JPH03178106A - Manufacture of coil assembly - Google Patents

Abstract

PURPOSE:To assure the fixation of a connection part on the outer surface of a coil by a method wherein coil lead wires and outer lead wires are connected by soldering process while the bulk level of the connection part between the coil lead, wires and the outer lead wires fixed on the outer surface of the coil is lowered by thinning the thickness of a bonding agent. CONSTITUTION:Coil lead wires 12 and lead wires 13 are connected with one another not by wrapping process but by soldering process through the intermediary of the pattern surfaces 17a, 17b of an FPC (flexible circuit substrate) 16 while the connection part is fixed on the FPC 16 using a bonding agent 14 and then further fixed on the outer surface of a coil 11 through the intermediary of the FPC 16. Accordingly, the bulk level of the connection part between the coil lead wires 12 and the outer lead wires 13 on the outer surface of coil 11 can be lowered thereby thinning the thickness of the bonding agent 14. Thus, the resistance of the connection part to the resin is low since no large force is given at all from the resin to the connection part. Through these procedures, the fixation of the connection part on the outer surface of the coil 11 can be assured.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a coil assembly in which a resin molded body is formed on the outer surface of the coil.

A coil assembly is being considered in which a resin molded body is formed on the outer surface of the coil.

In such a coil assembly, as shown in FIGS. 6(a) and (b), the coil lead wire 2 drawn out to the outer surface of the coil (2) and the external lead wire 3 are connected by soldering, and the connection portion is connected by soldering. Overcoat with adhesive 4 and fix to the outer surface of coil 1, then set a mold (not shown) on the outer surface of coil 1, inject resin into the mold at high temperature and pressure, and create a resin molded body by insert molding. 5.

However, the conventional manufacturing method described above has the following problems.

That is, in the above method, resin is injected at high temperature and pressure into a mold set on the outer surface of the coil l, and the resin mold body 5 is formed by insert molding, so that the coil lead wire 2
It is necessary to ensure the connection by soldering between the external lead wire 3 and the coil lead! ! ! It is necessary to wrap one of the coil lead wires 2 or 3 around the other and make a connection by soldering, which requires labor and has a high risk of damaging and breaking the coil lead wire 2. .

Coil lead II again! 2 and an external lead wire 3 are wound together and connected by soldering, and fixed to the outer surface of the coil l with an adhesive 4, so that the coil lead II on the outer surface of the coil 1 is
! 2 and the external lead wire 3 is bulky, and the adhesive 4 is also thick. For this reason, the resin injected into the mold on the outer surface of the coil 1 at high temperature and high pressure causes a large degree of deterioration of the connection part due to thermal softening of the adhesive 4, and the resistance of the connection part to the resin is large, resulting in strong force from the resin. As a result, the fixation of the connecting portion to the outer surface of the coil 1 becomes weak and unstable.

Furthermore, since the connection part between the coil lead wire 2 and the external lead wire 3 on the outer surface of the coil 1 becomes bulky, the outer lead wire 3 cannot be brought into close contact with the outer surface of the coil I. Since the external lead wire 4 is easily washed away by the flow of the resin injected into the mold, in order to keep the position of the external lead wire 3 constant from the resin mold body 5, it is necessary to Lead It! There is the trouble of having to support 3 with a special jig.

Therefore, an object of the present invention is to connect the coil lead wire and the external lead wire reliably by soldering without requiring any work to wrap the coil lead wire and the external lead wire, which has a high risk of breaking the coil lead wire. In addition, by reducing the bulk of the connection part between the coil lead wire and the external lead wire on the outer surface of the coil fixed with adhesive, and by reducing the thickness of the adhesive, insert molding on the outer surface of the coil can be used. It reduces the influence when forming the resin mold body, ensures the fixation of the connection part to the outer surface of the coil, and also allows the external lead wire to be taken out from the resin mold body at a constant position without requiring a special jig. Therefore, it is an object of the present invention to provide a manufacturing method capable of manufacturing a coil assembly.

The above objects are achieved by the method for manufacturing a coil assembly according to the present invention. To summarize, the present invention connects a coil lead wire drawn out to the outer surface of a coil and an external lead wire by soldering, and fixes a connecting portion between the coil lead wire and the external lead wire to the outer surface of the coil with an adhesive. , a method for manufacturing a coil assembly in which a resin molded body is formed on the outer surface of the coil by insert molding, wherein the coil lead wire and the external lead wire are fixed to the outer surface of the coil with a thin substrate having an exposed metal surface. The coil lead wire and the external lead wire are connected by soldering through the exposed metal surface, with or without fixing, the substrate is fixed to the outer surface of the coil, and the coil lead wire and the external lead wire are connected through the exposed metal surface of the substrate. , forming a resin molded body on the outer surface of the coil by insert molding, with the connecting portion between the coil lead wire and the external lead wire being fixed to the outer surface of the coil via the substrate with an adhesive; This is a method for manufacturing a coil assembly.

influence measurement Examples of the present invention will be described in detail below.

FIGS. 1(a) to 1(d) are process diagrams showing one embodiment of the method for manufacturing a coil assembly of the present invention.

In the present invention, in order to connect the coil lead wire 12 drawn out to the outer surface of the coil 11 and the external lead wire 13 by soldering, a thin substrate having an exposed metal surface, for example, an FPC (flexible A major feature is the use of a circuit board (16).

First, as shown in FIG. 1(a), the FPC 16 is fixed with adhesive to the outer surface of the coil 11 from which the coil lead wire 12 is drawn out.

The FPC 16 may be made of any material, such as imide or polyester, as long as it can withstand short-time soldering of the coil lead wire 12 and the external lead wire 13.

The shape and thickness of the FPC 16 and the shapes of the pattern surfaces 17a and 17b may be adjusted to the drawing direction of the coil lead wire 12, the drawing direction of the external lead wire 13, design values, etc., but the thinner the thickness, the better the outer surface of the coil 11. The thickness is preferably 1 mm or less, more preferably 0.3 mm or less, since this is advantageous in reducing the bulk of the connection portion between the coil lead wire 12 and the external lead wire 13 above. The adhesive for fixing the FPC 16 to the outer surface of the coil 11 is preferably an epoxy adhesive, an imide adhesive, or the like in consideration of heat resistance during soldering.

Next, as shown in FIG. 1(b), each of the coifre lead springs 12 is connected by solder to one place on the pattern surfaces 17a and 17b of the FPC 16 fixed to the outer surface of the coil 11. As shown in (C), pattern surface 1
Each of the external lead wires 13 is connected to the other locations of 7a and 17b by soldering, so that the pattern surfaces 17a and 1
The coil lead wire 12 and the external lead wire 13 are connected via 7b.

Next, as shown in FIG. 1(d), the coil lead wire 1
Apply adhesive 1 from above the connection part between 2 and external lead l1i113.
4 and fix the connection part on the FPC 16, thereby connecting the connection part to the coil 11 through the FPC 16.
be fixed to the outside surface of the A side view of the coil 11 at this time is shown in FIG.

After that, a mold (not shown) is set on the outer surface of the coil 11, resin is injected into the mold at high temperature and pressure, and insert molding is performed on the outer surface of the coil 11, as shown in FIG. 1(d). By forming the resin mold body 15, a coil assembly is obtained. A perspective view of this coil assembly is shown in FIG. In FIG. 3, arrow X indicates the direction in which the coil assembly swings.

As the resin used to form the resin mold body 15 by insert molding, hard resins such as PPS resin, PES resin, epoxy resin, nylon resin, polycarbonate resin, and phenol resin can be used.

According to the method for manufacturing a coil assembly as described above, the coil lead wire 12 and the external lead wire 13 are connected by soldering to the pattern surface 17a of the FPC 16 by soldering.
, 17b, the pattern surface 17a,
17b, so the coil lead wire 12
The connection between the coil lead wire 12 and the external lead wire 13 can be made stably and quickly, and the coil lead wire 12 is not broken during winding work, as when the coil lead wire 12 and the external lead wire 13 are wound and connected by soldering. There is no such thing.

Moreover, without winding the coil lead wire 12 and the external lead wire 13, the pattern surfaces 17a and 17b of the FPC 16 can be
The connection is made by soldering through the coil, the connection part is fixed on the FPC 16 with adhesive 14, and the connection part is fixed to the outer surface of the coil 11 via the FPC 16, so as shown in Fig. 2 above. , the coil lead wire 12 on the outer surface of the coil 11
The bulky height h of the connection part between and the external lead wire 13 can be reduced,
The thickness of the adhesive 14 can also be made thinner. Therefore, it is possible to reduce the deterioration of the connection part due to thermal softening of the adhesive 14 due to the resin injected at high temperature and high pressure into the mold set on the outer surface of the coil 11, and the resistance of the connection part to the resin is small. Since strong force is not applied to the resin, the connection portion can be firmly and reliably fixed to the outer surface of the coil 11.

Furthermore, since the bulk of the connection portion between the coil lead wire 12 and the external lead wire 13 on the outer surface of the coil 11 can be reduced, the external lead wire 13 can be brought into close contact with the outer surface of the coil 11. Since the external lead wire 13 is difficult to be washed away by the resin injected into the mold, the resin mold body can be easily molded without having to support the external lead 13 with a special jig at a location outside the mold when resin is injected. The position at which the external lead wire 13 is taken out from the lead wire 15 can be kept constant, and there is no need for that trouble.

Furthermore, since the bulk of the connection portion between the coil lead wire 12 and the external lead wire 13 on the outer surface of the coil 11 can be reduced, the margin of thickness of the resin molded body 15 with respect to the coil assembly is increased, and the resin molded body 15 It also has the advantage of making the design easier.

In the above embodiment, the FPC 16 is fixed to the outer surface of the coil 11, and then the coil lead wire 12 and the external lead wire 13 are sequentially connected to the pattern surfaces 17a and 17b by soldering. 17a, 17
Coil lead ili to b! 12 and external lead wire 1
3 by soldering, and then connect the FPC 16 to the coil 11.
It can also be fixed to the outer surface of the pattern surface 17a,
Coil lead I to 1.7b! 12 and external lead wire 13
You can also reverse the connection order.

In addition, we have explained the case where the coil assembly is manufactured by taking up a rectangular bobbinless type coil 11 that does not have an inner bobbin as the coil that constitutes the coil assembly. Any shape may be used as long as a resin mold body can be formed on the outer surface of the coil by insert molding, as shown in Figs. 4(a) and (b).
As shown in FIGS. 5A and 5B, a resin molded body 21 is formed on the outer surface of a flat coil 20 by insert molding to obtain a coil assembly, and as shown in FIGS. A coil assembly can be obtained by forming a resin mold body 23 on the outer surface of the coil 22 by insert molding.

4. Supervision (As explained above, according to the manufacturing method of the present invention, winding the coil lead wire and the external lead wire, which has a high risk of breaking the coil lead wire, does not require any work, and the coil lead The wire and the external lead wire are reliably connected by soldering, and the connection part between the coil lead wire and the external lead wire is fixed with adhesive.The bulk of the connection part on the outer surface of the coil is reduced, and the thickness of the adhesive is reduced. By making it thinner, the influence on the connection part when forming the resin molded body on the outer surface of the coil by insert molding is reduced, and the fixation of the connection part to the coil outer surface is ensured. The coil assembly can be manufactured without requiring any tools and by keeping the position at which the coil assembly is taken out from the resin mold body constant.

[Brief explanation of drawings]

FIGS. 1(a) to 1(d) are process diagrams showing one embodiment of the manufacturing method of the present invention. FIG. 2 is a side view showing the coil of FIG. 1(d) after being overcoated with adhesive. FIG. 3 is a perspective view showing the coil assembly manufactured by the steps shown in FIGS. 1(a) to (d). FIGS. 4(a) and 4(b) are perspective views showing other examples of a coil used in the present invention and a coil assembly obtained from the coil, respectively. FIGS. 5(a) and 5(b) are perspective views showing still other examples of a coil used in the present invention and a coil assembly obtained from the coil, respectively. FIGS. 6(a) and 6(b) are a front view and a side view, respectively, showing a conventional coil assembly. 11: Coil 12: Coil lead wire 13: External lead wire 14: Adhesive IS: Resin mold body 16: FPC (flexible circuit board) 17a. 17b: Pattern surface 1 Figure 2 Figure 3 Figure 4 (a) (b)

Claims (1)

[Claims] 1) Connect the coil lead wire drawn out to the outer surface of the coil and the external lead wire by soldering, fix the connection part between the coil lead wire and the external lead wire to the outer surface of the coil with adhesive, and A method for manufacturing a coil assembly in which a resin molded body is formed by insert molding, wherein the coil lead wire and the external lead wire are fixed to the outer surface of the coil or not to a thin substrate having an exposed metal surface. The substrate is fixed to the outer surface of the coil by soldering through the exposed metal surface, the coil lead wire and the external lead wire are connected through the exposed metal surface of the substrate, and the coil lead wire A coil assembly characterized in that a resin molded body is formed on the outer surface of the coil by insert molding, with a connecting portion between the and an external lead wire being fixed to the outer surface of the coil via the substrate with an adhesive. manufacturing method.