JPH0317580U - - Google Patents
Info
- Publication number
- JPH0317580U JPH0317580U JP7812289U JP7812289U JPH0317580U JP H0317580 U JPH0317580 U JP H0317580U JP 7812289 U JP7812289 U JP 7812289U JP 7812289 U JP7812289 U JP 7812289U JP H0317580 U JPH0317580 U JP H0317580U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insulating substrate
- semiconductor
- semiconductor device
- contactor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の実施例を示す要部側断面図、
第２図は本考案装置のソケツトへの半導体装置の
着脱を説明する要部側断面図、第３図は従来の半
導体製造装置の要部側断面図である。
FIG. 1 is a side sectional view of the main part showing an embodiment of the present invention;
FIG. 2 is a sectional side view of a main part of the apparatus of the present invention for explaining how to attach and remove a semiconductor device to a socket, and FIG. 3 is a sectional side view of a main part of a conventional semiconductor manufacturing apparatus.
Claims (1)
数本のリードを導出し各リードの中間部を同一方
向に折り曲げ半導体装置の各リード中間部乃至遊
端外面を絶縁基板に植立した接触子と接触させ通
電試験する半導体製造装置において、上記絶縁基
板に半導体装置を貫通する穴を穿設したことを特
徴とする半導体製造装置。 A plurality of leads are led out from the side wall of the exterior material covering the semiconductor pellet, the middle part of each lead is bent in the same direction, and the middle part or the outer surface of the free end of each lead of the semiconductor device is brought into contact with a contactor planted on an insulating substrate. 1. A semiconductor manufacturing device for carrying out a conduction test, characterized in that the insulating substrate has a hole penetrating through the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7812289U JPH0317580U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7812289U JPH0317580U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317580U true JPH0317580U (en) | 1991-02-21 |
Family
ID=31621113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7812289U Pending JPH0317580U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317580U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015166734A (en) * | 2014-02-13 | 2015-09-24 | セイコーインスツル株式会社 | IC inspection socket and inspection method using the same |
-
1989
- 1989-06-30 JP JP7812289U patent/JPH0317580U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015166734A (en) * | 2014-02-13 | 2015-09-24 | セイコーインスツル株式会社 | IC inspection socket and inspection method using the same |