JPH031541U - - Google Patents

Info

Publication number
JPH031541U
JPH031541U JP1989060433U JP6043389U JPH031541U JP H031541 U JPH031541 U JP H031541U JP 1989060433 U JP1989060433 U JP 1989060433U JP 6043389 U JP6043389 U JP 6043389U JP H031541 U JPH031541 U JP H031541U
Authority
JP
Japan
Prior art keywords
coupler
refrigerant
drain
flow path
refrigerant flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989060433U
Other languages
English (en)
Other versions
JPH0720922Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989060433U priority Critical patent/JPH0720922Y2/ja
Publication of JPH031541U publication Critical patent/JPH031541U/ja
Application granted granted Critical
Publication of JPH0720922Y2 publication Critical patent/JPH0720922Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案による電子基板の冷却構造を示
すもので、冷却運転時の状態を示す断面図、第２
図は装置補修時のクーリングプレートを示す断面
図、第３図は冷媒の排出状態を説明するクーリン
グプレートの斜視図、第４図は従来の電子基板の
冷却構造を示す断面図である。 図において、１０は電子基板、１１は半導体素
子、１２は冷媒流路、１３はクーリングプレート
、１６は冷媒入口、１７は冷媒出口、１８はドレ
インカプラ、１９は雄カプラ、２０は圧力調整弁
、２４は雌カプラ、２５はドレインホースである
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電子基板１０上に搭載された半導体素子１１に
    対して、冷媒を供給する冷媒流路１２と、この冷
    媒流路１２の端部に設置されるドレインカプラ１
    ８と、冷却運転時、冷媒流路１２内の冷媒圧を一
    定に維持する圧力調整弁２０を備えるとともに、
    上記ドレインカプラ１８に取り付けられる雄カプ
    ラ１９と、装着補修時、冷媒流路１２内の冷媒を
    外部に排出するドレインホース２５を備え、上記
    ドレインカプラ１８に取り付けられる雌カプラ２
    ４とを具備し、上記ドレインカプラ１８に対して
    、雄カプラ１９あるいは雌カプラ２４を選択的に
    併用したことを特徴とする電子基板の冷却構造。
JP1989060433U 1989-05-26 1989-05-26 電子基板の冷却構造 Expired - Lifetime JPH0720922Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Publications (2)

Publication Number Publication Date
JPH031541U true JPH031541U (ja) 1991-01-09
JPH0720922Y2 JPH0720922Y2 (ja) 1995-05-15

Family

ID=31587792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989060433U Expired - Lifetime JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Country Status (1)

Country Link
JP (1) JPH0720922Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015082565A (ja) * 2013-10-22 2015-04-27 富士通株式会社 電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015082565A (ja) * 2013-10-22 2015-04-27 富士通株式会社 電子機器

Also Published As

Publication number Publication date
JPH0720922Y2 (ja) 1995-05-15

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