JPH03155643A - Discrimination of wafer - Google Patents
Discrimination of waferInfo
- Publication number
- JPH03155643A JPH03155643A JP29550589A JP29550589A JPH03155643A JP H03155643 A JPH03155643 A JP H03155643A JP 29550589 A JP29550589 A JP 29550589A JP 29550589 A JP29550589 A JP 29550589A JP H03155643 A JPH03155643 A JP H03155643A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- discrimination
- holes
- identification
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 36
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、半導体製造におけるウェハー識別方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer identification method in semiconductor manufacturing.
（従来の技術１
従来のウェハー識別方法としては、ウェハーの表面にレ
ーザビームを照射しウェハーに識別用の文字を形成し、
ＣＯＤカメラによりその文字を操影し、パターン認識装
置により文字を認識してウェハーの識別を行っていた。(Prior art 1) A conventional wafer identification method involves irradiating the surface of the wafer with a laser beam to form identification characters on the wafer.
The wafers were identified by manipulating the characters with a COD camera and recognizing them with a pattern recognition device.
〔発明が解決しようとする課題１
しかし、前述の従来技術では、ウェハーの加工処理が行
なわれるにつれて、ウェハーの表面に膜が付くため認識
が困難となるという課題を有していた。[Problem to be Solved by the Invention 1] However, the above-mentioned conventional technology has a problem in that as the wafer is processed, a film is formed on the surface of the wafer, making it difficult to recognize it.
そこで本発明は従来のこのような課題な解決するために
、ウェハーの加工処理が行われてもウェハーの識別を可
能にする方法を提供することを目的とする。SUMMARY OF THE INVENTION In order to solve these conventional problems, it is an object of the present invention to provide a method that makes it possible to identify a wafer even after the wafer is processed.
［課題を解決するための手段］
上記課題を解決するため本発明のウェハー識別方法は
１）ウェハー表面上に形成されたウェハー識別手段によ
り、ウェハーを識別するウェハー識別方法において、前
記ウェハー識別手段が、ウェハー表面に形成された１個
乃至複数個の穴であることを特徴とする。[Means for Solving the Problems] In order to solve the above problems, the wafer identification method of the present invention includes 1) a wafer identification method for identifying a wafer by a wafer identification means formed on a wafer surface, wherein the wafer identification means is , one or more holes formed on the wafer surface.
２）ウェハー識別手段がウェハー表面に形成された１個
乃至複数個の溝であることを特徴とする。2) The wafer identification means is characterized by one or more grooves formed on the wafer surface.
３）ウェハー識別手段がウェハー表面に形成された１個
乃至複数個の黒色パターンであることを特徴とする。3) The wafer identification means is characterized by one or more black patterns formed on the wafer surface.
［実 施 例］ 以下に本発明の実施例を図面をもとに説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.
第１図及びその第１図の断面図を示す第２図において、
ウェハーｌの周辺部に識別用の手段として穴２を設ける
。この識別用の穴２の配置はコード化することにより、
識別のための情報が付与されている。In FIG. 1 and FIG. 2 showing a cross-sectional view of FIG. 1,
A hole 2 is provided at the periphery of the wafer 1 as a means for identification. The arrangement of this identification hole 2 can be coded.
Information for identification is given.
ウェハーの識別は第３図に示すように、識別用手段と対
応して配置された検出手段、例えば反射型の光センサ−
３ａ 、ｂにより識別用の穴２を読みとる。光センサー
投光部３ａより発せられた光は、穴２により反射角が変
わるため光センサー受光部３ｂに入らなくなる。As shown in FIG. 3, the wafer is identified using a detection means, such as a reflective optical sensor, arranged in correspondence with the identification means.
Read the identification hole 2 using 3a and 3b. The light emitted from the light sensor light emitting section 3a does not enter the light sensor light receiving section 3b because the reflection angle is changed by the hole 2.
以上のようにして、ウェハー上の多穴の有無を検出し、
識別用の穴の配置パターンを検出することにより、コー
ド化された情報を得ることができ、ウェハーの識別が可
能となる。In the above manner, the presence or absence of multiple holes on the wafer is detected,
By detecting the arrangement pattern of the identification holes, coded information can be obtained, making it possible to identify the wafer.
このようなウェハーに穴を設けるという方法によりウェ
ハーの加工処理が進んでも識別用の穴が変化することな
く確実に安定した識別が可能となる。This method of providing holes in the wafer allows reliable and stable identification without changing the identification holes even as the wafer processing progresses.
また、第４図および第５図に示すようにウェハー１に設
けられた識別手段が穴の代わりに溝４あるいは黒色パタ
ーン５であっても同様である。Further, as shown in FIGS. 4 and 5, the same applies even if the identification means provided on the wafer 1 is a groove 4 or a black pattern 5 instead of a hole.
〔発明の効果］
本発明は、以上述べたように、ウェハーの表面上に穴又
は溝又は黒色パターンを設けたという簡単な構造によっ
て、ウェハーの加工処理が行なわれても誤検出がなく、
確実で安定したウェハーの識別を可能にする効果がある
。[Effects of the Invention] As described above, the present invention has a simple structure in which holes, grooves, or black patterns are provided on the surface of the wafer, so that there is no false detection even when the wafer is processed.
This has the effect of enabling reliable and stable wafer identification.
第１図は、本発明のウェハー識別手段を示す図。
第２図は、本発明のウェハー識別手段としての穴の断面
図。
第３図は、ウェハー識別手段のウェハー識別方法を示す
図。
第４図は、本発明のウェハー識別手段としての溝の断面
図。
第５図は１本発明のウェハー識別手段としての黒色パタ
ーンの説明図。
５・・・黒色パターン
以上FIG. 1 is a diagram showing wafer identification means of the present invention. FIG. 2 is a sectional view of a hole as a wafer identification means of the present invention. FIG. 3 is a diagram showing a wafer identification method of the wafer identification means. FIG. 4 is a sectional view of a groove as a wafer identification means of the present invention. FIG. 5 is an explanatory diagram of a black pattern as a wafer identification means of the present invention. 5...Black pattern or more
Claims (3)
より、ウェハーを識別するウェハー識別方法において、
前記ウェハー識別手段が、ウェハー表面に形成された１
個乃至複数個の穴であることを特徴とするウェハー識別
方法。(1) A wafer identification method for identifying a wafer using a wafer identification means formed on the wafer surface,
The wafer identification means is formed on the wafer surface.
A wafer identification method characterized by having one or more holes.
個乃至複数個の溝であることを特徴とするウェハー識別
方法。(2) Wafer identification means formed on the wafer surface 1
A wafer identification method characterized by having one or more grooves.
個乃至複数個の黒色パターンであることを特徴とするウ
ェハー識別方法。(3) Wafer identification means formed on the wafer surface 1
A wafer identification method characterized by having one or more black patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29550589A JPH03155643A (en) | 1989-11-14 | 1989-11-14 | Discrimination of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29550589A JPH03155643A (en) | 1989-11-14 | 1989-11-14 | Discrimination of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03155643A true JPH03155643A (en) | 1991-07-03 |
Family
ID=17821482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29550589A Pending JPH03155643A (en) | 1989-11-14 | 1989-11-14 | Discrimination of wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03155643A (en) |
-
1989
- 1989-11-14 JP JP29550589A patent/JPH03155643A/en active Pending
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