JPH03143809A - Method and device for transfer of electronic product in magazine - Google Patents

Abstract

PURPOSE:To transfer electronic parts smoothly in a device for transferring electronic parts for semiconductor devices in a hollow rod-like magazine by inserting a protruding part of a sectionally protruding chute into a groove part of the magazine, and transferring the work by transmitting vibration of a linear advance feeder to it through the protruding part. CONSTITUTION:A protruding part 9 of a sectionally protruding chute 2 is inserted into a groove part 7 of a magazine 1 to get in contact with the bottom part of an IC product 3 contained in the magazine 1 through a ceramic coating 10. The chute 2 is vibrated by a linear advance parts feeder 5. This vibration is transmitted through the ceramic coating 10 for preventing abration on the protruding part 9 of the chute 2 to the IC product 3, thereby the IC product 3 is transferred.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transfer method for transferring electronic products such as semiconductor devices in a hollow rod-shaped magazine, and a transfer device therefor.

[Conventional technology]

In the manufacturing and assembly process of surface-mounted ICs (semiconductor integrated circuit devices), and in each post-assembly process, IC products that are sealed in a resin molded package and have multiple leads bent on the sides are placed inside a hollow rod-shaped magazine. It is common practice to store, store, and transport a large number of items. This hollow rod-shaped magazine is an elongated case l with a cross-sectional opening having a groove 7 at the bottom as shown in Fig. 5, and is also called a stain magazine, and there are ζ- magazines in it as shown in Figs. 3 and 4. As shown in FIG. 6, about 27 to 35 surface-mount type products 3 such as C (product 3) are stored side by side with the lead mounting side facing upward.

When taking out IC products from this hollow rod-shaped magazine or storing them in the magazine, the conventional method is to tilt the magazine and utilize the falling phenomenon of its own weight, or by moving a movable member inserted into the magazine back and forth. A forced transfer method was used to move IC products through direct contact.

[Problem to be solved by the invention]

In the above-mentioned conventional technology, in the case of the inclined transfer method, I
Contact or collision between the leads and pan cages on the C side, or in the case of a forced transfer method, contact with movable parts may cause deformation or damage to the leads or pan cage, so sufficient consideration must be given to this point. Not yet.

Further, when using the inclined transfer method, IC products often get jammed (JAM phenomenon) due to wear of the chute, which causes a problem in that the transfer work is stagnant.

The present invention is intended to solve the above-mentioned problems, and provides a transfer method and a transfer device that can automatically transfer electronic products such as ICs in a hollow rod-shaped magazine without damage (product clogging). It is intended for the purpose of providing.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a method for horizontally transferring electronic products in a hollow rod-shaped magazine, in which a convex part of a chute with a convex cross section is inserted into the magazine through a groove in the magazine, and a linear parts feeder is used. By transmitting the vibrations from above to the electronic components on the convex part through the chute,
It is characterized by transporting electronic products along the inside of the magazine.

The present invention also provides a transfer device for transferring electronic products in a hollow rod-shaped magazine with a cross-sectional opening, comprising: a chute having a convex cross-section to be inserted into a groove of the magazine; and a linear parts feeder directly connected to the chute. and a fixing means for fixing the chute to the magazine, further comprising a ceramic coating formed by thermal spraying or the like on the surface of the convex portion of the chute.

[Effect]

In the method for transferring electronic products according to the present invention, the convex part of the chute with a convex cross section is inserted through the groove of the magazine, and the electronic products placed thereon are transferred using a linear parts feeder. It is possible to transfer electronic products in a stable state without tilting them (electronic products do not get damaged due to bumping into each other or contacting movable parts from the outside, there is no friction with magazines (no product jams), As a result, automatic transport is also possible and the above objective can be achieved.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing the overall structure of a transfer device for storing and transferring surface-mounted IC products in a stick magazine, and FIG. 2 is a side view.

2 is a stick magazine, and as shown in FIG. 5, a groove 7 is provided along the longitudinal direction on the lower side of the magazine case l, which is a hollow bar with an opening-shaped cross section.

3 is a surface mount type RC type product.The IC is built into a resin molded package, and the leads 8 protruding from the side of the package are bent inward in a 3-shape, and the leads are brought into contact with the wiring on the wiring board for surface mounting. It is now possible to do so.

Reference numeral 2 denotes a product transfer chute, which corresponds to a stick magazine and is slightly longer in size than the stick magazine.As shown in FIG. 7, a convex portion 9 is provided along the upper surface of the chute. The upper surface of the convex portion is a portion on which an IC product is placed and moved. In order to prevent friction and wear between the tC product and the chute surface, a thin ceramic coating 11*10 is formed by means such as ceramic spraying.

The convex portion 9 of the chute is inserted into the magazine through the groove 7 of the magazine, and the IC product is placed inside with only a portion floating above the surface of the magazine, as shown in FIG.

Reference numeral 4 denotes a chuck claw for fixing the magazine, which has a mechanism that can be mechanically opened and closed on the left and right sides, and is adapted to fix the magazine to the chute or support member 6.

Reference numeral 5 denotes a linear parts feeder that supports the chute via a support member, transmits its own vibration to the chute, and has the function of transporting TCW products placed on the chute in a fixed direction by vibration.

Therefore, when the straight parts feeder operates, the IC products are transported along the protrusion of the chute within the magazine without coming into contact with each other or receiving any impact, regardless of whether the chute is horizontal or has a certain degree of inclination. Regardless of the situation, the product can be transferred in a stable state without clogging, and products can be automatically taken out and stored from the magazine.

〔Effect of the invention〕

According to the present invention described above, the following effects are achieved.

Since IC products, leads, and buff cages in the stain magazine can be automatically fed one by one without being damaged, product yield can be expected to improve.

FIG. 3 is a partial cross-sectional view of the engine and IC product transfer device.

FIG. 2 is also a partially sectional side view.

FIG. 3 is a plan view of the area-fabric device C product, and FIG. 4 is a front view thereof.

FIG. 5 is a perspective view of the stick magazine.

FIG. 6 is a sectional view showing a conventional method for transferring IC products within a magazine.

FIG. 7 is a cross-sectional and oblique view of the chute in the IC product transfer device according to the present invention.

1... Stick magazine, 2... Shoot,
3... IC product, 4... Chuck claw for fixing the magazine, 5... Straight-advance type parts feeder 6... Support member, 7... Groove, 8... Lead, 9... Convex part , 10... Ceramic 7-ri coating.

[Brief explanation of the drawing]

Claims (1)

[Claims] 1. A method for transferring electronic products in a hollow rod-shaped magazine, in which a convex part of a chute with a convex cross section is inserted into the magazine through a groove in the magazine, and vibrations from a linear parts feeder are removed. A method for transferring an electronic product within a magazine, characterized in that the electronic product is transferred along the inside of the magazine by transmitting information to the electronic component on the convex portion through the chute. 2. A transfer device for transferring electronic products in a hollow rod-shaped magazine with a cross section of ■ shape, which includes a chute having a convex cross section to be inserted into a groove of the magazine, a linear parts feeder directly connected to the chute, and and fixing means for fixing the chute to the magazine. 3. The electronic product transfer device according to claim 1,
A ceramic coating is formed on the surface of the convex part of the shoot.