JPH0367446U - - Google Patents

Info

Publication number
JPH0367446U
JPH0367446U JP1989128737U JP12873789U JPH0367446U JP H0367446 U JPH0367446 U JP H0367446U JP 1989128737 U JP1989128737 U JP 1989128737U JP 12873789 U JP12873789 U JP 12873789U JP H0367446 U JPH0367446 U JP H0367446U
Authority
JP
Japan
Prior art keywords
cooling
cooling chamber
semiconductor device
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989128737U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128737U priority Critical patent/JPH0367446U/ja
Publication of JPH0367446U publication Critical patent/JPH0367446U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例による浸漬冷却モジ
ユールの構造を示す断面図、第２図は本実施例の
ノズルを示す拡大斜視図、第３図は作用を示す斜
視図、第４図は従来の浸漬冷却モジユールの構造
を示す断面図、第５図は課題を示す断面図である
。 図において、１……プリント基板、２……ＬＳ
ｉ、２−３……リード端子、５……シール部材、
１３……冷媒供給板、１３ａ……供給口、１３ｂ
……流路、１３ｃ……排出口、１３ｄ……冷却室
、１４……ノズル、１４ａ……噴射口、を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体装置２を主面に実装したプリント基板１
    と、 一面側に上記半導体装置を密封して冷却する冷
    却室１３ｄを形成して、他面側に冷却液を該冷却
    室１３ｄに供給する手段１３ａ，１３ｄおよび排
    出口１３ｃを設け、上記供給手段１３ｂと導通す
    る貫通孔を、該冷却室１３ｄの上記プリント基板
    １に実装した各隣接する該半導体装置２間の中央
    部と対向する位置に穿設した冷媒供給板１３と、 一端側を前記貫通孔に挿入して上記冷媒供給板
    １３の該供給手段１３ｂと接続させ、他端側に上
    記半導体装置２の外周より前記冷却液を噴射する
    噴射口１４ａを設けたＪ字形ノズル１４とから構
    成したことを特徴とする浸漬冷却モジユールの構
    造。
JP1989128737U 1989-11-01 1989-11-01 Pending JPH0367446U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128737U JPH0367446U (ja) 1989-11-01 1989-11-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128737U JPH0367446U (ja) 1989-11-01 1989-11-01

Publications (1)

Publication Number Publication Date
JPH0367446U true JPH0367446U (ja) 1991-07-01

Family

ID=31676423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128737U Pending JPH0367446U (ja) 1989-11-01 1989-11-01

Country Status (1)

Country Link
JP (1) JPH0367446U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026066182A (ja) * 2024-10-06 2026-04-16 リクアクール アイピー エルエルシー 密封液体冷却システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026066182A (ja) * 2024-10-06 2026-04-16 リクアクール アイピー エルエルシー 密封液体冷却システム

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