JPH03178155A - Ic package - Google Patents

Abstract

PURPOSE: To prevent short-circuiting between leads generated, due to an interval between fine leads while maintaining a same interval between leads for each system by placing an IC package on a circuit substrate, where a connection point is formed at a position that corresponds to the bent part of a number of gull wing type and J-type leads. CONSTITUTION: A large number of leads 10N of an IC package 10 have gull wing type bent leads G1-G6 each of which has a bent part G1A and the like that is bent in gull wing type. Leads J1-J5 that are bent in J-type are provided between the gull wing type leads G1-G6, each lead is bent in J-type, and a bent part J1A, where an edge part J1B is brought close to the bottom surface 10A of the IC package 10 is provided. Each lead of the IC package 10 in this form is connected to each corresponding point from among a number of connection point formed in a circuit substrate 6, thus relatively increasing the gap between leads when connected to the substrate 6 and preventing electrical short- circuiting.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention is applied to IC packages (Integrated Circuits).
The invention relates to a combination type IC package in which leads are bent alternately into a Gull type and a J type.

[Conventional technology]

Generally, after all the manufacturing processes are completed, the IC package is manufactured through a forming process (Form) that involves bending a large number of leads on both sides.
ing Process), form the lead into a gull or J shape.

That is, FIG. 1A shows a bent part IB in which each lead IA of an IC package 1 having a large number of leads IN is bent into a stepped gull shape, and FIG. 1B shows a bending part IB having a large number of leads 2B. The J-shaped bent ends 2D of each lead 2A of the IC package 2 are connected to the bottom surface 2C of the IC package 2.
The bent portions 2B are shown close to each other.

Generally, the leads IA and 2 on both sides of each IC package 1 and 2 are bent into a gull shape or a J shape, as shown in FIGS. 1A and 18, and are used selectively depending on the application. are doing. Therefore, each such IC
The bent portions 1B and 2B of the leads 1A and 2A of the packages 1 and 2 are mounted using surface mount technology (Surface Mount Technique) at the predetermined positions on the board on which the circuit is formed.
connected by

However, according to surface mount technology that connects a large number of leads of a TC package to a circuit board in this way, the distance between each lead is very narrow, making it impossible to prevent electrical short circuits occurring between the leads. There wasn't. That is, in each lead (LA or 2A) that is generally bent in a gull shape or a J shape, the pitch 9 between the adjacent leads L1 and L2 is about 1.27 mm, as shown in FIG. 1C. The width W of each lead 1 or 2A is approximately 0.635m+*
It is.

Therefore, the actual distance I between both leads L1 and L2 is approximately 0.635+++m. As a result, when the leads of the IC package are connected to the substrate, short circuits occur between the leads because the intervals between the leads are minute.

As described above, FIG. 1D illustrates the connection points on the circuit board that are connected to each lead of the IC package.

For example, if it is assumed that the IC package 1 bent into a gull shape as shown in FIG. The bent portion IB of the lead 1A is located at each connection point (Xl) corresponding to each lead LA among the many connection points 5N of the board 5.

. . . XN) are sequentially connected in a straight line. Therefore, as shown in FIG. 1C, since the distance I between the leads is substantially small (1-0,635 degrees), an electrical short circuit occurs between the leads, thereby causing an electrical failure in the circuit. rate becomes higher. Similarly, an IC package having a J-shaped lead as shown in FIG. 1B also suffers from the above-mentioned problem. Therefore, in order to solve these problems, an expensive surface mounting device that can maintain a fine spacing between the leads during the connection process is required, which increases the economic burden.

[Means to solve the problem]

Therefore, in order to solve the above-mentioned problems, it is an object of the present invention to maintain the same spacing between the leads of each existing system and to prevent short circuits between the leads that may occur due to the fine spacing between the leads. The purpose of the present invention is to provide a combination type IC package of a gal type and a J type.

According to the combination type IC package according to the present invention, a large number of gull-shaped leads each having a bent portion bent in a gull shape, and a plurality of gull-shaped leads arranged alternately between the plurality of gull-shaped leads, and A large number of J-shaped leads each having a bent portion with a J-shaped end are formed, and connection points are provided at positions corresponding to the bent portions of the large number of gull-shaped and J-shaped leads. It is characterized by being configured so that it can be attached to a formed circuit board.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2A shows a perspective view of an IC package according to the present invention.
FIG. 2B each represents a front view of FIG. 2A.

The most significant feature of the present invention is that it provides an IC package in which a large number of leads on both sides of an IC package are alternately combined in a gal or J shape.

Referring to FIGS. 2A and 2B, the multiple leads ION of the IC package 10 of the present invention are a first lead G1, a third lead G2, a fifth lead G3, a seventh lead G4, and a third lead G4, which are bent into a gull shape. The 9th lead G5 and the 11th lead G6 are each provided with a bent portion CIA bent into a gull shape, and each of the gull type leads Gl, G2 . G3.
G4゜Between G5 and G6, there are provided a second lead J1, a fourth lead J2, a sixth lead J3, an eighth lead J4, and a tenth lead J5, each of which is bent into a J shape. A bent portion JIA is provided which is bent and has an end portion JIB close to the bottom surface 10A of the IC bar cage 10.

Each lead of the IC package 30 having such a configuration is connected to a corresponding connection point among a large number of connection points 6N formed in the circuit board 6 as shown in FIG. 2C. That is, assuming that the IC package 10 is mounted on the circuit board 6 as shown by the dotted line, the first, third and third parts having the respective gull-shaped bent portions CIA are provided. , fifth, seventh, ninth and eleventh leads Gl.

G2. G3. G4. G5 and G6 each connect to a respective connection point X1°X2. located in the "X" column in the circuit board 6. X3.
X4. A second, a fourth,
6th, 8th and 10th leads Jl, J2. J3. J4 and J5 are respective connection points Zl located in the "Z" column in the circuit board 6.

Z2. Z3. Connected to Z4 and Z5 in a mutually corresponding manner.

At this time, the "X" column and "Z" in the circuit board 6 maintain a predetermined distance from each other. Therefore, a large number of leads 6N, etc., which are combined in the gull type and J type of the IC package, are connected with a wider interval than the interval between the multiple connection points shown in FIG. 1D. That is, the distance between the adjacent leads (Ll and L2 of FIG.
is about 0.635 mm, whereas the spacing 1 of leads G1 and Jl, such as the leads in FIG. 2C, is about 2 am.
Therefore, it is possible to maintain a distance approximately three times as wide.

Although the drawings show an IC package in which a large number of leads are formed on both sides of the IC package body, only one lead will be explained as an example to avoid complicating the specification.

Also, each lead of one IC package is connected to gal type and J type.
Form
ing Press) punches and dies (Die)
Since it can be processed to meet the requirements of the present invention, this does not pose a major problem.

〔Effect of the invention〕

Therefore, the IC package of the present invention having leads in the form of an alternating combination of the gull type and the J type is different from the conventional IC package in which the leads are bent in a single form of either the gull type or the J type.
Compared to a package, when connected to a substrate, the distance between each lead can be made relatively wider, thereby preventing electrical short circuits, which in turn has the effect of reducing the defective rate of products.

[Brief explanation of drawings]

FIG. 1A is a front view of an IC package with the leads bent into a gull shape using the prior art, FIG. 1B is a front view of the IC package with the leads bent into a J shape using the prior art, and FIG. 1C is a front view of the IC package with the leads bent into a J shape using the prior art. FIG. 1D is a partial front view of the leads showing the pitch and width between adjacent leads of the IC package, and FIG. 1D is a plan view of Fang Bay showing each lead and the corresponding connection point in FIG. 1A or FIG. 1B as an example. FIG. 2A is a perspective view of the combination type IC package of the present invention, and FIG. 2B is a front view of the combination type IC package of FIG. 2A of the present invention.
FIG. 2C is a plan view showing the combination type IC package of the present invention, the leads, and the corresponding connection points in the circuit board.

Claims (1)

[Claims] In an IC package that has a large number of leads attached to a circuit board on which a large number of connection points are formed on the bottom surface, a large number of gull-shaped leads each having a bent part bent into a gull shape are provided. leads and the plurality of gull-shaped leads are arranged alternately, and
A plurality of J bending parts each having a J-shaped bent end so as to be close to the bottom of the IC package.
gull type and J type leads, and configured to be able to be mounted on a circuit board having connection points formed at positions corresponding to the bent portions of the large number of gull type and J type leads. combination IC package.