JPH03153105A - Trimming method for resistive terminator - Google Patents

Trimming method for resistive terminator

Info

Publication number
JPH03153105A
JPH03153105A JP1291189A JP29118989A JPH03153105A JP H03153105 A JPH03153105 A JP H03153105A JP 1291189 A JP1291189 A JP 1291189A JP 29118989 A JP29118989 A JP 29118989A JP H03153105 A JPH03153105 A JP H03153105A
Authority
JP
Japan
Prior art keywords
resistance
width
wide spread
resistance film
resistive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1291189A
Other languages
Japanese (ja)
Inventor
Hitoshi Tomita
富田 均
Yutaka Ikeda
豊 池田
Takushi Kunimoto
国本 琢司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FDK Corp
Original Assignee
FDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FDK Corp filed Critical FDK Corp
Priority to JP1291189A priority Critical patent/JPH03153105A/en
Publication of JPH03153105A publication Critical patent/JPH03153105A/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Reversible Transmitting Devices (AREA)
  • Waveguides (AREA)

Abstract

PURPOSE:To prevent an extreme current concentration from being caused onto a resistance film by forming a wide spread part expanding partially the width of a strip resistance film in advance to a resistive terminator used for a microwave circuit and matching a resistance between electrodes with a reference value while the wide spread part is being cut gradually. CONSTITUTION:A wide spread part 4a spreading locally the width is formed to one side in the middle of the beltlike resistance film 4. While the resistance between the electrodes 2 and 3 is being measured, the wide spread part 4a is gradually cut by a laser trimming device and the resistance is accurately matched to the reference value. Since a cut part 5 exists in the wide spread part 4a in this way, the width of the resistance film 4 is not extremely made narrow. Thus, no extreme current concentration is caused in the resistance film, resulting that the resistive terminator with a high dielectric strength is easily realized in a limited component size.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明はマイクロ波回路に使用される無反射終端器に
関し、特に、電極間の抵抗値を正確に基準値に合わせる
トリミング方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a non-reflection terminator used in a microwave circuit, and more particularly to a trimming method for accurately adjusting the resistance value between electrodes to a reference value.

(従来の技術) 第4図(A)(B)に無反射終端器の代表的な構造を示
している。直方体形状の基板1はアルミナ、フェライト
、ベリリア、チッ化アルミニウム等のセラミンクスから
なる。基板1には金、銀、銅等の導電性のよい金属材料
で2つの電極部2とと3が形成されてる。基板1の上面
部分において電極部2と3は相対向する両端部分に形成
されており、この電極部2と3の間に抵抗膜4が帯状に
形成されている。抵抗膜4の材料としては、薄膜の場合
チッ化タンタル、ニクロ11等が使用され、厚膜の場合
は酸化ルテニウム、銀−バラジュウム合金等が使用され
る。抵抗膜4を形成する段階では、電極部2.3間の抵
抗値が基準値(50Ω)より若干小さくなるように設計
されている。
(Prior Art) Figures 4(A) and 4(B) show typical structures of non-reflection terminators. The rectangular parallelepiped-shaped substrate 1 is made of ceramics such as alumina, ferrite, beryllia, and aluminum nitride. Two electrode parts 2 and 3 are formed on the substrate 1 using a highly conductive metal material such as gold, silver, or copper. Electrode portions 2 and 3 are formed at opposite ends of the upper surface of the substrate 1, and a resistive film 4 is formed in a strip shape between the electrode portions 2 and 3. As the material for the resistive film 4, tantalum nitride, Nichrome 11, etc. are used in the case of a thin film, and ruthenium oxide, silver-baladium alloy, etc. are used in the case of a thick film. At the stage of forming the resistive film 4, the resistance value between the electrode parts 2 and 3 is designed to be slightly smaller than the reference value (50Ω).

製造工程のほぼ最終段階で電極部2.3間の抵抗値を測
定しながら、レーザトリミング装置などにより第4図(
C)(D)に示すように抵抗膜4を部分的に削除しく5
は削除部分)抵抗値を基準値に正確に合わせる。
At almost the final stage of the manufacturing process, while measuring the resistance value between the electrode parts 2 and 3, a laser trimming device or the like is used to measure the resistance value shown in Figure 4 (
C) Partially remove the resistive film 4 as shown in (D).
(deleted part) Adjust the resistance value exactly to the reference value.

(発明が解決しようとする課題) 第4図に示すように、従来の無反射終端器では抵抗膜4
は均一な幅の帯状に形成され、トリミングにより幅方向
に局部的に削除している。従って削除部5が形成された
部分の抵抗膜4の幅が非常に狭くなり、その狭い部分に
電流が集中することになる。電流値が小さい場合は問題
ないが、高電力マイクロ波回路に使用した場合、無反射
終端器の抵抗膜4に比較的大きな電流が流9れ、その電
流か一部に集中すると、素子が過熱して破壊する。
(Problems to be Solved by the Invention) As shown in FIG. 4, in the conventional non-reflection terminator, the resistive film 4
is formed into a strip of uniform width, and is locally removed in the width direction by trimming. Therefore, the width of the resistive film 4 at the portion where the deleted portion 5 is formed becomes extremely narrow, and the current is concentrated in that narrow portion. There is no problem if the current value is small, but when used in a high-power microwave circuit, a relatively large current flows through the resistive film 4 of the non-reflective terminator, and if that current is concentrated in a portion, the element may overheat. and destroy it.

つまり従来のトリミング方法では、耐電力の高い無反射
終端器を限られた素子寸法で実現するのか難しかっt二
In other words, with conventional trimming methods, it is difficult to realize a high-power-resistant, non-reflection terminator with limited element dimensions.

この発明は前述した従来の問題点に鑑みなされたもので
、その目的は、抵抗膜に極端な電流集中が起きないよう
に12だ無反射終端器のトリミング方法を提供すること
にある。
This invention was made in view of the above-mentioned conventional problems, and its purpose is to provide a method for trimming a non-reflective terminator so as to prevent extreme current concentration from occurring in the resistive film.

(課題を解決するための手段) そこでこの発明では、前記抵抗膜の幅を局部的に拡大1
.た拡幅部を予め形成しておき、この拡幅部を徐々に削
除しながら電極部間の抵抗値を基桑値に合イつせるよう
にl〜た。
(Means for Solving the Problems) Therefore, in the present invention, the width of the resistive film is locally enlarged.
.. A widened portion was formed in advance, and this widened portion was gradually removed so that the resistance value between the electrode portions matched the base value.

(作 用) 前記抵抗膜にηめ形成しである前記拡幅部を削除しなが
ら抵抗値を調整するので、トリミングを施した部分が他
の部分より幅が狭くはならず、電流の集中箇所は牛しな
い。
(Function) Since the resistance value is adjusted while removing the widened portion formed on the resistive film, the width of the trimmed portion does not become narrower than other portions, and the current concentration point is No cow.

(実施例) 第1図(A )は本発明の一実施例による無反射終端器
のトリミング前の状態を示(7ている。1は基板、2と
3は電極部、・4は抵抗膜であり、その材料は前述した
通りである。この実施例の特徴は、j;)状の抵抗膜4
の中間部分の片側に局部的に幅を拡大りまた拡幅部、4
 aを形成し、た点にある。そL −C第1図(B)(
C)に示すように、電極部2と3間の抵抗値を測定しな
からレーザトリミング装置などにより、抵抗膜4の拡幅
部4aを徐々に削除し、抵抗値を基準値に正確に合わせ
る。、15はトリミングにより抵抗膜4を削除した部分
を示す。このように削除部5が拡幅部4aにあるので、
抵抗lI!2!、 4の幅を極端に狭める箇所は発生l
−ない。
(Example) Figure 1 (A) shows the state before trimming of a non-reflective terminator according to an example of the present invention (7). 1 is a substrate, 2 and 3 are electrode parts, and 4 is a resistive film. The material is as described above.The feature of this embodiment is that the j;)-shaped resistive film 4
The width is locally expanded on one side of the middle part of the
Form a and be at the point. SoL-CFigure 1 (B) (
As shown in C), after measuring the resistance value between the electrode parts 2 and 3, the widened part 4a of the resistive film 4 is gradually removed using a laser trimming device or the like to accurately match the resistance value to the reference value. , 15 indicates a portion where the resistive film 4 has been removed by trimming. In this way, since the deleted portion 5 is located in the widened portion 4a,
Resistance lI! 2! , The part where the width of 4 is extremely narrow occurs.
-No.

第2図は本発明の第2実施例を示し、(A)はトリミン
グ前、(B)はトリミング後である。この実施例では抵
抗膜4の両端側に2箇所の拡幅部4a、4))を予め形
成しておき、この拡幅部4a、4bにトリミングによる
削除部5を成形する。
FIG. 2 shows a second embodiment of the present invention, with (A) before trimming and (B) after trimming. In this embodiment, two widened portions 4a, 4)) are formed in advance on both ends of the resistive film 4, and removed portions 5 are formed by trimming on these widened portions 4a, 4b.

第3図は抵抗膜4に形成する拡幅部4a、4k〕のさま
ざまな形態例を示している。
FIG. 3 shows various examples of the widened portions 4a, 4k formed in the resistive film 4.

(発明の効果) 以−L詳細に説明したように、この発明の無反射終端器
のトリミング方法では、予め形成しである抵抗膜の拡幅
部を削除しながら抵抗値を基準値に合わせるので、トリ
ミングによる削除部ができても抵抗膜の幅が極端に狭く
なる箇所は発生しない。
(Effects of the Invention) As explained in detail below, in the trimming method of the non-reflective terminator of the present invention, the resistance value is adjusted to the reference value while removing the widened portion of the resistive film that has been formed in advance. Even if a portion is removed by trimming, there will be no portion where the width of the resistive film becomes extremely narrow.

そのため抵抗膜中に極端な電流集中は起きず、その結果
耐電力の高い無反射終端器を限られた未了=J−法にて
容易に実現することができる。
Therefore, extreme current concentration does not occur in the resistive film, and as a result, a non-reflection terminator with high power resistance can be easily realized using the limited termination=J- method.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(A)は本発明の一実施例によるトリミング前の
無反射終端器の平面図、同図(B)(C)はトリミング
後の無反射終端器の平面図、第2図(A)は本発明の第
2実施例によるトリミング前の無反射終端器の平面図、
同図(B)はl・リミング後の無反射終端器の平面図、
第3図(A)〜(C)は本発明による拡幅部を形成した
抵抗膜のさまざまなバクーンを示す平面図、第4図(A
)は従来の無反q、tp端器のトリミング]1ijの平
面図、同図(B)はその西+Jxj図、同図CC)(D
)はトリミング後の゛I4面図「ある。 ・基板 ・・電極部 ・・抵抗膜 4b・・拡幅部 ・・・・・シリミングによる削除部 1   ・・   3 4 ・・・・・ a 5 ・・
FIG. 1(A) is a plan view of a non-reflective terminator before trimming according to an embodiment of the present invention, FIG. 1(B) and (C) are plan views of a non-reflective terminator after trimming, and FIG. ) is a plan view of the non-reflection terminator before trimming according to the second embodiment of the present invention,
Figure (B) is a plan view of the non-reflection terminator after l-rimming.
FIGS. 3(A) to 3(C) are plan views showing various backings of the resistive film formed with the widened portion according to the present invention, and FIG. 4(A)
) is a plan view of conventional unreflected q, trimming of tp terminal equipment] 1ij, the same figure (B) is the west + Jxj figure, the same figure CC) (D
) is the "I4 side view" after trimming. ・Substrate...Electrode section...Resistance film 4b...Width section...Removed section by shirring 1...3 4...A 5...

Claims (1)

【特許請求の範囲】[Claims]  基板上に形成された2つの電極部の間に抵抗膜を帯状
に形成した無反射終端器において、前記抵抗膜の幅を局
部的に拡大した拡幅部を予め形成しておき、この拡幅部
を徐々に削除しながら前記電極部間の抵抗値を基準値に
合わせることを特徴とする無反射終端器のトリミング方
法。
In a non-reflective terminator in which a resistive film is formed in a strip shape between two electrode parts formed on a substrate, a widened part is formed in advance by locally enlarging the width of the resistive film, and this widened part is A method for trimming a non-reflective terminator, comprising adjusting the resistance value between the electrode portions to a reference value while gradually removing the electrode portions.
JP1291189A 1989-11-10 1989-11-10 Trimming method for resistive terminator Pending JPH03153105A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1291189A JPH03153105A (en) 1989-11-10 1989-11-10 Trimming method for resistive terminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1291189A JPH03153105A (en) 1989-11-10 1989-11-10 Trimming method for resistive terminator

Publications (1)

Publication Number Publication Date
JPH03153105A true JPH03153105A (en) 1991-07-01

Family

ID=17765614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1291189A Pending JPH03153105A (en) 1989-11-10 1989-11-10 Trimming method for resistive terminator

Country Status (1)

Country Link
JP (1) JPH03153105A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08154005A (en) * 1994-11-28 1996-06-11 Fujitsu Ltd Resistance attenuator
CN107342450A (en) * 2017-07-11 2017-11-10 中国电子科技集团公司第十六研究所 A kind of design method for the superconducting microstrip resonator that frequency can be accurately adjusted with laser

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63214002A (en) * 1987-03-02 1988-09-06 Murata Mfg Co Ltd Resistance adjustment method for termination resistive element with respect to strip line

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63214002A (en) * 1987-03-02 1988-09-06 Murata Mfg Co Ltd Resistance adjustment method for termination resistive element with respect to strip line

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08154005A (en) * 1994-11-28 1996-06-11 Fujitsu Ltd Resistance attenuator
CN107342450A (en) * 2017-07-11 2017-11-10 中国电子科技集团公司第十六研究所 A kind of design method for the superconducting microstrip resonator that frequency can be accurately adjusted with laser

Similar Documents

Publication Publication Date Title
CA2217155C (en) Buried layer capacitor
JPH0738321B2 (en) Bulk metal chip resistors
US4869671A (en) Electrical connector for printed circuit board
JPH03153105A (en) Trimming method for resistive terminator
JP2001176701A (en) Resistor and its manufacturing method
JP2002075714A (en) Low resistor and its manufacturing method
US3588974A (en) Method of manufacturing an electronic component
JPH08250906A (en) Method for manufacturing dielectric filter
JPH11186691A (en) Trimming method of circuit element and circuit element using the same
JPH05109513A (en) Formation of thick film resistor
KR100367560B1 (en) Monolayered surface mounting chip device
KR200208766Y1 (en) Monolayered surface mounting chip device
JPS62109418A (en) Chip-shaped delay element
JPH02288038A (en) Fuse and its manufacture
JPH0132363Y2 (en)
JP4383912B2 (en) Chip-type fuse and manufacturing method thereof
JPH04125904A (en) Resistor trimming method and resistor
JPH0684618A (en) Formation of thick film resistor
JPH0983215A (en) Small sized chip attenuator for microwave and manufacture thereof
JP2976698B2 (en) Electronic component manufacturing method
JPH07202521A (en) Micro wave circuit
JPH10106808A (en) Chip ntc thermistor
JPH0738060A (en) Membrane Capacitor and Trimming Method Thereof
JP2000208303A (en) Chip-type ceramic electronic component and method for adjusting its characteristic value
JPH10321403A (en) Manufacturing method of resistor