JPH03152802A - Fluorescent lamp device - Google Patents

Abstract

PURPOSE:To make a fluorescent lamp device compact with simple constitution, and prevent lighting circuit parts from being heated due to thermal conduction by forming a gap between a lighting circuit board and a casing side wall. CONSTITUTION:A casing 1 for housing a fluorescent lamp contains a circuit board 7 packaged with a part for driving the lamp, as well. The circuit board 7 is fitted to the casing 1 via an L-type step part 13, and a gap 15 is formed between the circuit board 7 and the casing 1. Consequently, a fluorescent lamp device can be made compact with simple constitution, and a lighting circuit part is prevented from being heated due to thermal conduction.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a fluorescent lamp device that integrally includes a fluorescent lamp and its lighting circuit components.

(Prior Art) In a fluorescent lamp device, a circuit board on which high-frequency lighting circuit components are mounted is housed in a casing that has a screw-in base for an incandescent light bulb attached to one end, and a circuit board with high-frequency lighting circuit components mounted on the other end of the casing.
Devices have been developed that are fitted with bent fluorescent lamps (discharge lamps), eg, U-shaped, W-shaped, saddle-shaped, etc.

This type of fluorescent lamp device is becoming popular as an energy-saving light source because it is compatible with incandescent light bulbs.

Conventionally, when installing a circuit board for such a fluorescent lamp device, the circuit board is set to have an outer shape that corresponds to the inner diameter of the casing. Then, this circuit board was inserted into the inside of the casing and fixed so that the entire outer peripheral end was in contact with the inner surface of the casing.

By the way, when such a fluorescent lamp device is turned on,
The heat generated by the fluorescent lamp heats the casing.

However, since the circuit board and the casing are in contact with each other, heat is conducted to the circuit board through the contact portion, and heats the high-frequency lighting circuit components, which are sensitive to heat.

Therefore, it is conceivable to provide a plurality of holes in the peripheral wall of the casing and dissipate heat by convection.

However, this structure does not solve the problem because high-temperature air heated by the fluorescent lamp enters the casing through the hole and heats the circuit board.

For this reason, in the past, in order to keep the high-frequency lighting circuit components within the heat-resistant temperature range, the solution was to place them far away from the fluorescent lamp or use large components with high heat resistance. .

(Problems to be Solved by the Invention) However, this structure has a problem in that the fluorescent lamp device becomes large, and improvements are desired.

This invention was made based on these circumstances,
The purpose is to provide a fluorescent lamp device that can prevent heating of lighting circuit components due to conduction heat while reducing the size of the device. [Structure of the Invention] (To solve the problem The fluorescent lamp device of the present invention is characterized in that a gap is provided between the outer peripheral end of the circuit board and the peripheral wall of the casing facing thereto.

(Function) According to the fluorescent lamp device of the present invention, the gap formed between the casing and the circuit board makes it possible to reduce the contact area that serves as a heat transfer path, so that heat can be transferred to the circuit board accordingly. This makes it possible to suppress heat from the peripheral wall of the casing.

In other words, it becomes possible to prevent the circuit board from being heated without using large components with high heat resistance or increasing the distance from the fluorescent lamp.

(Example) The present invention will be described below based on a first example shown in FIGS. 1 and 2. FIG. 2 shows a cross-sectional view of the entire fluorescent lamp device to which the present invention is applied, and in the figure, 1
is a hollow, substantially cylindrical casing made of, for example, a synthetic resin member. The casing 1 is divided at its lower end, with a large upper portion serving as a cover body 1a and a smaller portion serving as a closing member 1b. Further, both are removably connected by an engaging pawl protruding from one open end and an engaging recess (both not shown) provided at the other opening end.

A cap 3 is inserted into the center of the end of the cover body 1a through a cylindrical portion 2 protruding from the cover body 1a.
is installed. Further, the end wall of the closing member lb is provided with a plurality of insertion holes 4, into which the ends of fluorescent lamps, for example, two U-shaped bent fluorescent lamps 5 are inserted and fixed. ing. Note that 5a is an adhesive for fixing the end of the bent fluorescent lamp 5 to the closing member 1b.

Further, a lighting circuit device 6 is housed inside the casing.

To explain the lighting circuit device 6, it is a circular circuit board 7 (made of a printed wiring board) formed slightly smaller than the inner diameter of the cover body 1 and the closing member 1b.
An electrolytic capacitor 8, a plurality of film capacitors 9, a transistor 10 ., which constitute an inverter circuit (lighting circuit) are provided on the circuit board 7 . Various electronic components such as an oscillation transformer (not shown) are mounted.

Then, the circuit board 7 is connected to the cover body 1a and the closing member 1.
b, and the entire lighting circuit device 6 is installed in the center within the casing.

Here, the structure of the installation of the circuit board 7 will be explained as follows.
For example, as shown in FIG.
Abbreviated step portions 13 that engage with the outer peripheral edge of the circuit board 7 are protrudingly provided at a plurality of locations on the inner peripheral portion of the opening. Further, a step portion 14 having a similar shape and forming a pair with the step portion 13 is provided protrudingly on the inner peripheral portion of the opening of the closing member 1b in correspondence with the step portion 13,
The outer peripheral edge of the circuit board 7 is sandwiched between the stepped portions 13 and 14, and the entire circuit board 7 is fixed at a position concentric with the casing. In this fixing structure of the circuit board 7, a gap 15 is formed between the outer peripheral end of the circuit board 7 and the peripheral wall of the casing 1 facing thereto. And this fixed part! In the gap 15 apart from the peripheral wall of the casing,
The heat transfer path from the casing to the circuit board 7 is minimized.

In this way, the inverter circuit of the built-in circuit board 7 is connected to the base 3. It is connected to a bent fluorescent lamp 5.

Therefore, in the fluorescent lamp device constructed in this way, after the cap 3 is inserted into a socket (not shown) that serves as a power source,
When the power is turned on, the inverter circuit operates and the fluorescent lamp 5
A high frequency current is supplied to the fluorescent lamp 5 to light up the fluorescent lamp 5.

As a result, high-temperature air flows from the fluorescent lamp 5 along the outer surface of the hermetically sealed casing 1 due to convection. Along with this convection, direct heat generated from the fluorescent lamp 5 is also transferred to the casing 1.

Then, this heat tries to be transferred from the casing 1 to the circuit board 7.

However, between the casing 1 and the circuit board 7,
A gap 15 is provided in the portion excluding the fixed portion. This makes it possible to reduce the size of the contact area that serves as a heat transfer path.

However, it is possible to suppress the heat from the peripheral wall of the casing 1 that attempts to transfer heat to the circuit board 7, and it is possible to suppress the heat from the peripheral wall of the casing 1, which attempts to transfer heat to the circuit board 7. It is possible to prevent the electronic components that make up the inverter circuit from being heated by conductive heat.

Therefore, it is possible to downsize the fluorescent lamp device. According to experiments, by applying the gap structure, the diameter was [65~70+smJ] and the length was [170~1g].
(The fluorescent lamp device, which was about the size of IlemJ, was
ml, and the length could be made small to about 140 to 150 mIIJ.

Moreover, it is sufficient to simply provide the gap 15, and the structure is simple.

Note that in this embodiment, the circuit board 7 is not limited to a shape smaller than the inner diameter of the casing 1; for example, the shape is rectangular or polygonal, and the gap 15 is formed between the opposite sides of the circuit board 7 and the peripheral wall of the casing 1. It may be configured.

Further, the present invention is not limited to the first embodiment, but can be applied to the second embodiment shown in FIG. 3, FIGS. 4 and 5.
The third embodiment shown in the figure may also be used.

That is, in the second embodiment, the casing 20 is divided into a main body part 21 on the circuit board 7 side and a main body part 22 on the fluorescent lamp 5 side.
It is divided into two parts, and the two are connected via an air layer 23.

According to this structure, since the air layer 23 serves as a heat insulating layer, the heat from the peripheral wall of the casing 1 that attempts to transfer heat to the circuit board 7 can be further suppressed. According to an experiment, the temperature of the main body portion 22 on the side of the fluorescent lamp 5 was "1".
When the temperature was 50°C, a considerable decrease in temperature was observed in each part as shown in FIG.

Therefore, compared to the first embodiment, the fluorescent lamp device can be further downsized, and the output (power) of the fluorescent lamp device can be increased by suppressing heat from the peripheral wall of the casing 1. brings benefits that can be achieved.

9b as one block and installed on the circuit board 7.

That is, as shown in FIG. 4, a block capacitor has a structure in which, for example, two individual film capacitor elements 9a and 9b are arranged in parallel, the surroundings are covered with an exterior resin 11, and the two are connected. It has become. In other words,
Two or more film capacitor elements 9a in the same exterior
, 9b, resulting in a block-shaped capacitor. Note that in this embodiment, four lead wires 12 are extended in the vertical direction. Then, this block-shaped capacitor is attached to the patterned surface of the circuit board 7 like other electronic components. Specifically, after each lead wire 12 of the block capacitor is inserted into the component insertion hole 7a of the circuit board 7,
It is connected to the pattern surface of the circuit board 7 by soldering.

If this type of installation is structured, high-density mounting (surface) can be achieved, and the size of the fluorescent lamp device can be reduced accordingly. Moreover, the quality of the lighting circuit device 6 is also improved. Namely. Since the film capacitor elements 9a and 9b alone are thin and small, it is difficult to stand them stably on the circuit board 7, which causes shaking and vibration during soldering and causes conduction failure. This is because the individual cables 9a and 9b are made into one block, which provides stability and enables reliable soldering.

In this embodiment, the film capacitor 9 is soldered to the circuit board 7 using the lead wire 12 extending vertically, but as in another embodiment shown in FIG. Alternatively, the solder may be soldered to the patterned surface of the circuit board 7.

[Effects of the Invention] As described above, according to the present invention, it is possible to reduce the size of the device and prevent heating of lighting circuit components due to conduction heat. Moreover, the structure is simple because it is only necessary to provide a gap.

1

[Brief explanation of the drawing]

1 and 2 show a first embodiment of the invention,
FIG. 1 is a plan sectional view of the circuit board and its surroundings taken along line A-A in FIG. 2, FIG. 2 is a side sectional view showing the overall structure of the fluorescent lamp device, and FIG. FIG. 4 is a cross-sectional view showing a block-shaped capacitor which is the main part of a third embodiment of the present invention, and FIG. 5 shows the state in which the block-shaped capacitor is mounted. Perspective view, No. 6
The figure is a perspective view showing how different block-shaped capacitors are mounted. 1... Casing, 5... Fluorescent lamp, 7...
Circuit board, 8,9.10...electrolytic capacitor, film capacitor, transistor (lighting circuit parts),
15... Gap.

Claims (1)

[Claims] In a fluorescent lamp device configured by inserting a circuit board on which lighting circuit components are mounted into a casing and connecting a fluorescent lamp driven by the lighting circuit components to the casing, the outer periphery of the circuit board A fluorescent lamp device characterized in that a gap is provided between an end and a peripheral wall of the casing facing the end.