JPH03150B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a jet soldering device having features at the lower part of the nozzle.

(Prior Art) Conventionally, as shown in Japanese Utility Model Publication No. 56-41888, a rectifying grid having a solder inlet that is inclined to descend sequentially from the solder pumping side is provided in the opening at the bottom of the nozzle. This inclined rectifier grid corrects the tendency for a large amount of solder to be pumped to the opposite side of the nozzle from the solder inflow side, so that the solder surface jetted from the nozzle is horizontally uniform throughout the nozzle. I have to.

(Problems to be Solved by the Invention) Since the jet surface of the inclined rectifier grid changes depending on the angle of the inclined surface, the optimum angle of the inclined surface must be determined by trial and error during manufacturing. Since the rectifier grid is formed by combining a large number of rectifier plates in a lattice shape, it is difficult to change the angle of inclination. In the case where an adjustment mechanism that can be finely adjusted is provided, the mechanism becomes complicated, and in any case, it is currently difficult to actually obtain a uniform horizontal jet surface.

SUMMARY OF THE INVENTION The object of the present invention is to solve these conventional problems and provide a jet soldering device that can obtain a uniform horizontal jet surface through simple adjustment.

[Structure of the invention]

(Means for solving the problem) The first invention is a casing in which molten solder pumped from a pump 13 covers a lower opening 15 of a nozzle 14 in a solder bath 12 containing molten solder 11. The solder is supplied into the inside of the casing 22 from the solder inlet 24 provided on one side of the casing, and inside the casing 22, the solder is supplied at intervals so as to extend downward from the solder inlet side toward the back. A plurality of flow divider plates 25 provided through
As a result, the solder flow forced into the nozzle 14 is rectified, and the molten solder jetted from the upper opening 16 of the nozzle 14 causes a jet to solder the workpiece 17 conveyed above the nozzle. In the type soldering apparatus, a solder outlet 3 is provided on the other side of the casing 22 opposite to the inlet 24.
2, and this solder outlet 32 is provided with a rear adjustment plate 33 or 44 for adjusting the opening area of this outlet.

In a second invention, in addition to the constituent features of the first invention, the solder inlet 24 on one side of the casing 22 is provided with a front adjusting plate 31 or 43 for adjusting the opening area of the inlet. It has been established.

(Function) In the first invention, when a large amount of flow is directed to the rear side opposite to the solder inlet 24, the opening is adjusted by the rear adjustment plate 33 or 44 in order to uniformly divide the flow. By letting the solder flow escape to the outside of the casing 22 through the solder outlet 32, the overall shunt flow balance is maintained. In this way, the solder flow rate supplied to the nozzle 14 is adjusted uniformly from one side of the nozzle to the other, so that the jet surface 18 from the nozzle 14 forms a uniform horizontal surface over the entire width of the nozzle 14. Become.

In the second invention, the flow of solder from the pump 13 is variably adjusted by using the front adjusting plate 31 or 43 to variably adjust the flow rate toward each flow dividing plate 25.

(Examples) Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings.

As shown in FIG. 1, molten solder is pumped into a lower opening 15 of a nozzle 14 by a pump 13 in a solder bath 12 containing molten solder 11.
The molten solder jetted from the upper opening 16 of the nozzle 14 solders the work 17 (printed wiring board and mounted components) conveyed on the nozzle 14 . This work 17 is conveyed in a direction perpendicular to the plane of the first drawing. Said pump 1
3, a vane provided inside the pump body 13a and rotated by the motor 13b is connected to the pump body 1.
Suction of molten solder from the lower suction port 13c of 3a,
It is a centrifugal pump that discharges from the peripheral surface.

Since the jet surface 18 from the nozzle 14 tends to be higher on the opposite side than on the pump 13 side, in order to correct this, a casing 22 is provided on the lower surface of the flange portion 21 of the nozzle 14 to receive the supply of molten solder. It is attached via the flange portion 23 and is disposed inside the casing 22 at intervals so as to extend downward from the solder inlet 24 on one side of the casing 22 as it goes deeper. A large number of flow divider plates 25 are attached. When each of the flow divider plates 25 is optimally adjusted, it has the function of making the flow of solder supplied into the nozzle 14 uniform and keeping the jet surface 18 horizontal. It is difficult to adjust.

Therefore, a front adjusting plate 31 is provided at the solder inlet 24 on one side of the casing 22 to adjust the opening area of the inlet 24, and a solder flow is provided on the other side of the casing 22 opposite to the inlet 24. An outlet 32 is provided, and a rear adjustment plate 33 for adjusting the opening area of the solder outlet 32 is provided at the solder outlet 32 .

The front adjusting plate 31 has the flange portions 21 and 23
The rear adjustment plate 33 is vertically adjusted by an adjustment screw 34 provided on the flange portion 2.
The vertical movement is adjusted by adjustment screws 35 provided at 1 and 23. The adjusting screws 34, 35 are screwed into the flange portions 21, 23, and are fixed relative to the adjusting plates 31, 33 by stop rings (not shown) fitted to the lower portions of the screws 34, 35. Adjustment plate 3 to prevent it from moving in the axial direction.
It is loosely fitted into the upper parts 31a and 33a of Nos. 1 and 33 so as to be freely rotatable. Therefore, this adjustment screw 34,3
5, the adjustment plates 31 and 33 are moved up and down along a guide (not shown) in accordance with the direction of rotation.

Next, to explain the function of the adjustment plates 31 and 33, each flow divider plate 25 is not adjusted, but the flow of solder from the pump 13 is adjusted by the front adjustment plate 31, so that the flow rate toward each flow divider plate 25 is adjusted. variably adjusted. This front adjusting plate 31 is provided at the solder inlet 24 because the closer the flow divider plate 25a is to the inlet 24, the more the deviation in its length will affect the jet surface. Closer flow divider plate 2
This is because it is preferable to provide the front adjustment plate 31 at the solder inflow port 24 in order to effectively correct the deviation in the length of the solder inlet 5a.

Furthermore, adjustment of the front side adjustment plate 31 alone is not enough.
Since there are cases where a large amount of flow is directed to the rear side opposite to the solder inlet 24, in order to evenly divide the flow even in such a case, the opening of the solder outlet 32 is adjusted by the rear adjusting plate 33. By allowing the solder flow to escape, the overall shunt flow balance is maintained. In particular, the solder outlet 32 whose opening area is adjusted by the rear adjusting plate 33 allows the flow 11a rising toward the nozzle behind the last flow dividing plate 25b to have the same flow as the flow 11b on the front side. This provides relief and prevents the solder surface from bulging at the rear of the nozzle 14.

In this way, the flow rate of solder supplied to the nozzle 14 is adjusted uniformly from one side of the nozzle 14 to the other side, so that the flow of solder from the nozzle 14 is uniformly adjusted.
8 becomes a uniform horizontal surface over the entire width of the nozzle 14.

FIG. 2 shows another embodiment of the invention, which:
The lower ends of the adjusting screws 34 and 35 screwed into the flange parts 21 and 23 rotate vertically through a hinge 41 on the inner surface of the pump body 13a and through a hinge 42 on the rear side of the casing 22. A freely pivoted front adjustment plate 43 and a rear adjustment plate 4
4 is locked. Each adjustment plate 43, 4
4. Depending on the pressure of the solder flow, the adjustment screws 34 and 35
It is pressed against the lower end of and locked at an adjusted angle by screws 34, 35.

Note that the present invention does not apply to the front adjusting plate 31 or 43.
If both the and the rear adjusting plate 33 or 44 are used as in the embodiment, a very uniform horizontal jet soldering surface can be obtained, but if high precision is not required for the uniformity, Adjustment plate 33 or 44
In such a case, it is not necessary to provide the front adjustment plate 31 or 43, since it is sufficiently effective just by using the adjustment plate 31 or 43.

〔Effect of the invention〕

According to the first invention, a solder inlet is provided on one side of the casing and a solder outlet is provided on the other side opposite to the solder outlet, and a rear adjustment plate is provided on the solder outlet for adjusting the opening area of the outlet. Since the solder flow outlet is provided with a simple adjustment mechanism consisting of the solder outlet and the rear adjustment plate, the solder flow pumped to the nozzle can be uniformly controlled, and each flow dividing plate can be adjusted. A horizontal, uniform jet surface is obtained over the entire width of the nozzle.

According to the second invention, the solder inlet on one side of the casing is further provided with a front adjusting plate for adjusting the opening area of the inlet.
The uniformity of the horizontal jet surface can be made very precise by the front adjustment plate and the rear adjustment plate.

Further, the front adjustment plate and the rear adjustment plate are not greatly affected by the number of flow divider plates, and are effective even with a small number of flow divider plates.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the jet soldering apparatus of the present invention, and FIG. 2 is a sectional view showing another embodiment. DESCRIPTION OF SYMBOLS 11... Molten solder, 12... Solder bath, 13... Pump, 14... Nozzle, 15... Lower opening, 16... Upper opening, 17... Work, 22... Casing, 24
... Solder inlet, 25... Diversion plate, 31, 43... Front adjustment plate, 32... Solder outlet, 33, 44... Rear adjustment plate.

Claims (1)

[Scope of Claims] 1. In a solder tank containing molten solder, the molten solder is pumped from a pump into a casing that covers the lower opening of the nozzle, and passes through a solder flow provided on one side of the casing. The solder is supplied from the inlet, and inside the casing, it is forced into the nozzle by a plurality of flow divider plates provided at intervals so as to extend downward in sequence from the solder inlet side toward the back. The solder flow is rectified.
In a jet soldering device in which a workpiece conveyed on a nozzle is soldered by molten solder jetted from an upper opening of a nozzle, a solder flow is formed on the other side of the casing opposite to the inflow port. What is claimed is: 1. A jet soldering device, characterized in that the solder outlet is provided with a rear adjusting plate for adjusting the opening area of the solder outlet. 2. In the solder tank containing molten solder, the molten solder is pumped from the pump and is supplied into the casing that covers the lower opening of the nozzle from the solder inlet provided on one side of the casing. Inside the casing, the solder flow being forced into the nozzle is rectified by a plurality of flow dividing plates provided at intervals so as to extend downward in sequence from the solder inlet side toward the back. ,
In a jet soldering device in which a workpiece conveyed on a nozzle is soldered by molten solder jetted from an upper opening of a nozzle, a solder inlet on one side of the casing is provided with a solder inlet on one side of the casing. A front adjusting plate is provided for adjusting the opening area, a solder outlet is provided on the other side of the casing opposite to the inlet, and a rear adjustment plate is provided at the solder outlet for adjusting the opening area of the outlet. A jet soldering device characterized by being provided with a side adjustment plate.