JPH0316237A - Inner lead bonder - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Object of the invention 1 (Industrial application field) The present invention relates to an inner lead bonder.

(Prior art) In general, an inner lead bonder intermittently feeds out a carrier tape wound around a supply reel, winds it onto a take-up reel, and performs bonding at a bonding stage between the supply reel and the take-up reel. A semiconductor element is bonded to the rear tape by this means.

(The problem that Masaaki is trying to solve) By the way, conventionally, in this type of equipment, there is a device to check whether the semiconductor device is correctly supplied to the bonding stage at the bonding station, and a device to check whether the semiconductor device is correctly supplied to the bonding stage at the bonding station. We did not give up on checking to see if the lead was securely bonded.For this reason, for example, if the bonding work was performed without a semi-continuous element being supplied to the bonding stage,
Removal of this defective part 1 was carried out in the later inspection process.Also, suppose that a semiconductor element is supplied to the bonding stage, and if a bonding defect occurs, bonding cannot be avoided. A problem has arisen in that a semiconductor element is left behind on the bonding stage, and the semiconductor element to be supplied to the bonding stage in the next step is placed on top of the half-dead element left behind.

Therefore, the present invention aims to improve the yield of bonded products.

[Structure of the Invention] (Means for Solving the Problem) In order to achieve the above object, in the present invention, the semiconductor elements sequentially supplied to the bonding stage and the inner leads of the key/rear tape or lead frame are The sliding inner lead bonder is characterized in that the bonding stage is provided with a detection means for detecting the presence or absence of a semiconductor element.

(Function) Therefore, since it is possible to monitor the presence or absence of a semiconductor element in the bonding stage, for example, the presence or absence of a semiconductor element can be detected immediately before and after the supply operation of the semiconductor element to the bonding stage, and the presence or absence of the semiconductor element can be detected immediately before the supply operation.
If a "presence" signal is obtained immediately after the signal supply operation, it can be determined to be normal.

On the other hand, if there is a "present" signal immediately before the supply operation or a "no" signal immediately after the supply operation, it can be determined that the bonding condition or the supply condition of the semiconductor element is defective, and the product may be damaged by taking measures such as stopping Honda. Yield can be improved.

{Example} Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view schematically showing an example of the inner lead bonder of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG.
It is a partially enlarged view of the figure. In the figure, 1 is a supply reel;
Reference numeral 2 denotes a take-up reel, and the carrier tape 3 wound around the supply reel 1 is intermittently supplied from the supply reel 1 and wound by the take-up reel 2. Note that the Kyrelia tape 3 is made to run approximately horizontally over a predetermined distance between the supply reel 1 and the take-up reel 2 by a pair of noid rollers 4. 5 is a bonding station, and this bonding station 5 is provided with bonding means 6.

This bonding means 6 includes a bonding head 7, and a tool 8 provided at the tip of the bonding head 7 is
The tip thereof faces the upper surface of the carrier tape 3. 9
is a bonding stage, which is installed on an XY table 10, and by moving this XY table 10, a mounting table 11 on the bonding stage 9 is placed at the IHA where semiconductor elements are placed.
and the bonding position f2iB. Further, 121 is a field feeding arm, which holds the semiconductor pellets la with a suction portion at its tip and sequentially supplies them to the cultivation table 11 positioned at the semiconductor element feeding position. The details are described in, for example, Japanese Unexamined Patent Application Publication No. 107130/1982, and will therefore be omitted.

Here, the mounting table 11 is provided with a through hole 11a smaller than the outer diameter of the semiconductor element a, and the vacuum source 16 is connected to the through hole 11a4 through the piping 3, the electromagnetic valve 14, and the pressure sensor will be connected as appropriate.

Here, the solenoid valve 14 is operated by the control section 17 as follows. That is, the mounting table 11 of the bonding stage 9 is positioned at the semiconductor element feeding position A, and the transfer arm 12
From immediately before starting the feeding operation of the semiconductor element a until immediately before the mounting table 11 is positioned at the bonding position 7 B and the bonding operation is interrupted, the four through holes 11a and the vacuum source 16 are connected. It works like this.

On the other hand, the pressure sensor 15 measures the pressure in the piping immediately before the transfer arm 12 starts the supply operation of the semiconductor element a and immediately after the supply operation is finished, when the pressure sensor 15 is positioned at the semiconducting element supply position A. At the same time, a detection signal is output to the control unit 17.

Next, the operation of the above structure will be explained. First, bonding work is performed as follows. Semiconductor elements a are sequentially bonded to the Kyrelia tape 3 which is sequentially and intermittently supplied from the supply reel 1 by a bonding stage 6 provided in a bonding station 5. One semiconductor element a is supplied to the bonding stage 9 which is positioned at the semiconductor element supplying position A by the L1 feeding arm 12 onto the bonding stage 9. Next, by moving the XY table 10, the bonding stage 9 is moved to the bonding position B, and the element a on the mounting table 11 is moved.
is positioned directly below the tool 8. Then, the tool 8 descends. As a result, the semiconductor element a is bonded to the inner lead of the carrier tape 3 which is currently stopped.

Now, the mounting table 11 and the pressure sensor 15 will be explained with attention. First, after the mounting table 11 moves to the semiconductor element supplying position A, and immediately before the transfer arm 12 operates to supply the semiconductor elements to the mounting table 11, the through hole 11a opens at true '9! Source 16
It is in a state where it is not connected. Here pressure sensor 15
detects the pressure J in the pipe 13. If bonding was performed normally in the previous step, there should be no semiconductor element a on the mounting table 11 at this stage. In other words, in this state, air is sucked in through the through hole 11a, and compared to when the semiconductor element a is present in the mounting base 1,
The pressure sensor 15 will detect high pressure. That is, based on the detected value of this pressure sensor 15, the mounting table 11
It is possible to determine whether the semiconductor element a above is present or absent. Therefore, immediately before the semiconductor element feeding operation, when the semiconductor element "right" on the mounting table 11 is 111 constant, the LIJ control unit 17 controls the carrier tape 3 by the supply reel 1 and the take-up reel 2.
This time, the pitch movement of is stopped, and the feeding operation of the semiconductor element a by the transfer arm 12 is also stopped. Then, the mounting table 11 is moved to the bonding position B again, and the bonding operation is performed again.

On the other hand, when the mounting table 11 is moved to the semiconductor element feeding position A, if it is determined that the semiconductor element is "light", a new semiconductor element a will be supplied to the mounting table 11. Immediately after this supply operation ends, the pressure sensor Fj15 continues to detect whether the semiconductor element is present or absent. That is, immediately after the semiconductor element supply operation is completed, the pressure detected by the pressure hinger 15 should decrease because the through hole 11a is blocked by the semiconductor element a. However, if the supply operation is not performed normally, it is still determined that the semiconductor element is "absent".

In this case, the bonding stage 9 is not moved to the bonding position B, and the transport arm 12 is caused to perform the feeding operation of the semiconductor element a again.

As described above, in the above embodiment, U? is used to determine whether the bonding state and the supply state of the semiconductor element a are performed normally. U can be performed, and if it is not normal, it is possible to guide it to normal operation.

Therefore, it is possible to improve the yield of bonded products to a level of 1. Further, in the embodiment, the semiconductor element a supplied to the mounting table 11 of the bonding stage 9 is
Since the semiconductor is held from the semiconductor supply position A to the bonding position B by vacuum pressure, it is possible to prevent positional displacement due to vibrations caused by movement of the bonding stage 9. In addition, by detecting whether or not the semiconductor element a is present on the mounting table 11 of the bonding stage 9, when starting automatic operation of the bonder, the current state is grasped and the sequence is started from the optimum sequence. You can also do that.

In the above embodiment, the presence, absence, and 1 of the semiconductor element were detected by pressure detection using the pressure sensor 15. However, as an alternative to this, for example, an optical sensor may be installed at the semiconductor element feeding position A. Or a camera may be installed.

Furthermore, a defective bonding operation and a defective semiconductor element feeding operation are detected when the mounting table 11 is not positioned at the semiconductor element feeding position 8. However, the mounting table 11 may be positioned at the bonding position B, and a defective bonding operation may be detected immediately after the bonding operation is completed by lowering the tool. In this case, when a bonding defect is detected, the tool 8 can be lowered again while the position of the cutting board 11 remains unchanged, so that small bonding can be performed again in a short time.

In addition, in the embodiment, the bonding stage was positioned without moving, but the key? The rear tape side may be moved, or both may be moved relative to each other.

Note that Masaaki Hon's method can also be applied to a bonding device for lead frames and semiconductor elements.

[Effects of the Invention] According to the inner lead bonder by Bonmei Mok, it is possible to improve the yield of bonded products.

[Brief explanation of drawings]

FIG. 1 is a front view schematically showing an example of the inner lead bonder of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG.
A partially enlarged view of the figure is shown. 1... Supply reel, 2... Take-up reel, 3...
・Key 1-Rear tape, 5... Bonding station, 7... Bonding head, 8... Tool, 9
... bonding stage, 11 ... mounting table, 11
a...Through hole, 15...Pressure sensor +j (detection means)
, a... semiconductor element.

Claims (1)

[Claims] (1) An inner lead bonder for bonding semiconductor elements sequentially supplied to a bonding stage and inner leads of a carrier tape or a lead frame, characterized in that the bonding stage is provided with a detection means for detecting the presence or absence of a semiconductor element. inner lead bonder.