JPH03145794A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH03145794A JPH03145794A JP1284342A JP28434289A JPH03145794A JP H03145794 A JPH03145794 A JP H03145794A JP 1284342 A JP1284342 A JP 1284342A JP 28434289 A JP28434289 A JP 28434289A JP H03145794 A JPH03145794 A JP H03145794A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- semiconductor element
- resin
- flexible wiring
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、半導体装置の改良に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in semiconductor devices.
（従来の技術）
従来半導体装置をプリント配線板に接続するには半田付
けによる方法が最も一般的である。(Prior Art) Conventionally, the most common method for connecting a semiconductor device to a printed wiring board is soldering.
この−例として半導体装置の外形及び外部接続端子数に
一致するソケットを前取てプリント配線板に半田付けし
ておき、このソケットに半導体装置を差し込む方法があ
る。As an example of this, there is a method in which a socket matching the external shape and number of external connection terminals of the semiconductor device is soldered to the printed wiring board in advance, and the semiconductor device is inserted into this socket.
（発明が解決しようとする課題）
しかしながら上記の方法では、外部接続端子数が増加し
た場合、端子間の間隔が狭くなシ、端子間のショート、
絶縁不良、接続部でのクラック等が発生し易く、高度な
半田接続技術が必要であるという欠点がある。(Problem to be Solved by the Invention) However, in the above method, when the number of external connection terminals increases, the intervals between the terminals are narrow, short circuits between the terminals,
The drawbacks are that poor insulation, cracks, etc. are likely to occur at the connection, and that advanced solder connection technology is required.
本発明は上記のような欠点のない半導体装置の製造法、
詳しくは半導体素子を備えたフレキシブル配線板とプリ
ント配線板とを接続した半導体装置の製造法を提供する
ことを目的とするものである。The present invention provides a method for manufacturing a semiconductor device that does not have the above-mentioned drawbacks,
Specifically, it is an object of the present invention to provide a method for manufacturing a semiconductor device in which a flexible wiring board provided with a semiconductor element and a printed wiring board are connected.
（課題を解決するための手段）
本発明は下部のほぼ中央部に凹部を、また中央部を除い
た部分に複数の突起を設けた樹脂固形物を成形後、ワイ
ヤーボンディング部及び外部接続端子を設けたフレキシ
ブル配線板を該外部接続端子が該樹脂固形物の突起の下
部に位置するよう圧して樹脂固形物の下面に接着し、つ
いで該樹脂固形物の下部のほぼ中央部に半導体素子を接
着した後半導体素子とワイヤーボンディング部間をワイ
ヤーで接続し、ついでその周辺を合成樹脂で封止し、さ
らに特定方向にのみ導電性を有する物質を介してフレキ
シブル配線板とプリント配線板とを接続する半導体装置
の製造法に関する。(Means for Solving the Problems) The present invention provides wire bonding portions and external connection terminals after molding a resin solid material having a recessed portion approximately in the center of the lower part and a plurality of protrusions in the portion excluding the center portion. The provided flexible wiring board is adhered to the lower surface of the resin solid body by pressing so that the external connection terminal is located at the lower part of the protrusion of the resin solid body, and then the semiconductor element is adhered to approximately the center of the lower part of the resin solid body. After that, the semiconductor element and the wire bonding part are connected with a wire, the surrounding area is then sealed with synthetic resin, and the flexible wiring board and the printed wiring board are connected through a substance that is conductive only in a specific direction. This invention relates to a method for manufacturing a semiconductor device.
本発明において樹脂固形物に用いられる樹脂としては、
エポキシ樹脂、ポリイミド樹脂、シリコーン変性エポキ
シ樹脂、ポリエステル樹脂、ポリアミド樹脂等が用いら
れる。The resin used for the resin solid in the present invention includes:
Epoxy resins, polyimide resins, silicone-modified epoxy resins, polyester resins, polyamide resins, etc. are used.
半導体素子を封止するための合成樹脂としては。As a synthetic resin for sealing semiconductor elements.
エポキシ樹脂、シリコーン樹脂等が用いられる。Epoxy resin, silicone resin, etc. are used.
樹脂固形物とフレキシブル配線板との接着は。Adhesion between solid resin and flexible wiring board.
エポキシ樹脂、フェノール樹脂等の熱硬化性樹脂・を用
いて接着することが好ましい。It is preferable to bond using a thermosetting resin such as an epoxy resin or a phenol resin.
樹脂固形物と半導体素子との接着は、エポキシ樹脂、シ
リコーンゴム等で接着することが好ましい。The resin solid material and the semiconductor element are preferably bonded together using epoxy resin, silicone rubber, or the like.
半導体素子とワイヤーボンディング部間を接続するワイ
ヤーは、金ワイヤ−アルミニウムワイヤーを用いること
が好ましい。It is preferable to use a gold wire-aluminum wire as the wire connecting the semiconductor element and the wire bonding part.
フレキシブル配線板の材質としては、ポリエステル樹脂
フィルム、ポリイミド樹脂フィルム、ポリアミド樹脂フ
ィルム等を用いることが好ましい。As the material of the flexible wiring board, it is preferable to use a polyester resin film, a polyimide resin film, a polyamide resin film, or the like.
特定方向にのみ導電性を有する物質としては。As a substance that has conductivity only in a specific direction.
異方導電フィルム、例えば日立化成工業社製の商標名ア
ニソルムが用いられる。An anisotropic conductive film, for example, Anisolm (trade name) manufactured by Hitachi Chemical Co., Ltd., is used.
本発明においては、必要に応じフレキシブル配線板の上
面に配線パターンが形成される。In the present invention, a wiring pattern is formed on the upper surface of the flexible wiring board as necessary.
（実施例） 以下本発明の実施例を１ｇ８Ａする。(Example) Examples of the present invention will be described below with reference to 1g8A.
実施例１
エポキシ樹脂（日立化成工業社製、商品名ＣＥＬ−３６
００Ｋ）を成形金型に注入し、加熱して硬化させた後成
形金型から取シ出して第１図に示すような外形寸法が４
４Ｘ４４ｍｍで、その下部のほぼ中央部に凹部１１を形
成し。また凹部１１を除いた部分にＺ５４ｍｍ間隔に高
さが０．６閣の半球状の突起工２を形成したエポキシ樹
脂成形体（樹脂固形物）１を得た。Example 1 Epoxy resin (manufactured by Hitachi Chemical Co., Ltd., trade name CEL-36
00K) is injected into a mold, heated and cured, and then taken out from the mold and has an external dimension of 4 as shown in Figure 1.
4 x 44 mm, with a recess 11 formed approximately in the center of its lower part. Further, an epoxy resin molded body (resin solid body) 1 was obtained in which hemispherical protrusions 2 having a height of 0.6 mm were formed at intervals of Z54 mm in a portion excluding the recessed portions 11.
一方ポリイミド樹脂フィルム（日立化成工業社製）の両
面に銅箔を張り合わせ、ついでエツチング加工して第２
図に示すように上面に配線パターン３を形成し、下面に
はエツチング加工後６±４μｍの厚さにニッケルめっき
を、さらにその表面Ｖｃａ±２μｍの厚さに金めつきを
施してワイヤーボンディング部４及び外部接続端子５を
形成したフレキシブル配線板２を得た。On the other hand, copper foil was laminated on both sides of a polyimide resin film (manufactured by Hitachi Chemical Co., Ltd.), and then etched to form a second layer.
As shown in the figure, a wiring pattern 3 is formed on the upper surface, and the lower surface is plated with nickel to a thickness of 6±4 μm after etching, and then gold plated to a thickness of Vca±2 μm on the lower surface to form a wire bonding part. 4 and external connection terminals 5 were formed on the flexible wiring board 2.
次に第３図に示すようにフレキシブル配線板２に形成し
た外部接続端子５がエポキシ樹脂成形体１の突起１２の
下部に位置するようにセットした後９両者をフィルム状
エポキシ樹脂接着剤（日本エイプルスティック社製）を
用いて接着した。この後第４図に示すようにエポキシ樹
脂成形体ＩＫ形成した四部１１に２寸法が１０１０Ｘ１
０で厚さ一５＝
が０．５．のシリコン単結晶の片面に所望の配線パター
ンを形成した半導体素子６をシリコーンゴム組成物（信
越化学工業社製、商品名ＪＣＢ、６１１０）を用いて接
着し、さらに半導体索子６とフレキシブル配線板上のワ
イヤーボンディング４間を直径が５０μｍで珪素を１重
量％含むアルミニウムワイヤー７を超音波接合した後、
これらの周辺にエポキシ樹脂組成物（日立化成工業社製
、商品名ＣＥ０２８０）８を注入して半導体素子６を封
止した。Next, as shown in FIG. 3, the external connection terminals 5 formed on the flexible wiring board 2 are set so as to be positioned below the protrusions 12 of the epoxy resin molded body 1, and then both are bonded using a film-like epoxy resin adhesive (Japanese). (manufactured by Aple Stick Co., Ltd.) was used to adhere. After this, as shown in Fig. 4, two dimensions are 1010
0 and thickness - 5= is 0.5. A semiconductor element 6 with a desired wiring pattern formed on one side of a silicon single crystal is adhered using a silicone rubber composition (manufactured by Shin-Etsu Chemical Co., Ltd., trade name JCB, 6110), and then the semiconductor element 6 and a flexible wiring board are bonded together. After ultrasonically bonding an aluminum wire 7 having a diameter of 50 μm and containing 1% by weight of silicon between the upper wire bonding 4,
An epoxy resin composition (manufactured by Hitachi Chemical Co., Ltd., trade name CE0280) 8 was injected around these to seal the semiconductor element 6.
次に第５図に示すように粘着性の異方導電フィルム（日
立化成工業社製、商標名アニソルム）９を介してフレキ
シブル配線板２とプリント配線板１０とを接続して半導
体装置を得た。Next, as shown in FIG. 5, the flexible wiring board 2 and the printed wiring board 10 were connected via an adhesive anisotropic conductive film (manufactured by Hitachi Chemical Co., Ltd., trade name: Anisolm) 9 to obtain a semiconductor device. .
（発明の効果） 本発明の製造法によって得られる半導体装置は。(Effect of the invention) A semiconductor device obtained by the manufacturing method of the present invention.
端子間のショート、絶縁不良、接続部でのクラック等の
発生を防止することができ、工業的に極めて好適な半導
体装置である。It is possible to prevent short circuits between terminals, poor insulation, cracks at connection parts, etc., and is an industrially very suitable semiconductor device.
一
第１図、第２図、第３図及び第４図は本発明の実施例に
おける半導体装置の製造作業状態を示す断面図並びに第
５図は本発明の実施例になる半導体装置の断面図である
。
符号の説明
１・・・エポキシ樹脂成形体
２・・・フレキシブル配線板
３・・・配線パターン
４・・・ワイヤーボンディング部
５・・・外部接続端子 ６・・・半導体素子７・・
・アルミニウムワイヤー
８・・・エポキシ樹脂組成物
９・・・異方導電フィルム
１０・・・プリント配線板
一1, 2, 3, and 4 are cross-sectional views showing the manufacturing process of a semiconductor device according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view of a semiconductor device according to an embodiment of the present invention. It is. Explanation of symbols 1...Epoxy resin molded body 2...Flexible wiring board 3...Wiring pattern 4...Wire bonding portion 5...External connection terminal 6...Semiconductor element 7...
・Aluminum wire 8...Epoxy resin composition 9...Anisotropic conductive film 10...Printed wiring board 1
Claims (1)
分に複数の突起を設けた樹脂固形物を成形後，ワイヤー
ボンディング部及び外部接続端子を設けたフレキシブル
配線板を該外部接続端子が該樹脂固形物の突起の下部に
位置するようにして樹脂固形物の下面に接着し，ついで
該樹脂固形物の下部のほぼ中央部に設けた凹部に半導体
素子を接着した後半導体素子とワイヤーボンディング部
間をワイヤーで接続し，ついでその周辺を合成樹脂で封
止し，さらに特定方向にのみ導電性を有する物質を介し
てフレキシブル配線板とプリント配線板とを接続するこ
とを特徴とする半導体装置の製造法。1. After molding a solid resin material with a concave portion approximately in the center of the lower part and a plurality of protrusions in the area excluding the center portion, a flexible wiring board provided with wire bonding portions and external connection terminals is placed where the external connection terminals are located. The solid resin is bonded to the lower surface of the resin solid so as to be located at the lower part of the protrusion, and then the semiconductor element is bonded to the recess provided approximately in the center of the lower part of the solid resin, and then the semiconductor element and the wire bonding part are bonded. A semiconductor device characterized in that a flexible wiring board and a printed wiring board are connected through a wire, the periphery of which is then sealed with synthetic resin, and a substance that is conductive only in a specific direction is used to connect a flexible wiring board and a printed wiring board. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1284342A JPH03145794A (en) | 1989-10-31 | 1989-10-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1284342A JPH03145794A (en) | 1989-10-31 | 1989-10-31 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03145794A true JPH03145794A (en) | 1991-06-20 |
Family
ID=17677337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1284342A Pending JPH03145794A (en) | 1989-10-31 | 1989-10-31 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03145794A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008118056A (en) * | 2006-11-07 | 2008-05-22 | Seiko Epson Corp | Wiring board manufacturing method and electronic device |
-
1989
- 1989-10-31 JP JP1284342A patent/JPH03145794A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008118056A (en) * | 2006-11-07 | 2008-05-22 | Seiko Epson Corp | Wiring board manufacturing method and electronic device |
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