JPH03152199A - Cleaner for rosin-based soldering flux - Google Patents

Abstract

PURPOSE:To obtain the title cleaner especially useful for assembly, having excellent cleaning power, approximately satisfactory in terms of environmental characteristics, toxicity, smell, flammability, etc., comprising a mixture of a specific hydrogenated fraction or a specific cracked oil and a specific nonionic surfactant as a active ingredient. CONSTITUTION:The objective cleaner comprising a mixture of (A) (i) a hydrogenated fraction prepared by hydrogenating a fraction having 150-300 deg.C boiling point prepared as a by-product by thermal cracking or reforming of petroleum naphtha and/or (ii) a cracked oil prepared as a by-product in manufacturing a hydrogenated petroleum resin obtained by hydrogenating a petroleum resin made by cationic polymerization and (B) a nonionic surfactant preferably shown by the formula (R is 5-20C alkyl, phenyl or 7-12C alkyl-substituted phenyl; n is 5-20 integer) as an active ingredient.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a cleaning agent for rosin-based solder flux, and particularly to a cleaning agent for rosin-based solder flux for assembly.

(Prior Art) Rosin-based solder flux is used in the production of modules such as printed circuit boards and printed wiring boards. The purpose of soldering is generally to increase the adhesive strength between the board and the input/output bottle, and to prevent oxidation of the contacts and maintain conductivity. The system is used for solder flux removal. After soldering is completed, a cleaning agent is used to selectively and completely remove only the flux from the board surface. In other words, if the flux is insufficiently cleaned, the residual flux may cause circuit corrosion, or the electrical insulation on the surface of the substrate may deteriorate, ultimately leading to circuit damage. be.

Therefore, by using cleaning agents to remove the residual flux, especially the activator components contained in it,
We will try to resolve the above-mentioned differences. There is α4.

Conventionally, halogenated carbon water stopping agents such as trichlorethylene and trichlorotrifluoroethane have been used as cleaning agents for rosin-based solder flux. However, due to environmental pollution problems such as ozone layer depletion, restrictions on the use of such halogenated hydrocarbon solvents are becoming more serious, and the development of so-called fluorocarbon substitute solder flux cleaning agents has become an urgent need in the electrical industry. .

Recently, non-halogen solder flux cleaning agents have been developed, but no one has yet been found that completely satisfies all required performance such as cleaning power, toxicity, odor, and flammability. is the current situation.

(Problems to be Solved by the Invention) The present invention has 1. It is an object of the present invention to provide a non-halogen solder flux cleaning agent which has excellent pre-cleaning power and is almost satisfactory in terms of F-friendly characteristics and toxicity.

(Means for Solving the Problems) The present inventors have achieved the above-mentioned object (as a result of extensive studies, we have surprisingly found that when a specific hydrocarbon component and a nonionic surfactant are used as essential components) discovered that all of the above problems could be solved and completed the present invention.

That is, the present invention provides a hydrogenated fraction [b] obtained by hydrogenating a fraction with a boiling point of 150 to 300°C that is produced as a by-product by thermal decomposition or reforming of petroleum naphtha, and/or a hydrogenated fraction [b] obtained by thermal cracking or reforming of petroleum naphtha. By-product boiling point 150-300
A mixture consisting of cracked oil [b], which is a by-product during the production of hydrogenated petroleum resin obtained by hydrogenating petroleum resin obtained by combining cationic fractions of °C, and a nonionic surfactant, is effectively used. The present invention relates to a cleaning agent for rosin-based solder flux, which is characterized by containing a rosin-based solder flux as a component.

Among the components of the rosin-based solder flux cleaning agent of the present invention, the hydrogenated fraction (hereinafter referred to as component (2) is said to be a hydrogenated C9 fraction obtained by hydrogenating a so-called C9 fraction. Here, the above C, fraction is -1 for boat fishing.
For example, it is a mixture of hydrocarbons containing various polymerizable aromatic hydrocarbons such as styrene, α-methylstyrene, vinyltoluene, vinylxylene, propenylbenzene, indene, methylindene, and ethylindene as a main component. Note that the C3 fraction may contain a small amount of aliphatic hydrocarbons such as butene, pentene, hexene, heptene, octene, butadiene, pentadiene, cyclopentadiene, dicyclopentadiene, etc. as a subcomponent. Therefore, component (2) is a hydrocarbon mixture containing as a main component an alicyclic hydrocarbon obtained by hydrogenating the above-mentioned C9 fraction by a known method. In the hydrogenation reaction, the C1 fraction is heated to 0 to 300 g/Cr weight 1' hydrogen pressure in the presence of a metal catalyst such as nickel, palladium, cobalt, platinum, ruthenium, or rhodium or an oxide catalyst of these metals. , can be carried out by heating the reaction at 30 to 300°C, whereby component (1) can be easily obtained.

Among the components of the cleaning agent of the rosin-based solder flux of the present invention, hydrogen is obtained by hydrogenating a petroleum resin obtained by cationic polymerization, which is a by-product with a boiling point of 150 to 300°C by thermal decomposition or reformation of petroleum naphtha. The cracked oil (hereinafter referred to as component ()) which is produced as a by-product during the production of fossil petroleum resin is the C9 fraction that is polymerized by a known cationic polymerization method to form a so-called C9-based petroleum resin. So-called hydrogenated C, which is produced by employing a known hydrogenation method for resin.
The cationic polymerization method here refers to a cationic polymerization method that may be any known method without any particular limitation. A common method is to heat-react the C fraction in the presence of C. In addition, as hydrogenation conditions, conditions similar to the components listed in (~) can be adopted, but the hydrogen pressure needs to be under stricter conditions, usually 50 to 30
It is estimated to be around 0Kg/crr1'. However, the ingredient ■ is
It refers to what is called a so-called hydrocracked oil, which is a by-product of C9 petroleum resin under the above-mentioned water production conditions. Therefore, when comparing component ■ with component Although there are differences, both are considered to be essentially the same hydrocarbon mixture.

Among the components of the cleaning agent for the rosin-based solder flux of the present invention, the nonionic surfactant (hereinafter referred to as component (Φ)) is not particularly limited, and various known ones may be employed.Specific examples thereof include: , polyethylene glycol ether such as polyoxyethylene alkyl ether, polyoxyethylene phenol ether, polyoxyethylene alkyl phenol ether, etc. as a nonionic surfactant;
Polyethylene glycol ester type nonionic surfactants such as polyethylene glycol monoester and polyethylene glycol diester; ethylene oxide-attached carboxylates of higher aliphatic amines; ethylene oxide adducts of fatty acid amides; Hydrolic alcohol type nonionic surfactants; fatty acid alkanolamides and the like; corresponding polyoxypropylene type nonionic surfactants and polyoxyethylene polyoxypropylene copolymerization nonionic surfactants can also be mentioned. Among these, polyethylene glycol ether type nonionic surfactants are preferred from the viewpoint of detergency, and those represented by the following formula are preferred for cleaning purposes.

R=O-(CH□CH,O). −[1 (in the formula,
R is a straight chain or branched alkyl group having 5 to 20 carbon atoms,
A phenyl group or a phenyl group substituted with a straight chain or branched alkyl group having 7 to 12 carbon atoms, where n is 5 to 20
The proportion of the above-mentioned component O and/or component (◇, which represents an integer of ◇) is not particularly limited, but
Usually Ii? i: Review is 95-50 heavy%: 5-5
0 weight! %, preferably 90-80! II 31%:10
~2010.

The cleaning agent of the present invention, which is composed of the above component (1) and/or component (2) and component (Φ), is applicable to cleaning rosin-based solder flux, particularly rosin-based solder flux for assembly.The flux includes rosin,
Inactive rosin fluxes whose main components are rosins such as modified rosin, and activated rosin fluxes whose main components are rosins and an activator are common, but the cleaning agent of the present invention is suitable for use in assemblies. It has great significance when applied to activated rosin flux.

To specifically apply the cleaning agent of the present invention to a substrate, follow the steps below.
Adopt a dan. That is, when the cleaning agent of the present invention is used as it is or when emulsified with water, the concentration of active ingredients is usually 10.
i) ~50. [Adjust so that fE is 1%. A method of washing the substrate by directly immersing the substrate in the prepared solution obtained by (1), a method of flushing the aqueous solution using a spray device,
Alternatively, the cleaning agent of the present invention is a non-halogen solder flux cleaning agent.
The cleaning agent of the present invention does not have the problem of ozone layer depletion that occurs with fluorocarbon-based cleaning agents (and has the advantage of being relatively free of air pollution problems because it is a non-aromatic hydrocarbon-based cleaning agent). However, in consideration of the working environment and flash point relationship when using the cleaning agent, low boiling point components and low flammable components are removed by distillation etc. to achieve the desired flash point for component (1) and component (2). The component composition can be adjusted appropriately by removing the point components appropriately.However, if the flash point is 70°C or higher, there is no need to use a dedicated cleaning device that is specially designed to be explosion-proof. There is an advantage that various commercially available cleaning devices used in conventional fluorocarbon cleaning can be used as they are or by modifying them.

The temperature for 1φ of 1′/c cleaning is generally around room temperature, but Ag!
If the temperature is higher than the flash point, the cleaning effect can be further improved by adding the desired temperature.

(Examples Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited only to these examples.

Example I C3-based hydrogen (by-product cracked oil during petroleum resin production (boiling point 3)
The cleaning agent of the present invention was prepared by mixing 1 part of 85iRi (5°C) with 1 part of polyethylene glycol alkyl ether yanonionic surfactant (manufactured by Dai-Koshi Seisaku, trade name: Noigen [[MiT-+35J]). .

On the other hand, apply rosin-based flux (manufactured by LONCO, trade name: Re5i) to the entire surface of the printed wiring board ($1 laminated board).
n Flux #77-25 J) and apply 130
After drying at 260'C for 2 minutes, solder flow was performed at 260'C for 5 seconds to prepare a test board.

This board is immersed in the above cleaning agent at room temperature, and the degree of flux removal is determined as follows: Judgment was made visually based on weight standards. The results are shown in Table 1.

○ Can be removed well Δ Moss moss remains
The cleanliness (residual ion concentration) of the substrate was measured. The results are shown in Table 1.

Examples 2 to 3 In Example 1, ponds in which the cleaning agent composition ratio was changed as shown in Table 1 were evaluated in the same manner. The results are shown in Table 1.

Examples 4 to 6 The same procedure as in Example 1 was used except that various C-based hydrogenated petroleum resins having flash points as shown in Table 1 were replaced with by-product cracked oils during the production of hydrogenated petroleum resins, or the washing temperature was changed. The evaluation was carried out as follows. The results are shown in 1k.

Example 7 Example! In place of the by-product cracked oil during the production of C, J-based hydrogenated petroleum resins, a fraction with a boiling point of 150 to 300°C produced by the thermal decomposition of 1 petroleum naphtha was hydrogenated (1 produced hydrogenated fraction (flash point 33℃) was used in the same manner,
A heptavalent test was performed. The results are shown in Table 1.

Examples 8 to 9 In Example 5mtfl15, the types of surfactants used were, in order, polyethylene glycol decylphenyl ether type nonionic surfactant (manufactured by Dai-Kogyo Sohaku ■, trade name [
Noigen EA-143J > Polyethylene glycol nonylphenyl ether type nonionic surfactant (manufactured by Dai-Koushi Pharmaceutical Co., Ltd., trade name: Noigen EA-+20J)
The evaluation was carried out in the same manner except that it was changed to . The result is the first
Shown in the table.

(Effects of the Present Invention) According to the present invention, it is possible to easily provide a non-halogen solder flux cleaning agent that has excellent cleaning power and is fully satisfactory in terms of one-line properties. .

Arakawa Kaji Industries Co., Ltd.

Claims (1)

[Claims] [1] Hydrogenated fraction [a] obtained by hydrogenating a fraction with a boiling point of 150 to 300°C produced by thermal decomposition or reforming of petroleum naphtha, and/or heat of petroleum naphtha Cracked oil [b] that is produced as a by-product when producing hydrogenated petroleum resin obtained by hydrogenating petroleum resin obtained by cationic polymerization of a fraction with a boiling point of 150 to 300 ° C. that is produced as a by-product by cracking or reforming, and A rosin-based solder flux cleaning agent characterized by containing a mixture of a nonionic surfactant and a nonionic surfactant as an active ingredient. [2] The nonionic surfactant has the general formula: R-O-(CH_2CH_2O)_n-H (wherein R is a straight or branched alkyl group having 5 to 20 carbon atoms, a phenyl group, or a carbon number The cleaning agent according to claim 1, which is a surfactant represented by a phenyl group substituted with 7 to 12 linear or branched alkyl groups, where n is an integer of 5 to 20. [3] The cleaning agent according to claim 1 or 2, wherein the content of the nonionic surfactant is 5 to 50% by weight.