JPH03151A - Thin film coating device - Google Patents
Thin film coating deviceInfo
- Publication number
- JPH03151A JPH03151A JP13108489A JP13108489A JPH03151A JP H03151 A JPH03151 A JP H03151A JP 13108489 A JP13108489 A JP 13108489A JP 13108489 A JP13108489 A JP 13108489A JP H03151 A JPH03151 A JP H03151A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- tank
- vapor
- solvent vapor
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、物体の表面に薄膜を形成する薄膜塗布装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film coating device for forming a thin film on the surface of an object.
近年、磁気記録媒体の表面保護膜、電子写真用感光体の
感光層、プリント基板へのフラックス塗布膜やIC基板
へのレジスIf布膜などミクロンオーダーあるいはそれ
以下の膜厚の薄膜で、かつ、所定の機能を有する膜が必
要となる技術分野が増大してきている。In recent years, thin films on the order of microns or less, such as surface protective films of magnetic recording media, photosensitive layers of electrophotographic photoreceptors, flux coating films on printed circuit boards, and resist If cloth films on IC boards, have been developed. BACKGROUND OF THE INVENTION An increasing number of technical fields require membranes with specific functions.
このような膜はその機能が均一であることが要求される
が、薄膜であるためにわずかな膜厚の差が機能の大幅な
ばらつきを引き起こすことになるので、厚みのばらつき
のできるだけ少ない均一な膜厚の膜が望まれる。そのた
め、従来のはけ塗りやスプレーガン塗装などの塗膜形成
法は適用できず、より均一な膜厚の塗膜を得ることの可
能なスピンコード法やディッピング法が用いられる。し
かしながら、スピンコード法は高速回転の駆動系を必要
とし、塗膜を形成すべき物体の表面の面積が広い場合と
か、表面の形状が複雑な場合には塗布が困難あるいは不
可能となるので、ディッピング法が広く用いられてきた
。Such a film is required to have uniform functionality, but since it is a thin film, a slight difference in film thickness will cause large variations in functionality. A thick film is desired. For this reason, conventional coating film formation methods such as brush coating and spray gun coating cannot be applied, and spin cord methods and dipping methods are used, which can obtain a coating film with a more uniform thickness. However, the spin code method requires a high-speed rotating drive system, which makes coating difficult or impossible when the surface area of the object to be coated is large or the surface shape is complex. Dipping methods have been widely used.
ディッピング法は、機能性の材料を有機溶媒中に溶解あ
るいは分散させ、場合によってはさらに粘着剤、可塑剤
などを加えて塗布液として塗布樗に充填し、この塗布液
中に被塗布物体を浸漬させ、ついで被塗布物体を引き上
げて乾燥させ塗膜を形成する方法である。この方法は簡
便であり、しかも塗布液の粘度、被塗布物体の塗布液か
らの引き上げ速度を調節することにより比較的簡単に薄
膜を得ることができる。In the dipping method, a functional material is dissolved or dispersed in an organic solvent, and in some cases adhesives, plasticizers, etc. are added to form a coating solution, which is then filled into a coating funnel, and the object to be coated is immersed in this coating solution. In this method, the object to be coated is pulled up and dried to form a coating film. This method is simple and allows a thin film to be obtained relatively easily by adjusting the viscosity of the coating liquid and the rate at which the object to be coated is lifted from the coating liquid.
このようなディッピング法、またはこれと類似の塗布方
法、すなわち、被塗布物体の塗膜形成面と塗布液貯留槽
内の塗布液とを接触させた状態で鉛直方向に相対移動さ
せ塗膜形成面を塗布液から上方へ引き離すことにより塗
膜形成面上に塗膜を形成する方法においては、塗布液溶
媒の蒸発速度が速い場合、相対移動して塗布液内からで
てくる塗膜形成面上の塗膜から急激な溶媒の蒸発が起こ
り、そのために塗膜外観が著しく悪い状!!!(ナシ地
)となる。従って、塗布液の溶媒の種類および被塗布物
体と塗布液貯留槽との相対移動速度などの塗布条件が限
定されるという欠点があった。従来、これらの欠点を除
去するために、塗布液および塗膜から蒸発する空気より
比重の大きい溶媒蒸気を被塗布物体の周囲に保持するよ
うに、塗布液貯留槽の上部開口部周縁に溶媒蒸気の蒸気
貯留槽を付加することが行われていた。Such a dipping method or a similar coating method is used, in which the coating surface of the object to be coated and the coating liquid in the coating liquid reservoir are moved relative to each other in the vertical direction while they are in contact with each other. In the method of forming a coating film on the coating film formation surface by pulling upward from the coating solution, if the evaporation rate of the coating solution solvent is fast, the relative movement of the coating solution solvent and the coating film formation surface that comes out from the coating solution. Rapid evaporation of the solvent occurs from the paint film, resulting in a significantly poor appearance of the paint film! ! ! (Pear ground) Therefore, there has been a drawback that coating conditions such as the type of solvent in the coating liquid and the relative movement speed between the object to be coated and the coating liquid storage tank are limited. Conventionally, in order to eliminate these drawbacks, solvent vapor is placed around the upper opening of the coating liquid reservoir so that the solvent vapor, which has a higher specific gravity than the air that evaporates from the coating liquid and the coating film, is retained around the object to be coated. Additional steam storage tanks were being added.
しかしながら、従来の薄膜塗布装置では、蒸気貯留槽内
の溶媒蒸気濃度が一定せず、特に塗布開始直後にはその
蒸気濃度が低いために塗膜からの溶媒の蒸発が速く、塗
膜にナシ地が発生し、塗布時間の経過につれて濃度が増
し、塗膜からの溶媒の蒸気が抑えられ、例えば塗膜の厚
さが変わってくるなどの不具合が生じる。また、さらに
塗布終了時点では被塗布物体が塗布液より気中にでるた
めに溶媒蒸気流が攪乱され、塗膜形成面下端部に塗布む
らが生じるという欠点があった。However, in conventional thin film coating equipment, the concentration of solvent vapor in the vapor storage tank is not constant, and the vapor concentration is particularly low immediately after the start of coating, so that the solvent evaporates from the coating film quickly, leaving the coating film with no spots. The concentration increases as the coating time progresses, and solvent vapor from the coating film is suppressed, resulting in problems such as changes in coating thickness. Furthermore, at the end of coating, the object to be coated comes out of the coating liquid into the air, which disturbs the solvent vapor flow, resulting in uneven coating at the lower end of the coating surface.
この発明は、これらの欠点を除去して、塗布液に使用す
る溶媒の種類および塗布条件に制約を及ぼすことなく、
被塗布物体に形成される塗膜のナシ地の発生を防止し、
かつ、塗布終了時点で塗膜形成面下端部に生じる塗布む
らを防止することのできる薄膜塗布装置を提供すること
を課題とする。The present invention eliminates these drawbacks and does not impose any restrictions on the type of solvent used in the coating solution or the coating conditions.
Prevents the formation of blank spots on the coating object,
Another object of the present invention is to provide a thin film coating device that can prevent coating unevenness that occurs at the lower end of the coating film formation surface at the time of completion of coating.
上記の課題は、この発明によれば、被塗布物体の塗膜形
成面と塗布液貯留槽内の塗布液とを接触させた状態で鉛
直方向に相対移動させ塗膜形成面を塗布液から上方へ引
き離すことにより前記塗膜形成面に前記塗布液の薄膜を
形成する薄膜塗布装置が前記塗布液貯留槽の上部開口部
に塗布液の溶媒蒸気の蒸気貯留槽を備えたものにふいて
、前記蒸気貯留槽に、この槽内の蒸気を槽底部近傍から
排気する排気口と、これにつながる強制的排気制御機構
とを付設した構成の薄膜塗布装置とすることによって解
決することができる。According to the present invention, the above problem can be solved by moving the coating film forming surface of the object to be coated upwardly from the coating solution by moving the coating film forming surface of the object to be coated and the coating solution in the coating solution reservoir in contact with each other in the vertical direction. A thin film coating device that forms a thin film of the coating liquid on the coating film forming surface by separating the coating liquid from the coating liquid is wiped onto a device having a vapor storage tank for solvent vapor of the coating liquid in an upper opening of the coating liquid storage tank. This problem can be solved by using a thin film coating apparatus in which the steam storage tank is provided with an exhaust port for exhausting the steam in the tank from near the bottom of the tank, and a forced exhaust control mechanism connected to the exhaust port.
強制排気機構を設け、これをon・off作動させるこ
とにより、蒸気貯留槽内の溶媒蒸気濃度の制御が可能と
なる。溶媒蒸気の濃度を所要の範囲内に保ちながら塗布
を行うことにより、均一な膜厚の均質な外観良好な塗布
薄膜が得られることになる。また、塗布終了時点で溶媒
蒸気流の乱れやすいときには溶媒蒸気゛を強制的に排気
して、塗膜形成面下端部の塗布むらの発生を防ぐことが
できる。By providing a forced exhaust mechanism and turning it on and off, it becomes possible to control the concentration of solvent vapor in the vapor storage tank. By performing coating while maintaining the concentration of solvent vapor within a required range, a coated thin film with uniform thickness, homogeneity, and good appearance can be obtained. Furthermore, when the solvent vapor flow is likely to be disturbed at the end of coating, the solvent vapor can be forcibly exhausted to prevent uneven coating at the lower end of the coating surface.
第1図は、この発明に係わる薄膜塗布装置の一実施例の
模式的断面を示す。第1図において、1は塗布液貯留槽
であるとともに塗布槽であり、塗布液8は循環ポンプ4
の働きにより、矢印で示すように塗布槽1の下部から流
入し、上部開口部からオーバーフローして補助槽3へ上
部から流入し、下部から再び塗布槽1へと循環している
。塗布槽lの上部開口部を側面から取り囲むように蒸気
を貯留するための槽である蒸気槽2が設けられており、
蒸気槽2には排気ファン7の付設された排気口5が槽底
部近傍に設けられており、蒸気槽2内の溶媒蒸気は排気
ファン7により排気口5を通って外部へ強制排気できる
構成となっている。さらに排気口5にはシャッタ6が付
設されており、このシャッタ6を外部から機械的にある
いは電気的に開閉することにより蒸気槽2内の溶媒蒸気
の濃度が制御される。FIG. 1 shows a schematic cross section of an embodiment of a thin film coating apparatus according to the present invention. In FIG. 1, 1 is a coating liquid storage tank and a coating tank, and the coating liquid 8 is supplied to a circulation pump 4.
As shown by the arrow, the water flows into the coating tank 1 from the lower part, overflows from the upper opening, flows into the auxiliary tank 3 from the upper part, and circulates back into the coating tank 1 from the lower part. A steam tank 2, which is a tank for storing steam, is provided so as to surround the upper opening of the coating tank l from the side.
The steam tank 2 is provided with an exhaust port 5 equipped with an exhaust fan 7 near the bottom of the tank, and the solvent vapor in the steam tank 2 can be forcibly exhausted to the outside through the exhaust port 5 by the exhaust fan 7. It has become. Furthermore, a shutter 6 is attached to the exhaust port 5, and the concentration of solvent vapor in the steam tank 2 is controlled by opening and closing the shutter 6 mechanically or electrically from the outside.
この実施例の薄膜塗布装置を用いて塗膜を形成するに際
しては、まずシャッタ6を閉じた状態で、蒸気槽2内の
溶媒蒸気の濃度が塗布槽1内からオーバーフローしてい
る塗布液8から蒸発した溶媒蒸気により塗膜にナシ地が
発生しない程度の濃度に達した時点で塗布を開始する。When forming a coating film using the thin film coating apparatus of this embodiment, first, with the shutter 6 closed, the concentration of solvent vapor in the steam tank 2 is reduced from the coating liquid 8 overflowing from the coating tank 1. Coating is started when the concentration reaches a level where the evaporated solvent vapor does not cause pear spots on the coating film.
塗布がすすむにつれて、塗布槽1内の塗布液から引き上
げられてくる塗膜形成面上の塗膜から蒸発する溶゛媒蒸
気により蒸気槽2内の溶媒蒸気の濃度が上昇してくるが
、このときシャッタ6を開閉して蒸気槽2内の溶媒蒸気
を排気ファン7により排気口5から排気したり排気を中
止したりして、蒸気槽2内の溶媒蒸気の濃度を所要の一
定濃度範囲内に制御しながら塗布を行う。このようにし
て、膜厚均一で均質な外観良好な塗布薄膜を形成するこ
とができる。As coating progresses, the concentration of solvent vapor in the vapor tank 2 increases due to solvent vapor that evaporates from the coating film on the coating surface that is pulled up from the coating solution in the coating tank 1. When the shutter 6 is opened and closed, the solvent vapor in the steam tank 2 is exhausted from the exhaust port 5 by the exhaust fan 7, or the exhaust is stopped, and the concentration of the solvent vapor in the steam tank 2 is kept within a required constant concentration range. Apply while controlling. In this way, a coated thin film with uniform thickness, homogeneity, and good appearance can be formed.
また、塗布終了時点で溶媒蒸気流の乱れやすいときには
、シャッタ6を開いて溶媒蒸気を排気することにより、
塗膜形成面下端部に塗布むらが生じることを防ぐことが
できる。In addition, when the solvent vapor flow is likely to be disturbed at the end of coating, the shutter 6 can be opened to exhaust the solvent vapor.
It is possible to prevent uneven coating from occurring at the lower end of the coating film forming surface.
この発明によれば、ディッピング法またはこれと類似の
方法による薄膜塗布装置にふいて、塗布液貯留槽の上部
開口部に設けられる蒸気貯留槽にその内部の溶媒蒸気を
強制的に排気できる機構を設ける。According to the present invention, a thin film coating apparatus using a dipping method or a similar method is equipped with a mechanism that can forcibly exhaust the solvent vapor inside the vapor storage tank provided at the upper opening of the coating liquid storage tank. establish.
この発明に係わる薄膜塗布装置を用いることにより、蒸
気貯留槽内の溶媒蒸気の濃度を所要の範囲内に制御する
ことが可能となり、塗布液に用いる溶媒の種類および塗
布条件を特に限定することなく、ナシ地などが発生しな
くて外観が良好であり膜厚均一で均質な塗布薄膜を形成
することができる。By using the thin film coating device according to the present invention, it is possible to control the concentration of solvent vapor in the vapor storage tank within the required range, without particularly limiting the type of solvent used in the coating liquid and the coating conditions. It is possible to form a homogeneous coated thin film with a good appearance without the appearance of pear spots, and a uniform thickness.
また、被塗布物体の塗膜形成面下端が塗布液から出る時
点で乱れる蒸気を強制的に排気して、塗膜形成面下端部
の塗布むらをなくすことが可能となる。Further, by forcibly exhausting the steam that is disturbed when the lower end of the coating film forming surface of the object to be coated leaves the coating liquid, it becomes possible to eliminate uneven coating at the lower end of the coating film forming surface of the object.
第1図はこの発明に係わる薄膜塗布装置の一実施例の模
式的断面図である。
1− 塗布槽、2 蒸気槽、5 排気口、6 シャッタ
、7 排気ファン、8 塗布液。
第1図FIG. 1 is a schematic sectional view of an embodiment of a thin film coating apparatus according to the present invention. 1- coating tank, 2 steam tank, 5 exhaust port, 6 shutter, 7 exhaust fan, 8 coating liquid. Figure 1
Claims (1)
とを接触させた状態で鉛直方向に相対的に移動させ塗膜
形成面を塗布液から上方へ引き離すことにより前記塗膜
形成面に前記塗布液の薄膜を形成する薄膜塗布装置が前
記塗布液貯留槽の上部開口部に塗布液の溶媒蒸気の蒸気
貯留槽を備えたものにおいて、前記蒸気貯留槽に、この
槽内の溶媒蒸気をこの槽の底部近傍から排気するための
排気口と、これにつながる強制的排気制御機構とを付設
したことを特徴とする薄膜塗布装置。1) The coating film is formed by moving the coating film forming surface of the object to be coated and the coating liquid in the coating liquid storage tank in contact with each other in the vertical direction and separating the coating film forming surface upward from the coating liquid. A thin film coating device for forming a thin film of the coating liquid on a forming surface is provided with a vapor storage tank for solvent vapor of the coating liquid at an upper opening of the coating liquid storage tank, and a vapor storage tank for solvent vapor of the coating liquid is placed in the vapor storage tank. A thin film coating device characterized by being equipped with an exhaust port for exhausting solvent vapor from near the bottom of the tank, and a forced exhaust control mechanism connected to the exhaust port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13108489A JPH03151A (en) | 1989-05-24 | 1989-05-24 | Thin film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13108489A JPH03151A (en) | 1989-05-24 | 1989-05-24 | Thin film coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03151A true JPH03151A (en) | 1991-01-07 |
Family
ID=15049614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13108489A Pending JPH03151A (en) | 1989-05-24 | 1989-05-24 | Thin film coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03151A (en) |
-
1989
- 1989-05-24 JP JP13108489A patent/JPH03151A/en active Pending
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