JPH03158232A - Manufacture of laminate - Google Patents

Abstract

PURPOSE:To enhance the productivity in the manufacture of printed wiring board by a method wherein laminate, which is formed by piling up the required number of resin-impregnated base materials prepared by impregnating the band-like base material in continuous form with flexible resin and on the upper and lower sides of which metal foil is arranged, is continuously hardened under heat and no pressure and then cooled and finally taken up. CONSTITUTION:A plurality of band-like base materials 1 in continuous form, which are unwound after having been coiled, are run upper and lower in the vertical plane and cast from above with flexible resin varnish in order to manufacture resin- impregnated base material 2. Nest a plurality of the resin-impregnated base material 2 are piled up by being passed between a pair of rollers 5 and 6 so as to urge metal foils 3 on both sides of the piled-up base materials in order to form laminate 4. After that, the laminate 4 is passed through a heating oven 7 so as to be continuously har dened under heat and no pressure. Next, the hardened laminate is passed through a cooling oven 8 so as to be cooled in order to manufacture laminate A in continuous form. After that, the laminate A is taken up and stored. When the manufacturing of printed wiring board is wanted, the laminate A is unwound and out in required sizes. Thus, cutting loss is reduced and consequently productivity can be enhanced.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to the production of laminates by a continuous pressureless process.

[Prior art]

Conventionally, in the continuous pressureless method, the material is cut into required dimensions after being heated and cured. In this case, most of the pieces are cut to a size of 1×1 m. When manufacturing a printed wiring board from this 1x1 size, it is cut into a required size, such as 30x30c or 1010x40.

[Problem to be solved by the invention]

In the past, productivity was low due to large losses due to cutting to the required size. The present invention has been made in view of the above circumstances, and its purpose is to reduce the size
It is an object of the present invention to provide a method for manufacturing a laminated board, which can reduce loss due to cutting of the stock and improve productivity. Means for Solving Problem K] In the method for manufacturing a laminate of the present invention, after impregnating a long strip-shaped base material 1 with a flexible resin, a required number of resin-impregnated base materials 2 are stacked, and the upper surface and/or Or a laminate 4 with metal foil 3 disposed on the bottom surface
It is characterized by continuously heating and curing the material without pressure, cooling it, and winding it up, and this structure solves the above problem. [Function 1] Laminated board A can be wound up, so when manufacturing printed wiring boards, it can be unwound and cut into a predetermined size, reducing loss due to cutting and increasing productivity. It is. The present invention will now be described in detail with reference to the accompanying drawings. Examples of the visible resin used in the present invention include modified epoxy resins, modified unsaturated polyester resins, modified 7-enol resins, and modified polyimide resins, and means for modifying these resins include aliphatic modification, rubber modification, and the like. Paper, glass cloth, glass nonwoven fabric, plus paper, synthetic fiber cloth, and synthetic fiber nonwoven fabric are used as the elongated strip-shaped base material 1, and the plus base material is preferable as the electrical laminate. A long strip base material 1 wound into a coil is unwound and continuously flowed upward and downward in plurality, and a flexible resin varnish is flowed from above to produce a resin-impregnated base material 2. In this case, the long strip-shaped base material 1 may be immersed in a flexible resin varnish. Next, a plurality of resin-impregnated base materials 2 are passed between a pair of rollers 5.6 to be stacked, and metal M3 is pressed against both surfaces of the base materials 2 to form a laminate 4. As the metal M3, copper, aluminum, iron, nickel, zinc, etc., or foils of alloys thereof can be used. Thereafter, the laminate 4 is passed through a heating furnace 7 and continuously heated and cured without pressure. Next, the long laminate A is passed through a cooling furnace 8 and cooled.
is manufactured. The cooling is preferably rapid cooling, for example, cooling in water. Thereafter, it is rolled up and stored, and when manufacturing a printed wiring board, it is rewound and cut into a required size. Next, embodiments of the present invention will be specifically described. (Example) A visible epoxy resin (product number "871", manufactured by Shell Kagaku Co., Ltd.) was applied to a long plush cloth (product number RL 16 El, manufactured by Nitto Boseki Co., Ltd.) with a thickness of 0.11 mm and a width of 1050 mm.
Six sheets impregnated with an epoxy resin varnish consisting of 100 parts by weight, 4 parts by weight of dicyandiamide, and 0.2 parts by weight of benzyldimethylamine so that the resin amount is 45% by weight are stacked, and the upper and lower surfaces thereof are further coated with a thickness of 0.5%. A laminate was obtained by stacking 0351 m of copper foil. Next, the laminate was continuously carried into a heating furnace, heated and cured at 165°C for 20 minutes under no pressure, then rapidly cooled to 60°C in water, and then wound around a paper tube with a diameter of ioam to a thickness of 0. .6m-
A double-sided copper-clad laminate was manufactured. (Comparative example) Epoxy resin (product number r8) instead of flexible epoxy resin
A double-sided copper-clad laminate was manufactured in the same manner as in the example except that 28J (manufactured by Shell Chemical Co., Ltd.) was used. However, since the laminated board cannot be rolled up, it is 101000X1000.
I had to cut it off. In order to manufacture printed wiring boards from the double-sided copper-clad laminates of Examples and Comparative Examples, the double-sided copper-clad laminates of Examples were rewound and cut into required sizes, and the double-sided copper-clad laminates of Examples and Comparative Examples were When a double-sided steel-clad laminate measuring 101,000 x 1,000 was cut into the required size, the cutting loss in the example was 1/2 that of the comparative example. Effect of the invention 1 In the present invention, after impregnating a long strip-shaped base material with a flexible resin, a required number of resin-impregnated base materials are stacked, and a metal foil is arranged on the upper and/or lower surfaces. Since the prepared laminate is continuously heated and cured without pressure, then cooled and rolled up, long laminates can be rolled up and stored, and when manufacturing printed wiring boards, they can be rewound to the desired size. By cutting, the loss due to cutting can be reduced and productivity can be increased.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the steps of an embodiment of the present invention, in which A is a laminate, 1 is a long strip-shaped base material, 2 is a resin-impregnated base material, and 3 is a laminate board.
4 is a copper foil, and 4 is a laminate.

Claims (2)

[Claims] (1) After impregnating a long strip-shaped base material with a flexible resin, a required number of resin-impregnated base materials are stacked, and then a laminate with metal foil arranged on the upper and/or lower surfaces is continuously produced without pressure. A method for manufacturing a laminate, which comprises heating and curing, cooling, and winding. (2) The method for manufacturing a laminate according to claim 1, wherein the long strip-shaped base material is a glass base material.