JPH03181509A - Photo-setting type organopolysiloxane composition - Google Patents
Photo-setting type organopolysiloxane compositionInfo
- Publication number
- JPH03181509A JPH03181509A JP32223089A JP32223089A JPH03181509A JP H03181509 A JPH03181509 A JP H03181509A JP 32223089 A JP32223089 A JP 32223089A JP 32223089 A JP32223089 A JP 32223089A JP H03181509 A JPH03181509 A JP H03181509A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- organopolysiloxane
- polymerization catalyst
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 24
- 239000002685 polymerization catalyst Substances 0.000 claims abstract description 14
- 239000003999 initiator Substances 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 6
- -1 Polysiloxane Polymers 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 150000002430 hydrocarbons Chemical class 0.000 abstract description 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 238000006552 photochemical reaction Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 125000005442 diisocyanate group Chemical group 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000002087 whitening effect Effects 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- ZUQIVGCFGVFWNR-UHFFFAOYSA-N isocyanatoethane;2-methylprop-2-enoic acid Chemical compound CCN=C=O.CC(=C)C(O)=O ZUQIVGCFGVFWNR-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 1
- 229940044192 2-hydroxyethyl methacrylate Drugs 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- CCDWGDHTPAJHOA-UHFFFAOYSA-N benzylsilicon Chemical compound [Si]CC1=CC=CC=C1 CCDWGDHTPAJHOA-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229940061607 dibasic sodium phosphate Drugs 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- WELLGRANCAVMDP-UHFFFAOYSA-N isocyanatoethane;prop-2-enoic acid Chemical compound CCN=C=O.OC(=O)C=C WELLGRANCAVMDP-UHFFFAOYSA-N 0.000 description 1
- BVHBZCZOVYDVIE-UHFFFAOYSA-N isocyanic acid;2-methylprop-2-enoic acid Chemical compound N=C=O.CC(=C)C(O)=O BVHBZCZOVYDVIE-UHFFFAOYSA-N 0.000 description 1
- IQJVBAIESAQUKR-UHFFFAOYSA-N isocyanic acid;prop-2-enoic acid Chemical compound N=C=O.OC(=O)C=C IQJVBAIESAQUKR-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical class CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電気・電子工業、化学工業等の産業分野に
おけるフィルム、塗料、粘着剤等として用いられる光硬
化型オルガノポリシロキサン組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photocurable organopolysiloxane composition used as a film, paint, adhesive, etc. in industrial fields such as the electrical/electronic industry and the chemical industry.
一般に、優れた耐候性を示す塗料または電気・電子工業
関係におけるポンチ゛イング材、粘着剤として溶剤可溶
性のオルガノポリシロキサン組成物が知られている。そ
して、このようなオルガノポリシロキサン組成物の多く
は、熱硬化性であって、シリコーンゲルを白金系触媒の
存在下80〜150℃に加熱し、ケイ素原子に結合して
いる不飽和基に水素原子を付加して成形硬化を行なう。Generally, solvent-soluble organopolysiloxane compositions are known as paints exhibiting excellent weather resistance, or as punching materials and adhesives in the electrical and electronic industries. Most of these organopolysiloxane compositions are thermosetting, and silicone gel is heated to 80 to 150°C in the presence of a platinum catalyst to add hydrogen to unsaturated groups bonded to silicon atoms. Atom is added and mold hardening is performed.
このため、耐熱性の悪い電子部品等においては、硬化温
度が高すぎて使用できないという欠点があり、また、前
記シリコーンゲルは、加熱下で、イオウ、スズ、アンチ
モン、水銀、ビスマスまたはハンダフラックスと反応し
てその硬化が抑制されるため、製造管理上、手のかかる
ものであった。さらに、オルガノポリシロキサン組成物
を熱硬化させると、体積収縮が起こり、基材および電子
部品にクランクが発生したり、破壊されたりするという
問題点があった。For this reason, there is a drawback that the curing temperature is too high to be used in electronic parts with poor heat resistance.In addition, the silicone gel does not react with sulfur, tin, antimony, mercury, bismuth, or solder flux when heated. Since the reaction inhibits the curing, manufacturing control is complicated. Furthermore, when the organopolysiloxane composition is thermally cured, volumetric shrinkage occurs, causing problems such as cranking or destruction of the base material and electronic components.
一方、塗料として用いられるシリコーンは、オルガノポ
リシロキサンの低分子組成物であって溶剤可溶性とした
ものを白金触媒等の存在下に加熱して、高分子化反応を
させている。しかし、この高分子化反応に伴う加熱によ
って、有害な溶剤が気化するという環境衛生上の問題点
があった。On the other hand, silicone used as a paint is a low-molecular organopolysiloxane composition made solvent-soluble and heated in the presence of a platinum catalyst or the like to undergo a polymerization reaction. However, there is a problem in terms of environmental hygiene in that harmful solvents are vaporized by the heating associated with this polymerization reaction.
C発明が開発しようとする課題〕
この発明は、耐熱性の悪い電子部品にも使用でき、加熱
によって他の物質と反応したり、クラックが発生するこ
とのないように、加熱以外の手法によっても高分子化反
応が促進されて硬化する光硬化型オルガノポリシロキサ
ン組成物を得ることにある。Problems to be developed by Invention C] This invention can be used for electronic parts with poor heat resistance, and can also be developed by methods other than heating to prevent them from reacting with other substances or causing cracks due to heating. The object of the present invention is to obtain a photocurable organopolysiloxane composition that is cured by promoting a polymerization reaction.
C課題を解決するための手段〕
上記の課題を解決するため、この発明においては、
(式中、R1は水素原子またはメチル基、Rz、Rjは
同一または異種の非置換または置換の1価炭化水素基、
a、b、cは1〜6の正の整数、dは1〜200の正の
整数、nは1〜4の正の整数)で示されるオルガノポリ
シロキサン100重量部と、重合用触媒0.01〜10
重量部とを含む光硬化型オルガノポリシロキサン組成物
とする手段を採用する。Means for Solving Problem C] In order to solve the above problem, in this invention, (wherein R1 is a hydrogen atom or a methyl group, Rz and Rj are the same or different unsubstituted or substituted monovalent carbon hydrogen group,
a, b, and c are positive integers of 1 to 6, d is a positive integer of 1 to 200, and n is a positive integer of 1 to 4), 100 parts by weight of an organopolysiloxane, and 0.0 parts by weight of a polymerization catalyst. 01-10
Parts by weight of the photocurable organopolysiloxane composition are prepared.
また、光硬化型オルガノポリシロキサン組成物は、
式(n)
RR+
(式中、Rはメチル基または水素原子、R,、R8は同
一または異種の非置換または置換の1価炭化水素基、ま
たはフェニル基、a、bは1〜4の正の整数、nば1〜
200の正の整数)で示されるオルガノポリシロキサン
100重量部と、重合用触媒0.01〜10重量部とを
含む手段を採用してもよく、上記2種のオルガノポリシ
ロキサンを併用した混合物100重量部と、重合用触媒
0.01〜10重量部とを含む光硬化型オルガノポリシ
ロキサン組成物としてもよい、上記重合用触媒は、光反
応開始剤0.01〜10重量部と増感剤0.01〜10
重量部とから構成してもよい。以下その詳細を述べる。In addition, the photocurable organopolysiloxane composition has the formula (n) RR+ (wherein, R is a methyl group or a hydrogen atom, R,, R8 are the same or different unsubstituted or substituted monovalent hydrocarbon groups, or phenyl group, a and b are positive integers of 1 to 4, n is 1 to 4;
A method containing 100 parts by weight of an organopolysiloxane (a positive integer of 200) and 0.01 to 10 parts by weight of a polymerization catalyst may be adopted, and a mixture containing 100 parts by weight of the above two types of organopolysiloxanes may be adopted. The polymerization catalyst may be a photocurable organopolysiloxane composition containing 0.01 to 10 parts by weight of a photoinitiator and 0.01 to 10 parts by weight of a polymerization catalyst. 0.01~10
It may also be composed of parts by weight. The details will be described below.
まず、この発明で使用するオルガノポリシロキサンの合
戊例として、
Aニジイソシアネート類との反応
水酸基を含有するポリジメチルシロキサン類1モルとジ
イソシアネート類2モルとを反応させ、さらに片末端に
水酸基を含有するアクリルモノマー2モルとを反応させ
たものB:イソシアネート基を含有するアクリルモノマ
ーとの反応
水酸基を含有するポリジメチルシロキサン類1モルとイ
ソシアネート基を含有するアクリルモノマー2モルとを
反応させたちの
C:カルボキシル基を含有するアクリルモノマーとの反
応
水酸基を含有するポリジメチルシロキサン1モルとカル
ボキシル基を含有するアクリルモノマー2モルとを反応
させたもの
が挙げられる。First, as an example of synthesis of the organopolysiloxane used in this invention, reaction with Ani diisocyanates 1 mole of polydimethylsiloxanes containing hydroxyl groups and 2 moles of diisocyanates are reacted, and further hydroxyl groups are added at one end. B: Reaction with an acrylic monomer containing isocyanate groups.C: Reaction with 2 moles of an acrylic monomer containing isocyanate groups. : Reaction with an acrylic monomer containing a carboxyl group An example is a reaction between 1 mole of polydimethylsiloxane containing a hydroxyl group and 2 moles of an acrylic monomer containing a carboxyl group.
ここで、水酸基を含有するポリジメチルシロキサンの構
造単位は、
p+
ろ
(Roは水素または同種もしくは異種の有機基)
の組み合せからなり、その形態はシリコーン油、シリコ
ーンゴム、シリコーン樹脂のいずれでもよい。そして、
上記シリコーン油は、D単位を主鎖としてM単位を末端
とするものであり、シリコーンゴムはD単位のみからな
る長鎖状重合体で、Roにフェニル基を導入して、耐熱
性、耐寒性を高めてあってもよく、また、シリコーン樹
脂は、T単位を多量に含む3次元綱状構造を呈するもの
であり、耐寒性、耐熱性を高めるためRoにメチル基、
フェニル基およびそれらの両者混用した、たとえばフェ
ニルメチルシリコーン樹脂が適当である。Here, the structural unit of polydimethylsiloxane containing a hydroxyl group consists of a combination of p + Ro (Ro is hydrogen or the same or different organic group), and its form may be silicone oil, silicone rubber, or silicone resin. and,
The above silicone oil has D units as the main chain and M units as the ends, and silicone rubber is a long-chain polymer consisting only of D units, and a phenyl group is introduced into Ro, resulting in heat resistance and cold resistance. In addition, the silicone resin exhibits a three-dimensional linear structure containing a large amount of T units, and in order to improve cold resistance and heat resistance, Ro has a methyl group,
Phenyl groups and mixtures of both, such as phenylmethyl silicone resins, are suitable.
また、上記ジイソシアネート類としては、トリレジイソ
シアネート(↑DI) 、4. 4’ −ジフェニルメ
タンジイソシアネート(MDI) 、キシリレンジイソ
シアネート(XDI) 、メタキシリレンジイソシアネ
ート(MXDI) 、ヘキサメチレンジイソシアネー)
()101) 、2. 6−ジイツシアネートメチル
カブロネート(LDI) 、4. 4’−メチレンビス
(シクロヘキシル)イソシアネート (II+zM口■
)、水添化メチルシクロヘキサン、イソホロンジイソシ
アネート(IPDI) 、I−リメチルへキサメチレン
ジイソシアネート(IMDI) 、ダイマー酸ジイソシ
アネート(DDr)などが挙げられる。Further, as the diisocyanates, trirediisocyanate (↑DI), 4. 4'-diphenylmethane diisocyanate (MDI), xylylene diisocyanate (XDI), metaxylylene diisocyanate (MXDI), hexamethylene diisocyanate)
()101), 2. 6-dicyanatomethylcabronate (LDI), 4. 4'-methylenebis(cyclohexyl)isocyanate (II+zM■
), hydrogenated methylcyclohexane, isophorone diisocyanate (IPDI), I-lymethylhexamethylene diisocyanate (IMDI), dimer acid diisocyanate (DDr), and the like.
また、水酸基を含有するアクリルモノマーとしては、2
−ヒドロキシエチルアクリレ−) (211EA)、2
−ヒドロキシエチルメタクリレート(211HMA)、
2−ヒドロキシプロピルアクリレート(21(PA)ま
たは2−ヒドロキシプロピルメタクリレート(28PM
A)などが挙げられる。In addition, as an acrylic monomer containing a hydroxyl group, 2
-hydroxyethyl acrylate) (211EA), 2
-Hydroxyethyl methacrylate (211HMA),
2-hydroxypropyl acrylate (21 (PA) or 2-hydroxypropyl methacrylate (28PM)
A) etc.
イソシアネート基含有アクリルモノマーとしては、2−
エチルイソシアネートメタクリレート、2−エチルイソ
シアネートアクリレート、イソシアネートアクリレート
またはイソシアネートメタクリレートなどが挙げられる
。As the isocyanate group-containing acrylic monomer, 2-
Examples include ethyl isocyanate methacrylate, 2-ethyl isocyanate acrylate, isocyanate acrylate, and isocyanate methacrylate.
さらに、前記したオルガノポリシロキサン合威例A−C
中に添加される反応用触媒、重合禁止剤および溶剤を第
1表に示す。Furthermore, the organopolysiloxane synthesis examples A-C mentioned above
Table 1 shows the reaction catalyst, polymerization inhibitor, and solvent added therein.
重合用触媒としては、紫外線照射に対する光反応開始剤
、増感剤、重合開始剤としてのアゾビスイソブチロニト
リル(AIBN) 、電子線照射に対する反応開始剤等
が挙げられる。これら重1合用触媒は、オルガノポリシ
ロキサン100重量部に対して0.01〜10重量部添
加する。なぜなら0.01重量部以下なら反応が遅く、
10重量部以上であれば、光反第
■
表
店開始剤の分解が早くなり、臭い、残香等が多くなるか
らである。Examples of the polymerization catalyst include a photoreaction initiator for ultraviolet irradiation, a sensitizer, azobisisobutyronitrile (AIBN) as a polymerization initiator, and a reaction initiator for electron beam irradiation. These polymerization catalysts are added in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the organopolysiloxane. This is because if it is less than 0.01 part by weight, the reaction is slow;
This is because if it is 10 parts by weight or more, the decomposition of the light anti-oxidant initiator will be rapid, resulting in increased odor, residual fragrance, etc.
上記したように構成されるこの発明に係る光硬化型オル
ガノポリシロキサン組成物は、重合用触媒が含有されて
おり、紫外線照射、電子線照射、懸濁重合、溶液重合等
の手法により加熱することなく硬化する。The photocurable organopolysiloxane composition according to the present invention configured as described above contains a polymerization catalyst, and can be heated by methods such as ultraviolet irradiation, electron beam irradiation, suspension polymerization, and solution polymerization. It hardens without any problem.
以下、この発明の実施例、比較例を示すが、配合訓合に
おける部は、特に断らない限り重要部を意味する。Examples and comparative examples of the present invention will be shown below, and the parts in the formulations mean important parts unless otherwise specified.
実施例1:
オルガノポリシロキサンとしては、下記■〜■からなる
前記合成例へを用いた。Example 1: As the organopolysiloxane, the above synthesis examples consisting of the following (1) to (2) were used.
■ポリジメチルシロキサン(信越化学社製: X−22
160AS) 831部
■RD+ 336
部■2−HEA 23
2部■ジブチルスズジラウレート 0.1
部■ハイドロキノン 0.1部
■光反応開始剤(チハガイギー社製コイルガキュア65
1 ) 70部上記■
、■および■を60℃で2時間反応させた後、さらに8
0℃で2時間反応させ、ついで■、■を仕込み、80°
Cで反応させながら、赤外線吸収スペクトルで反応の進
行を観察し、イソシアネート基の吸収ピーク消失により
反応終了を確認した。ついで反応終了物に■を70部添
加し、これを厚さ50μmのPUTフィルムにll*厚
1〜5−となるよう塗布し、さらに、高圧水銀ランプ(
80W/cm)にてl、 Q cmの高さから】0秒間
照射し、硬化反応を完了させた。■Polydimethylsiloxane (manufactured by Shin-Etsu Chemical: X-22
160AS) 831 copies ■RD+ 336
Part ■2-HEA 23
2 parts ■ Dibutyltin dilaurate 0.1
Part ■ Hydroquinone 0.1 part ■ Photoreaction initiator (Coilgacure 65 manufactured by Chiha Geigy)
1) 70 copies above■
, ■ and ■ were reacted at 60°C for 2 hours, and then 8
React at 0℃ for 2 hours, then add ■ and ■ and heat at 80℃.
While reacting with C, the progress of the reaction was observed using an infrared absorption spectrum, and the completion of the reaction was confirmed by the disappearance of the absorption peak of the isocyanate group. Next, 70 parts of ■ were added to the reaction product, and this was applied to a PUT film with a thickness of 50 μm to give a thickness of 1 to 5−, and then heated using a high-pressure mercury lamp (
The curing reaction was completed by irradiating at 80 W/cm for 0 seconds from a height of 1, Q cm.
実施例2:
オルガノポリシロキサンとして、下記■〜■からなる前
記合成例Bを用いる。Example 2: As the organopolysiloxane, the above-mentioned Synthesis Example B consisting of the following (1) to (2) is used.
■ポリジメチルシロキサン(信越化学社製: X−22
−160AS) 83
1部■2−エチルイソシーネートメタクリレート310
部
■ジプチルスズジラウレー) 0.1部■
ハイドロキノン 0.1部■光
反応開始剤(チバガイギー社製ニイルガキュア
651)
55部上記■〜■を60℃で2時間反応させ
た後、さらに80℃で4時間反応させ、ついで■を仕込
み、80°Cで反応させながら赤外線吸収スペクトルで
反応の進行状況を観察した。以後、実施例1と全く同様
の操作を行なった。■Polydimethylsiloxane (manufactured by Shin-Etsu Chemical: X-22
-160AS) 83
1 part ■ 2-ethyl isocyanate methacrylate 310
Part ■Diptyltin dilaure) 0.1 part■
Hydroquinone 0.1 part ■Photoreaction initiator (Nilgacure manufactured by Ciba Geigy)
651)
55 parts The above ① to ③ were reacted at 60°C for 2 hours, and then further reacted at 80°C for 4 hours, then ① was added, and while the reaction was carried out at 80°C, the progress of the reaction was observed using an infrared absorption spectrum. Thereafter, the same operations as in Example 1 were performed.
実施例3:
オルガノポリシロキサンとして、下記■〜■からなる前
記合成例Cを用いる。Example 3: As the organopolysiloxane, the above-mentioned Synthesis Example C consisting of the following (1) to (2) is used.
■ボl/ジメチルシロキサン(信越化学社製: X−2
2160AS) 831
部■アクリル酸 144部
■バラトルエ〉′スルホンミツ 20
部■ハイドロキノン 2部■
l・ルエン 1500部■光
部名光始剤(チバガイギー社製ニイルガキュア651ン
70部■〜■を
110℃で10時間還流冷却しながら反応させ、36部
脱水して反応を終了させた。ついで、反応終了物に■を
70部添加してこのものをPUTフィルムに塗布し、以
後実施例1と全く同様の操作を行なった。■Vol/dimethylsiloxane (manufactured by Shin-Etsu Chemical Co., Ltd.: X-2
2160AS) 831
Parts ■ Acrylic acid 144 parts ■ Baratorue〉' Sulfonomitsu 20
Part ■Hydroquinone Part 2■
1,500 parts of luene ■ 70 parts of Niirgacure 651 (manufactured by Ciba Geigy) were reacted at 110° C. while cooling under reflux for 10 hours, and 36 parts were dehydrated to terminate the reaction. 70 parts of (1) was added to the reaction product, which was applied to a PUT film, and the same operations as in Example 1 were carried out.
実施例4:
実施例1のオルガノポリシロキサン合成例Aをセ眉重合
させる場合について説明する。Example 4: A case where organopolysiloxane synthesis example A of Example 1 is subjected to polymerization will be described.
■オルガノポリシロキサフ合成例A(実施例1に用いた
もの)10部
■2−エチルへキソルアクリレート 20部■ブ
チルメタクリレート60部
■スチレン 10部■重
合開始剤(AIBll) 2部■
分散剤(ゼラチン) 1部■分散剤
(第2リン酸ナトリウム) 0.1部■水
500部上記■〜■を
適当な容器に仕込み、この容器内温度を75〜80℃と
して上記■〜■を滴下ロートで滴下し、さらに同温度で
8時間反応させた。生成したポリマーを取り出し、フィ
ルム状として50℃で減圧乾燥した。■ Organopolysiloxaf Synthesis Example A (used in Example 1) 10 parts ■ 2-ethylhexol acrylate 20 parts ■ Butyl methacrylate 60 parts ■ Styrene 10 parts ■ Polymerization initiator (AIBll) 2 parts ■
Dispersant (gelatin) 1 part Dispersant (dibasic sodium phosphate) 0.1 part Water
500 parts of the above (1) to (2) were placed in a suitable container, the temperature inside the container was set at 75-80°C, and the above (1) to (3) were added dropwise using a dropping funnel, and the mixture was further reacted at the same temperature for 8 hours. The produced polymer was taken out and dried under reduced pressure at 50°C in the form of a film.
実施例5および実施例6:
実施例5および実施例6は、実施例4の試材■に代えて
実施例2のオルガノポリシロキサン合成例Bまたは実施
例3のオルガノポリシロキサンCを10部使用する以外
は、実施例4と同様の操作でそれぞれフィルム状のポリ
マーを得た。Example 5 and Example 6: In Examples 5 and 6, 10 parts of organopolysiloxane synthesis example B of Example 2 or organopolysiloxane C of Example 3 was used in place of sample ■ of Example 4. Film-like polymers were obtained in the same manner as in Example 4, except for the following.
比較例1:
■トリメチロールプロパントリアクリレート10部
■2−エチルへキシルアクリレート 20部■ブ
チルメタクリレート60部
■2−ヒドロキソメタクリレート lO部■光
反応開始剤(チバガイギー社製ニイルガキュア
651)
5 部上記■〜■の配合液を用いて実
施例1〜3と同様の操作でPETフィルム上にポリマー
被膜を形成した。Comparative Example 1: ■ 10 parts of trimethylolpropane triacrylate ■ 20 parts of 2-ethylhexyl acrylate ■ 60 parts of butyl methacrylate ■ 10 parts of 2-hydroxomethacrylate ■ Photoreaction initiator (Nilgacure manufactured by Ciba Geigy)
651)
A polymer film was formed on a PET film in the same manner as in Examples 1 to 3 using 5 parts of the liquid mixtures (1) to (2) above.
比較例2:
実m例4の■オルガノポリシロキサン(合成例A)10
部に代えて、トリメチロールプロパントリアクリレ−N
0部を用いる以外は実施例4と全く同様に調製してフィ
ルム状のポリマーを形成した。Comparative Example 2: Organopolysiloxane (Synthesis Example A) 10 of Example 4
Trimethylolpropane triacrylate-N instead of
A film-like polymer was prepared in exactly the same manner as in Example 4 except that 0 part was used.
以上、実施例1〜6ならびに比較例1および2のそれぞ
れで得たフィルムの物性を第2表にまとめて示した。な
お、各物性の評価方法はつぎのとおりである。The physical properties of the films obtained in Examples 1 to 6 and Comparative Examples 1 and 2 are summarized in Table 2. The evaluation method for each physical property is as follows.
耐溶剤性:
酢酸エチレン100g中にフィルム1gを常温にて24
時間放置し、溶解性を比較した。Solvent resistance: 1 g of film in 100 g of ethylene acetate at room temperature
The samples were allowed to stand for a period of time and their solubility was compared.
○不溶
△−−溶解または膨潤
×完全溶解
耐水性;
水道水にフィルム1gを常温にて24時間浸漬し、白化
性を比較した。○ Insoluble Δ -- Dissolution or swelling × Complete dissolution Water resistance; 1 g of film was immersed in tap water at room temperature for 24 hours, and the whitening properties were compared.
○白化せず
△一部自白
化完全白化
耐熱性:
150℃で1時間放置乾燥し、黄変性の試験を行なった
。○ No whitening △ Partial whitening Complete whitening Heat resistance: It was left to dry at 150° C. for 1 hour, and a yellowing test was conducted.
○黄変せず
△−−黄変
×完全黄変
第2表からも明らかなように、実施例1〜6の光硬化型
オルガノポリシロキサン組成物がら加熱硬化の操作をす
ることなく得られたフィルムは、耐溶剤性、耐水性、耐
熱性に優れ、弾性的性質をも備えた汎用性の高いもので
あった。○ No yellowing △ - Yellowing × Complete yellowing As is clear from Table 2, the photocurable organopolysiloxane compositions of Examples 1 to 6 were obtained without heat curing. The film had excellent solvent resistance, water resistance, heat resistance, and elastic properties, making it highly versatile.
第
表
〔効果〕
この発明の光硬化型オルガノポリシロキサン組成物は、
以上説明したように、比較的低温での操作または紫外線
照射などの非加熱的操作によって高分子化反応が促進さ
れて硬化し、その結果、耐溶剤性、耐水性、耐熱性に優
れたものとなり、電気・電子工業、化学工業などの広い
分野に適用できる産業上利用価値の高いものである。Table 1 [Effects] The photocurable organopolysiloxane composition of the present invention is as follows:
As explained above, the polymerization reaction is accelerated and cured by operation at relatively low temperatures or non-heating operations such as ultraviolet irradiation, resulting in a product with excellent solvent resistance, water resistance, and heat resistance. It has high industrial value and can be applied to a wide range of fields such as the electrical/electronic industry and the chemical industry.
Claims (4)
_3は同一または異種の非置換または置換の1価炭化水
素基、a、b、cは1〜6の正の整数、dは1〜200
の正の整数、nは1〜4の正の整数)で示されるオルガ
ノポリシロキサン100重量部と、重合用触媒0.01
〜10重量部とを含むことを特徴とする光硬化型オルガ
ノポリシロキサン組成物。(1) Formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ …(I) (In the formula, R_1 is a hydrogen atom or a methyl group, R_2, R
_3 is the same or different unsubstituted or substituted monovalent hydrocarbon group, a, b, c are positive integers of 1 to 6, d is 1 to 200
100 parts by weight of an organopolysiloxane (n is a positive integer of 1 to 4) and 0.01 parts by weight of a polymerization catalyst.
10 parts by weight of a photocurable organopolysiloxane composition.
は同一または異種の非置換または置換の1価炭化水素基
、またはフェニル基、a、bは1〜4の正の整数、nは
1〜200の正の整数) で示されるオルガノポリシロキサン100重量部と、重
合用触媒0.01〜10重量部とを含むことを特徴とす
る光硬化型オルガノポリシロキサン組成物。(2) Formula (II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼...(II) (In the formula, R is a methyl group or a hydrogen atom, R_1, R_2
is the same or different unsubstituted or substituted monovalent hydrocarbon group or phenyl group, a and b are positive integers of 1 to 4, and n is a positive integer of 1 to 200) Organopolysiloxane 100 weight 1 part by weight of a polymerization catalyst and 0.01 to 10 parts by weight of a polymerization catalyst.
ノポリシロキサンを併用した混合物100重量部と、重
合用触媒0.01〜10重量部とを含むことを特徴とす
る光硬化型オルガノポリシロキサン組成物。(3) A photocurable organoorganic product comprising 100 parts by weight of a mixture containing organopolysiloxanes represented by formulas (I) and (II) above, and 0.01 to 10 parts by weight of a polymerization catalyst. Polysiloxane composition.
量部と増感剤0.01〜10重量部とからなる請求項1
、2または3記載の光硬化型オルガノポリシロキサン組
成物。(4) Claim 1 in which the polymerization catalyst comprises 0.01 to 10 parts by weight of a photoreaction initiator and 0.01 to 10 parts by weight of a sensitizer.
, 2 or 3, the photocurable organopolysiloxane composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1322230A JPH0686499B2 (en) | 1989-12-11 | 1989-12-11 | Photocurable organopolysiloxane composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1322230A JPH0686499B2 (en) | 1989-12-11 | 1989-12-11 | Photocurable organopolysiloxane composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181509A true JPH03181509A (en) | 1991-08-07 |
| JPH0686499B2 JPH0686499B2 (en) | 1994-11-02 |
Family
ID=18141383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1322230A Expired - Fee Related JPH0686499B2 (en) | 1989-12-11 | 1989-12-11 | Photocurable organopolysiloxane composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0686499B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5750588A (en) * | 1996-09-27 | 1998-05-12 | Three Bond Co., Ltd. | Radiation-curable silicone composition |
| WO2006006402A1 (en) * | 2004-07-08 | 2006-01-19 | The Nippon Synthetic Chemical Industry Co., Ltd. | Active energy ray-curable resin composition, method for producing same, and coating composition using same |
| JP2016084446A (en) * | 2014-10-28 | 2016-05-19 | 大日精化工業株式会社 | Polysiloxane group-containing polymer and heat-cured coating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499168A (en) * | 1978-01-20 | 1979-08-04 | Shin Etsu Chem Co Ltd | Laminating molding material |
| JPS58113911A (en) * | 1981-12-04 | 1983-07-07 | ポリマ−・テクノロジ−・コ−ポレイシヨン | Contact lens material containing silicone and contact lens made thereof |
| JPS5943011A (en) * | 1982-09-03 | 1984-03-09 | Toshiba Silicone Co Ltd | Photocurable silicone composition and its production |
-
1989
- 1989-12-11 JP JP1322230A patent/JPH0686499B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499168A (en) * | 1978-01-20 | 1979-08-04 | Shin Etsu Chem Co Ltd | Laminating molding material |
| JPS58113911A (en) * | 1981-12-04 | 1983-07-07 | ポリマ−・テクノロジ−・コ−ポレイシヨン | Contact lens material containing silicone and contact lens made thereof |
| JPS5943011A (en) * | 1982-09-03 | 1984-03-09 | Toshiba Silicone Co Ltd | Photocurable silicone composition and its production |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5750588A (en) * | 1996-09-27 | 1998-05-12 | Three Bond Co., Ltd. | Radiation-curable silicone composition |
| WO2006006402A1 (en) * | 2004-07-08 | 2006-01-19 | The Nippon Synthetic Chemical Industry Co., Ltd. | Active energy ray-curable resin composition, method for producing same, and coating composition using same |
| JP2006045504A (en) * | 2004-07-08 | 2006-02-16 | Nippon Synthetic Chem Ind Co Ltd:The | Active energy ray-curable resin composition, method for producing the same, and coating agent composition using the same |
| JP2016084446A (en) * | 2014-10-28 | 2016-05-19 | 大日精化工業株式会社 | Polysiloxane group-containing polymer and heat-cured coating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0686499B2 (en) | 1994-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Kayaman-Apohan et al. | UV-curable interpenetrating polymer networks based on acrylate/vinylether functionalized urethane oligomers | |
| JPH02289611A (en) | Photo-setting resin composition | |
| JP2010144000A (en) | Photocurable resin composition, photocurable moistureproof sealing material for use in electronic paper, electronic paper, and method for manufacturing the same | |
| CN102504174A (en) | Polyurethane acrylic acid ester and preparation method and application thereof | |
| JPS61159462A (en) | Coating composition | |
| CN112646537A (en) | Preparation method of castor oil-based fully-crosslinked UV (ultraviolet) photo-peelable adhesive for silicon wafer cutting process | |
| JPS6174677A (en) | Photo-crosslinkable thermoplastic urethane painting system | |
| CA1163746A (en) | RADIATION CURABLE COMPOSITIONS CONTAINING .beta.- CYANOETHOXYALKYL ACRYLATES | |
| JPS62215624A (en) | Two component hardenable composition and method of carrying out composition of substrate | |
| JP2018154700A (en) | Curable resin composition | |
| JPH03181509A (en) | Photo-setting type organopolysiloxane composition | |
| JPS61130337A (en) | Ethylenic unsaturated polyester | |
| JP4013532B2 (en) | Active energy ray-curable composition for optical members | |
| JPH04505028A (en) | Free radical curable composition | |
| JP2010265402A (en) | Light and heat curing combined use-type resin composition, light and heat curing combined use-type moisture-proof sealing material for electronic paper, electronic paper, and method for producing the electronic paper | |
| JP2541997B2 (en) | Curing method with active energy rays | |
| WO2019182155A1 (en) | Curable composition, cured product, method for producing cured product, and method for repairing damage of cured product | |
| CN113336947B (en) | Fluorosilicone polymer with efficient UV (ultraviolet) photo-curing and thermal curing properties, preparation method thereof and coating | |
| JPH01163274A (en) | One-component coating composition | |
| JPS61143446A (en) | Coating material | |
| JP2003012727A (en) | Resin composition comprising high-refractive index (meth) acrylic ester compound and its cured product | |
| CN115044293B (en) | Release gloss oil based on EB curing | |
| İnan et al. | Synthesis and characterization of phosphorus‐containing methacrylate‐based difunctional crosslinkers and their use in UV‐curable resin systems | |
| JP7736491B2 (en) | Liquid crystal sealant for liquid crystal dripping method and liquid crystal display panel using the same | |
| JPH05247156A (en) | Resin composition, transmission screen ultrviolet-curable resin composition and cured material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071102 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081102 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091102 Year of fee payment: 15 |
|
| LAPS | Cancellation because of no payment of annual fees |