JPH03148152A - Testing method for semiconductor element - Google Patents

Abstract

PURPOSE:To unify test programs into one per product by performing the resistance measurement for derivative decision at the outset of a test so as to decide the derivative on the program. CONSTITUTION:An original film resistance R2 for deciding the kind of a derivative is made on a substrate 1, and in execution of a test program, at first the decision resistance of a product set in a tester is measured. Next, it is decided what kind of derivative the read resistance valve correspond to, and the test is executed as soon as the standard value of the derivative is incorporated in a test program, and shifting to the next product, the test is executed similarly. Hereby, there is no necessity of preparing programs according to derivatives, and the test programs can be collected into one each per product.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a test method for hybrid IO. Products with many different types of derivatives are differentiated by subnumbers printed on the circuit board. However, the same test equipment is used for the products with many different types of derivatives, and each derivative is tested by a separate test program. I was doing a test.

[Problem to be solved by the invention]

Conventional semiconductor device testing methods have been configured as described above, so if one product has many derivatives, many test programs must be prepared for that one product. The problem was that it was very time consuming and there was a high possibility of making mistakes.

The present invention was made in view of the above-mentioned problems.
An object of the present invention is to obtain a semiconductor device testing method that can unify test programs to one for each product.

[Steps to solve the problem]

The semiconductor device testing method according to the present invention focuses on the fact that each derivative product is provided with a resistance of a certain value that is completely unrelated to the timeliness of the product, in order to determine whether it is a derivative product. , the resistance to biting is measured at the beginning of the test, and the type of derivative product can be determined based on this.

[Effect]

The method for testing semiconductor devices according to the present invention includes measuring resistance to determine derivative products at the beginning of the test.
There is no need to prepare a program for each derivative product to determine whether it is a derivative product on the program, and one test program can be created for each product.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. Second
The figure is an explanatory diagram of the hybrid IC used in the present invention.
A thick film resistor R(2) for determining the type of derivative product is formed on the substrate (1). FIG. 1 is a 70-chart of a test program that is an embodiment of the present invention. In FIG. 1, when this test program is executed in step 11, for example, the determination resistance of the product set in the tester is first measured (step 12).

Next, it is determined which type of derivative product the read resistance value corresponds to (step 13). Then incorporate the specification values of the derivative into the test program (step 14)
. As soon as the above operations are completed, run the test (
Step 15). Move on to the next product and run the test from the beginning.

〔Effect of the invention〕

As described above, according to the present invention, there is no need to prepare test programs for all derivative products, and there is only one type of test program for one type of product, so test programs can be easily managed. When it comes to testing, there are fewer mistakes such as using the wrong test program.

[Brief explanation of the drawing]

FIG. 1 shows 7 of a test program showing one implementation sequence of the present invention.
0-Chart, FIG. 2 is an explanatory diagram of Hybrid E 0 tested in the present invention. In the figure, (1> is a thick film substrate of Hybrid E0, (
2) shows a thick film resistor for identification of derivative products.

Claims (1)

[Claims] A method for testing a semiconductor device, characterized in that when a hybrid IC is tested for a derivative product in which a plurality of derivative products are made to meet the purpose of use, the type of the derivative product is determined by thick film resistance measurement.