりジッド−７し今シプル複合多層プリント配線
板（ホ）の部分断面図、第５図、第６図は切欠溝、スペ
ーサ一部分の形成された成形板（至）、ＱｌＳの裏面状
態図である。4. Drawing omm aq Figure 1 shows a flexible copper clad fabric with prepreg (3) above and below an inner layer wiring board (4) on which a circuit is formed, and a releasable part (2) formed above and below the prepreg (3). State in which the sheet (1) and copper foil (5) are arranged - 1 Figure 2 is a partial cross-sectional view of the molded plate (7) formed by hot pressure forming with the sheet (1) and copper foil (5) arranged as shown in Figure 1, and Figure 3 is a # molding. FIG. 4 is a partial cross-sectional view of the plate (7) after circuit formation, notch grooves 00 and spacer portion 0 are formed by router processing, and solder resist (8) is coated. FIG. 4 shows the spacer portion αD peeled off. The flexible wiring board part 1) and the rigid wiring board part @ are formed, and Figures 5 and 6 are partial cross-sectional views of the composite multilayer printed wiring board (e), which shows the notch groove and part of the spacer. It is a back side state diagram of the formed molded plate (to) QIS.
１・・・フレキシブル銅張シート
２・・・離型性部分 ３・・・プリプレグ４・・
・内層配線板 ５・・・銅箔６・・・内層回路
７ 、１５ 、１８・・・成形板８・・・ソル
ダーレジスト ９・・・外層回路１０ 、１４ 、１７
・・・切欠溝
１１ 、１６ 、１９・・・スペーサ一部分１２・・・
スルホール １３・・・電子部品２０・・・リジ
ッド−７レキシプル複合多眉プリント配線板
２１・・・フレキシブル配線板部分
２２・・・リジッド配線板部分1...Flexible copper-clad sheet 2...Mold release part 3...Prepreg 4...
・Inner layer wiring board 5...Copper foil 6...Inner layer circuit
7, 15, 18...Molded plate 8...Solder resist 9...Outer layer circuit 10, 14, 17
...Notch grooves 11, 16, 19...Spacer part 12...
Through hole 13...Electronic component 20...Rigid-7 Lexiple composite multi-eye printed wiring board 21...Flexible wiring board portion 22...Rigid wiring board portion
Claims (1)
ート又は片面もしくは両面に回路形成されたフレキシブ
ル回路シートの裏面の適所に剥離性部分を形成させたも
のを回路形成した１枚又は複数枚の内層配線板もしくは
多層配線板にプリプレグ又は樹脂層を介し積層し、熱圧
成形したのち穴明け、スルホールメッキ、回路形成なら
びにソルダーレジストのコート等を施し、次いで該剥離
性部分においてルーター加工等によりスペーサー部分を
設けたのち、該スペーサー部分を剥離することを特徴と
するリジッド−フレキシブル複合多層プリント配線板の
製法A flexible copper-clad sheet arranged on at least one outer layer, or a flexible circuit sheet with a circuit formed on one or both sides, with a removable portion formed at an appropriate position on the back side of the flexible circuit sheet, and one or more inner layer wirings on which a circuit is formed. It is laminated onto a board or multilayer wiring board via a prepreg or resin layer, hot-press molded, and then subjected to drilling, through-hole plating, circuit formation, and coating with solder resist.Then, the spacer part is formed in the removable part by router processing, etc. A method for manufacturing a rigid-flexible composite multilayer printed wiring board, characterized in that the spacer portion is peeled off after being provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1197866A JPH0362591A (en) | 1989-07-28 | 1989-07-28 | Manufacture of rigid-flexible compound multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1197866A JPH0362591A (en) | 1989-07-28 | 1989-07-28 | Manufacture of rigid-flexible compound multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0362591A true JPH0362591A (en) | 1991-03-18 |
Family
ID=16381637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1197866A Pending JPH0362591A (en) | 1989-07-28 | 1989-07-28 | Manufacture of rigid-flexible compound multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0362591A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
| KR20020040188A (en) * | 2000-11-23 | 2002-05-30 | 김영학 | Rapid Washing Dry System |
| KR100471048B1 (en) * | 2002-02-16 | 2005-02-23 | 정인근 | Tent for drying laundry |
| KR100651423B1 (en) * | 2004-11-10 | 2006-11-29 | 삼성전기주식회사 | Method for manufacturing a multi-layer printed circuit board |
| US20160007442A1 (en) * | 2014-07-01 | 2016-01-07 | Isola Usa Corp. | Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs |
-
1989
- 1989-07-28 JP JP1197866A patent/JPH0362591A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
| KR20020040188A (en) * | 2000-11-23 | 2002-05-30 | 김영학 | Rapid Washing Dry System |
| KR100471048B1 (en) * | 2002-02-16 | 2005-02-23 | 정인근 | Tent for drying laundry |
| KR100651423B1 (en) * | 2004-11-10 | 2006-11-29 | 삼성전기주식회사 | Method for manufacturing a multi-layer printed circuit board |
| US20160007442A1 (en) * | 2014-07-01 | 2016-01-07 | Isola Usa Corp. | Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs |
| US9764532B2 (en) * | 2014-07-01 | 2017-09-19 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
| US10307989B2 (en) | 2014-07-01 | 2019-06-04 | Isola Usa Corp. | Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs |
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