JPH03177478A - Adhesive for metal-clad laminate - Google Patents
Adhesive for metal-clad laminateInfo
- Publication number
- JPH03177478A JPH03177478A JP31618689A JP31618689A JPH03177478A JP H03177478 A JPH03177478 A JP H03177478A JP 31618689 A JP31618689 A JP 31618689A JP 31618689 A JP31618689 A JP 31618689A JP H03177478 A JPH03177478 A JP H03177478A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive
- blending
- metal
- melamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 22
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 22
- 239000004640 Melamine resin Substances 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 7
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004840 adhesive resin Substances 0.000 claims abstract description 5
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000005007 epoxy-phenolic resin Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 abstract description 13
- 239000005011 phenolic resin Substances 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000007974 melamines Chemical class 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- -1 bisphenol F type Chemical compound 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属張積層板を製造する際に、金属箔と積層板
を接着するのに用いられる金属張積層板用接着剤に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an adhesive for metal-clad laminates used for bonding metal foil and laminates when manufacturing metal-clad laminates.
民生用電子機器の小型高機能化が進み、それに用いられ
る印刷配線板は高密度、微細配線化する傾向にある。こ
れに伴って印刷配線板に用いられる金属張積層板には高
密度実装が可能であることが要求されている。このため
金属張積層板に対しては、はんだ耐熱性や金属箔引き剥
がし強さ、耐トラツキング性などが強く要望されてきて
いる。BACKGROUND ART As consumer electronic devices become smaller and more sophisticated, the printed wiring boards used therein tend to have higher density and finer wiring. Along with this, metal-clad laminates used for printed wiring boards are required to be capable of high-density mounting. For this reason, there is a strong demand for metal-clad laminates to have solder heat resistance, metal foil peeling strength, tracking resistance, and the like.
これらの金属張積層板に用いられる接着剤には、ポリビ
ニルブチラール樹脂にエポキシ樹脂、フェノール樹脂、
メラミン樹脂などの熱硬化性樹脂を少なくとも１種類以
上配合したものが用いられてきた。この中で特にメラミ
ン樹脂は、はんだ耐熱性を向上させるのに効果があるこ
とが知られているが、このメラミン樹脂の硬化反応を促
進する目的で種々の触媒が用いられている。The adhesives used for these metal-clad laminates include polyvinyl butyral resin, epoxy resin, phenolic resin,
Materials containing at least one type of thermosetting resin such as melamine resin have been used. Among these, melamine resin is known to be particularly effective in improving soldering heat resistance, and various catalysts are used for the purpose of accelerating the curing reaction of this melamine resin.
しかしながら、メラミン樹脂の硬化剤としてしばしば用
いられているサリチル酸、安息香酸、酪酸、リン酸、酢
酸、シュウ酸などは、メラミン樹脂の硬化を促進し、積
層板のはんだ耐熱性を向上させるという点では効果が認
められるが、接着剤の保存安定性に劣るものであった。However, salicylic acid, benzoic acid, butyric acid, phosphoric acid, acetic acid, oxalic acid, etc., which are often used as curing agents for melamine resin, do not promote the curing of melamine resin and improve the soldering heat resistance of laminates. Although the adhesive was effective, the storage stability of the adhesive was poor.
そこでこの保存安定性を改良する目的で、特開昭６２−
１３２９８７号公報には、硬化剤にアジピン酸を用いる
ことなどが提案されている。しかしアジピン酸は炭素数
が６の直鎖飽和脂肪族ジカルボン酸であるために、はん
だ耐熱性のレベルを維持することが難しく、また、銅属
箔引き剥がし強さの点で問題があった。Therefore, in order to improve this storage stability, JP-A-62-
Publication No. 132987 proposes the use of adipic acid as a curing agent. However, since adipic acid is a linear saturated aliphatic dicarboxylic acid having 6 carbon atoms, it is difficult to maintain a level of soldering heat resistance, and there are also problems in peeling strength of copper metal foil.
本発明は上記のことを考慮して、はんだ耐熱性に優れて
いるとともに、金属箔引き剥がし強さも良好な金属張積
層板用接着剤を提供することを目的とする。In consideration of the above, an object of the present invention is to provide an adhesive for metal-clad laminates that has excellent solder heat resistance and also has good metal foil peel strength.
すなわち、本発明はポリビニルブチラール樹脂とエポキ
シ樹脂及びフェノール樹脂から選ばれる少なくとも１ｆ
！！！以上の熱硬化性樹脂とからなる樹脂にメラミン樹
脂を配合してなる接着剤樹脂組成物１００重量部に対し
て、メラミン樹脂の硬化剤としてイタコン酸（プロピレ
ンジカルボン酸、Ｈｚ
１
１１００ＣＣＨｚ−Ｃ−ＣＯＯＨ）を０．１〜５重量部
配合したことを特徴とする金属張積層板用接着剤を提供
するものである。That is, the present invention provides at least 1f selected from polyvinyl butyral resin, epoxy resin, and phenolic resin.
! ! ! Itaconic acid (propylene dicarboxylic acid, Hz 1 1100CCHz-C-COOH) was added as a curing agent for the melamine resin to 100 parts by weight of an adhesive resin composition made by blending a melamine resin with a resin consisting of the above thermosetting resin. ) is blended in an amount of 0.1 to 5 parts by weight.
本発明で用いられるポリビニルブチラール樹脂の重合度
、ブチラール化度などは特に制限されるものではないが
、一般に接着剤用に用いられている具体的な例としては
、エスレックＢＸ−１，ＢＸ−２、ＢＸ−５５（積木化
学工業社製、商品名）、電化ブチラール４０００−２．
５０００Ａ、６０００−Ｃ（電気化学工業社製、商品名
）などが挙げられる。これらの樹脂は単独又は２種以上
混合して用いられる。Although the degree of polymerization and degree of butyralization of the polyvinyl butyral resin used in the present invention are not particularly limited, specific examples generally used for adhesives include S-LEC BX-1 and BX-2. , BX-55 (manufactured by Block Chemical Industry Co., Ltd., trade name), Denka Butyral 4000-2.
Examples include 5000A and 6000-C (manufactured by Denki Kagaku Kogyo Co., Ltd., trade names). These resins may be used alone or in a mixture of two or more.
本発明に用いられるエポキシ樹脂は特に限定するもので
はないが、ビスフェノールＡ型、ビスフェノール５型、
ビスフェノールＦ型などの各エビ・ビス型エポキシ樹脂
、フェノールノボラック型エポキシ樹脂、タレゾールノ
ボランク型エポキシ樹脂、グリシジルエステル型エポキ
シ樹脂、脂肪族エポキシ樹脂、脂環式エポキシ樹脂、可
撓性エポキシ樹脂、エポキシ化ポリブタジェン樹脂、多
官能エポキシ樹脂、ハロゲン化エポキシ樹脂などが挙げ
られる。The epoxy resin used in the present invention is not particularly limited, but includes bisphenol A type, bisphenol type 5,
Various shrimp/bis type epoxy resins such as bisphenol F type, phenol novolak type epoxy resin, Talezol novolank type epoxy resin, glycidyl ester type epoxy resin, aliphatic epoxy resin, alicyclic epoxy resin, flexible epoxy resin, Examples include epoxidized polybutadiene resin, polyfunctional epoxy resin, and halogenated epoxy resin.
また本発明に用いられるフェノール樹脂は、特に限定す
るものではないが、レゾール型フェノール樹脂、ノボラ
ック型フェノール樹脂が挙げられる。Further, the phenolic resin used in the present invention is not particularly limited, but examples thereof include resol type phenolic resin and novolac type phenolic resin.
本発明ではエポキシ樹脂又はフェノール樹脂のいずれか
１種以上、あるいは１種以上のエポキシ樹脂と１種以上
のフェノール樹脂を混合したものが用いられる。ポリビ
ニルブチラール樹脂に対する熱硬化性樹脂の混合比率は
目標とする特性が得られるならば特に限定するものでは
ないがポリビニルブチラール樹脂１００重量部に対して
、１０〜２００重量部配合置型ことが望ましい。In the present invention, one or more of epoxy resins or phenol resins, or a mixture of one or more epoxy resins and one or more phenol resins is used. The mixing ratio of the thermosetting resin to the polyvinyl butyral resin is not particularly limited as long as the target properties can be obtained, but it is desirable to mix 10 to 200 parts by weight with respect to 100 parts by weight of the polyvinyl butyral resin.
ポリビニルブチラール樹脂に熱硬化性樹脂を配合した樹
脂にメラミン樹脂を配合するが、本発明で用いられるメ
ラミン樹脂としては、メチル化メラミン樹脂、ブチル化
メラミン樹脂、メチル・ブチル混合アルキル化メラミン
樹脂、エポキシ変性メラミン樹脂などを挙げることがで
き、使用するメラミン樹脂の種類については特に限定す
るものではない。また、配合量についても目的とする特
性が得られるのであれば特に限定するものではないが、
ポリビニルブチラール樹脂１００重量部に対して３０〜
２００重量部配合置型ことが望ましい。A melamine resin is blended with a resin that is a mixture of polyvinyl butyral resin and a thermosetting resin, and the melamine resins used in the present invention include methylated melamine resin, butylated melamine resin, methyl-butyl mixed alkylated melamine resin, and epoxy. Examples include modified melamine resins, and the type of melamine resin used is not particularly limited. In addition, there is no particular limitation on the amount of compounding as long as the desired characteristics can be obtained.
30 to 100 parts by weight of polyvinyl butyral resin
It is preferable to mix 200 parts by weight.
ポリビニルブチラール樹脂に熱硬化性樹脂を配合し、更
にメラミン樹脂を配合したものを接着剤樹脂組成物とす
る。この接着剤樹脂組成物１００重量部に対して、メラ
ミン樹脂の硬化剤としてイタコン酸（プロピレンジカル
ボン酸、
Ｃ）Ｉｇ
１
ＨＯＯＣＣＨｚ−Ｃ−ＣＯＯＨ）を０．１〜５重量重量
部上、目的とする接着剤を得る。硬化剤の配合量が０．
１重量部未満でははんだ耐熱性に劣り、また５重量部を
超えると金属箔引き剥がし強さや、接着剤の保存安定性
に劣るため好ましくない。An adhesive resin composition is prepared by blending a thermosetting resin with a polyvinyl butyral resin and further blending a melamine resin. To 100 parts by weight of this adhesive resin composition, 0.1 to 5 parts by weight of itaconic acid (propylene dicarboxylic acid, C)Ig 1 HOOCCHHz-C-COOH) as a curing agent for melamine resin is added. Get the glue. The amount of curing agent added is 0.
If it is less than 1 part by weight, the soldering heat resistance will be poor, and if it exceeds 5 parts by weight, the peel strength of the metal foil and the storage stability of the adhesive will be poor, which is not preferable.
本発明の接着剤は、上記配合材料に必要に応じて有機溶
剤を加え、混合することにより得られる。The adhesive of the present invention can be obtained by adding and mixing an organic solvent to the above compounded materials as needed.
有機溶剤としては、上記材料を溶解するものであれば特
に限定するものではないが、メタノール、アセトン、ト
ルエン、メチルエチルケトン、ジメチルホルムアミド、
ジメチルスルホキシド、セロソルブアセテートなどが具
体的には挙げられる。The organic solvent is not particularly limited as long as it dissolves the above materials, but examples include methanol, acetone, toluene, methyl ethyl ketone, dimethylformamide,
Specific examples include dimethyl sulfoxide and cellosolve acetate.
その他充填剤、カップリング剤などが必要に応じ添加さ
れる。Other fillers, coupling agents, etc. may be added as necessary.
上記の材料で配合した接着剤を金属箔上に塗布して接着
剤付金属箔とする。金属箔には銅箔、アルミ箔等が挙げ
られるが特に限定するものではなく、また塗布方法につ
いても、キスコート、ロールコート、スピンコード等を
挙げることができるが、特に限定するものではない。An adhesive blended with the above materials is applied onto a metal foil to obtain an adhesive-coated metal foil. Examples of the metal foil include copper foil, aluminum foil, etc., but are not particularly limited thereto, and examples of the coating method include kiss coating, roll coating, spin cord, etc., but are not particularly limited.
上記の接着剤付金属箔にフェノール樹脂を含浸させた紙
基材又はガラス基材のプリプレグを複数枚重ねて、加熱
加圧成形することにより、金属張積層板を得る。加熱加
圧成形条件については、特に限定するものではない。A metal-clad laminate is obtained by stacking a plurality of paper-based or glass-based prepregs in which the adhesive-coated metal foil is impregnated with a phenolic resin and molding them under heat and pressure. There are no particular limitations on the heating and pressure molding conditions.
以下本発明を実施例に基づいて詳細に説明するが、本発
明はこれに限定されるものではない。The present invention will be described in detail below based on Examples, but the present invention is not limited thereto.
実施例１、比較例１〜２
第１表に示す樹脂配合で溶剤に均一に溶解させて金属張
積層板用接着剤を得た。この接着剤をロールコータで厚
さ３５μｍの銅箔に塗布し乾燥硬化させて、接着剤厚み
４０μｍの接着剤銅箔を得た。この銅箔の接着剤側にフ
ェノール樹脂含浸基材８枚を重ねて積層体とし、ステン
レス鏡板に挟んで１６０°Ｃ１１００ｋｇ／ｃ＋ｆｌで
６０分間加熱加圧戒成形て銅張積層板を得た。この銅張
積層板の特性を第１表に示す。Example 1, Comparative Examples 1 to 2 The resin compositions shown in Table 1 were uniformly dissolved in a solvent to obtain adhesives for metal-clad laminates. This adhesive was applied to a copper foil having a thickness of 35 μm using a roll coater, and was dried and cured to obtain an adhesive copper foil having a thickness of 40 μm. Eight sheets of phenolic resin-impregnated substrates were stacked on the adhesive side of this copper foil to form a laminate, which was sandwiched between stainless steel mirror plates and heated and pressed at 160° C. and 1100 kg/c+fl for 60 minutes to obtain a copper-clad laminate. Table 1 shows the properties of this copper-clad laminate.
いずれの実施例も比較例に比べて接着剤の保存安定性に
優れ、はんだ耐熱性、銅箔引き剥がし強さの低下も見ら
れない。In all Examples, the storage stability of the adhesive is superior to that of the Comparative Example, and no decrease in solder heat resistance or copper foil peel strength is observed.
本発明の金属張積層板用接着剤は金属張積層板のはんだ
耐熱性金属箔引き剥がし強さを低下させることなく、接
着剤の保存安定性に優れたものであり、その工業的価値
は極めて大である。The adhesive for metal-clad laminates of the present invention has excellent storage stability without reducing the solder heat resistance and metal foil peeling strength of metal-clad laminates, and its industrial value is extremely high. It's large.
Claims (1)
ノール樹脂から選ばれる少なくとも１種以上の熱硬化性
樹脂とからなる樹脂にメラミン樹脂を配合してなる接着
剤樹脂組成物１００重量部に対してメラミン樹脂の硬化
剤としてイタコン酸を０．１〜５重量部配合したことを
特徴とする金属張積層板用接着剤。1. As a curing agent for melamine resin for 100 parts by weight of an adhesive resin composition made by blending melamine resin with a resin consisting of polyvinyl butyral resin and at least one thermosetting resin selected from epoxy resins and phenolic resins. An adhesive for metal-clad laminates, characterized in that it contains 0.1 to 5 parts by weight of itaconic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31618689A JPH03177478A (en) | 1989-12-05 | 1989-12-05 | Adhesive for metal-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31618689A JPH03177478A (en) | 1989-12-05 | 1989-12-05 | Adhesive for metal-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03177478A true JPH03177478A (en) | 1991-08-01 |
Family
ID=18074256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31618689A Pending JPH03177478A (en) | 1989-12-05 | 1989-12-05 | Adhesive for metal-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03177478A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06128547A (en) * | 1991-08-29 | 1994-05-10 | Hitachi Chem Co Ltd | Adhesive for copper foil for copper-clad laminate |
-
1989
- 1989-12-05 JP JP31618689A patent/JPH03177478A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06128547A (en) * | 1991-08-29 | 1994-05-10 | Hitachi Chem Co Ltd | Adhesive for copper foil for copper-clad laminate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03177478A (en) | Adhesive for metal-clad laminate | |
| JP3319650B2 (en) | Copper foil for copper clad laminates | |
| JP3177103B2 (en) | Adhesive for metal foil-clad laminate and metal foil-clad laminate using the same | |
| JPH0552873B2 (en) | ||
| JP2603603B2 (en) | Adhesive for metal-clad laminates | |
| JP2650158B2 (en) | Adhesive composition for flexible printed circuit board | |
| JP2650168B2 (en) | Adhesive for copper clad laminate | |
| JPH0578642A (en) | Adhesive composition | |
| JPS629628B2 (en) | ||
| JPH05255651A (en) | Adhesive for metallic foil-clad laminate board | |
| JPH0552872B2 (en) | ||
| JPH02180977A (en) | Adhesive composition for flexible printed circuit board | |
| JPH01294785A (en) | Adhesive for metal foil-clad laminate | |
| JP2744795B2 (en) | Adhesive for metal foil | |
| JP2842025B2 (en) | Adhesive for copper clad laminate | |
| JPH0435512B2 (en) | ||
| JPH037791A (en) | Adhesive composition for sticking foil | |
| JPS6119621A (en) | Epoxy resin composition | |
| JP3291028B2 (en) | Adhesive composition for flexible printed circuit board | |
| JPH0641503A (en) | Adhesive for copper-clad laminate | |
| JPH0220584A (en) | Adhesive for metal-clad laminate | |
| JPS5866385A (en) | Method of producing printed circuit board | |
| JPS6032875A (en) | Adhesive for metal-clad laminate | |
| JPS62132987A (en) | Adhesive for metal-clad laminated sheet | |
| JPS61195115A (en) | Adhesive composition for flexible printed circuit board |