JPH03181548A - Resin composition for laminated sheet - Google Patents
Resin composition for laminated sheetInfo
- Publication number
- JPH03181548A JPH03181548A JP32095189A JP32095189A JPH03181548A JP H03181548 A JPH03181548 A JP H03181548A JP 32095189 A JP32095189 A JP 32095189A JP 32095189 A JP32095189 A JP 32095189A JP H03181548 A JPH03181548 A JP H03181548A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- acid
- allyl ester
- resin composition
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- -1 allyl ester Chemical class 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 21
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 21
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 15
- 239000000460 chlorine Substances 0.000 claims abstract description 15
- 239000003063 flame retardant Substances 0.000 claims description 15
- 239000000654 additive Substances 0.000 claims description 12
- 230000000996 additive effect Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 abstract description 6
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 239000012188 paraffin wax Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- 239000000463 material Substances 0.000 description 14
- 239000002253 acid Substances 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 9
- 239000000123 paper Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- 150000005846 sugar alcohols Polymers 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 229920006337 unsaturated polyester resin Polymers 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000001246 bromo group Chemical group Br* 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- VTUQBUGVFRNKSH-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4,5,5,5-dodecachloropentane Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)Cl VTUQBUGVFRNKSH-UHFFFAOYSA-N 0.000 description 1
- HFVIYAZBVIGNAN-UHFFFAOYSA-N 1,1-dibromodecane Chemical compound CCCCCCCCCC(Br)Br HFVIYAZBVIGNAN-UHFFFAOYSA-N 0.000 description 1
- OZHJEQVYCBTHJT-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-methylbenzene Chemical compound CC1=C(Br)C(Br)=C(Br)C(Br)=C1Br OZHJEQVYCBTHJT-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- HGRZLIGHKHRTRE-UHFFFAOYSA-N 1,2,3,4-tetrabromobutane Chemical compound BrCC(Br)C(Br)CBr HGRZLIGHKHRTRE-UHFFFAOYSA-N 0.000 description 1
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- QBELEDRHMPMKHP-UHFFFAOYSA-N 1-bromo-2-chlorobenzene Chemical compound ClC1=CC=CC=C1Br QBELEDRHMPMKHP-UHFFFAOYSA-N 0.000 description 1
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- PBLNBZIONSLZBU-UHFFFAOYSA-N 1-bromododecane Chemical compound CCCCCCCCCCCCBr PBLNBZIONSLZBU-UHFFFAOYSA-N 0.000 description 1
- DLKQHBOKULLWDQ-UHFFFAOYSA-N 1-bromonaphthalene Chemical compound C1=CC=C2C(Br)=CC=CC2=C1 DLKQHBOKULLWDQ-UHFFFAOYSA-N 0.000 description 1
- VMKOFRJSULQZRM-UHFFFAOYSA-N 1-bromooctane Chemical compound CCCCCCCCBr VMKOFRJSULQZRM-UHFFFAOYSA-N 0.000 description 1
- YZWKKMVJZFACSU-UHFFFAOYSA-N 1-bromopentane Chemical compound CCCCCBr YZWKKMVJZFACSU-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- REIDAMBAPLIATC-UHFFFAOYSA-N 4-methoxycarbonylbenzoic acid Chemical compound COC(=O)C1=CC=C(C(O)=O)C=C1 REIDAMBAPLIATC-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LTDRUAUVMLTEDG-UHFFFAOYSA-N C(C)(=O)CC(C)=[O+][O-] Chemical compound C(C)(=O)CC(C)=[O+][O-] LTDRUAUVMLTEDG-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 1
- JMSRBKPMLUGHCR-UHFFFAOYSA-N bromohydrin Chemical compound BrC[C]1CO1 JMSRBKPMLUGHCR-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- DZCLVBQEPZQZNN-UHFFFAOYSA-N copper;phenol Chemical compound [Cu].OC1=CC=CC=C1 DZCLVBQEPZQZNN-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- JTUSQSYFVVBAED-UHFFFAOYSA-N ditetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OCCCCCCCCCCCCCC JTUSQSYFVVBAED-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- GBMDVOWEEQVZKZ-UHFFFAOYSA-N methanol;hydrate Chemical compound O.OC GBMDVOWEEQVZKZ-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WOZVHXUHUFLZGK-UHFFFAOYSA-N terephthalic acid dimethyl ester Natural products COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-M valerate Chemical compound CCCCC([O-])=O NQPDZGIKBAWPEJ-UHFFFAOYSA-M 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、特に電気機益、電子機2g、通信機2に等に
使用される電気用積層板を製造するに好適な積層板用樹
脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a resin for laminates suitable for manufacturing electrical laminates used particularly for electrical equipment, electronic equipment 2g, communication equipment 2, etc. Regarding the composition.
「従来の技術」
電気用積層板に用いられる樹脂としては従来フェ/−ル
樹脂、エポキン樹脂、不飽和ポリエステル樹脂が代表的
なものであり、各種の基材と復合化して用いられている
。``Prior Art'' Typical resins used in electrical laminates are fer/fell resin, epochene resin, and unsaturated polyester resin, which are used in combination with various base materials.
しかし、フェノール樹脂は硬化時の反応副生物の発生や
溶剤の除去の問題かあり、エボキ/131.指は上記同
様、溶剤の除去の問題かある。不飽和ポリエステル樹脂
はこれらの問題がなく、ラジカル硬化型で使用しやすい
反面、耐熱性及びfl 、M!性か共に浸れた両性能の
バランスのとれた積層板を得ることは困難であり、現在
大きな課題となっ−ごいる。However, phenolic resin has problems with the generation of reaction by-products during curing and the removal of solvents, so EBOKI/131. As with the fingers, there is a problem with removing the solvent. Unsaturated polyester resin does not have these problems and is a radical curing type and easy to use, but it also has poor heat resistance, fl, M! It is difficult to obtain a laminate with a well-balanced combination of both properties, and is currently a major challenge.
例えば特公平1−13418号公報に示されるように不
飽和ポリエステル樹脂中に脂肪族臭素及び/または脂環
族臭素を含有し、かつ芳香族臭素を含有する不飽和ポリ
エステル樹脂系枯N’Nが提案されているが、なお問題
は十分に解決されているとは言えない。For example, as shown in Japanese Patent Publication No. 1-13418, unsaturated polyester resin N'N containing aliphatic bromine and/or alicyclic bromine and aromatic bromine in the unsaturated polyester resin is Although some proposals have been made, it cannot be said that the problem has been fully resolved.
「発明が解決しようとする課題」
本発明の課題は高い難燃性を有し、かつ優れた耐熱性を
合わせ持つ電気用積層板を製造するに好適なラジカル硬
化性の積層板用樹脂組成物を堤供することにある。``Problems to be Solved by the Invention'' The problem of the present invention is to provide a radical-curable laminate resin composition suitable for manufacturing electrical laminates that has both high flame retardancy and excellent heat resistance. The purpose is to provide.
「課題を解決するための手段」
本発明者はこれらの目的達成に努力した結果、アリルエ
ステル樹脂に特定のハロケン3ft化合物を配合した樹
脂X]I成物を用いることにより、(嗣熱性及び難燃性
が共に澄れた電気用積層板などの積層板を作り得ること
を見出し、本究明を完成した。"Means for Solving the Problems" As a result of efforts made by the present inventors to achieve these objectives, the present inventors have found that by using a resin We completed this research by discovering that it is possible to make electrical laminates and other laminates with clear flammability.
即ち、本発明の要旨は、アリルエステル樹脂20〜85
wt%に対して、臭素または塩素を含む添加j1!!難
燃性化合物80〜15wt%を配合してなる積病板用樹
脂相成51′yJにある。That is, the gist of the present invention is that allyl ester resins 20 to 85
wt%, additions containing bromine or chlorine j1! ! There is a resin phase composition 51'yJ for disease-prone boards which contains 80 to 15 wt% of a flame retardant compound.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明にいうアリルエステル樹脂とは、飽和多塩J、(
酸と飽1rl多f+15アルコールより構成されてなろ
飽if]ポリエステルの木ζW5にアリルエステル+、
(をイfする樹脂をいう。The allyl ester resin referred to in the present invention refers to saturated polysalt J, (
Consisting of acid and 1rl poly(f+15) alcohol, allyl ester + polyester wood ζW5,
(This refers to the resin that produces
上記飽和多塩基酸としては、例えば二塩)、(酸として
オルソフタル酸、オルソフタル酸無水物、イソフタル酸
、テレフタル酸等のフタル酸類、テトラヒ!・ロフタル
酸、メチルテトラヒドロフタル酸、エンドメチレンチ)
・ラヒドロフタル酸、メチルエツト、メチルテトラヒド
ロフタル酸、ヘキサヒドロフタル酸、メチルヘキ→ヒド
ロフタルQti、TiUそれらの酸無水物等のヒドロフ
タル酸類、マロン酸、コハク酸、グルタル酸、アジピン
酸等の脂肪族二塩基酸、テトラブロムフタル酸、テトラ
クロルフタル酸、クロレンド酸、及びこれらの酸飢水物
等のハロゲン化二塩基酸があげられる。三官能以上の多
塩基酸としてはトリメリット酸、ビロメノット酸及びそ
れらの酸無水物があげられる。これらは、単独でまたは
l見金して用いることかできる。Examples of the above-mentioned saturated polybasic acids include di-salts), (acids such as orthophthalic acid, orthophthalic anhydride, isophthalic acid, phthalic acids such as terephthalic acid, tetrahyphthalic acid, methyltetrahydrophthalic acid, and endomethylenethiol).
・Hydrophthalic acids such as rahydrophthalic acid, methyleth, methyltetrahydrophthalic acid, hexahydrophthalic acid, methylhex→hydrophthal Qti, TiU, their acid anhydrides, aliphatic dibasic acids such as malonic acid, succinic acid, glutaric acid, adipic acid, etc. , tetrabromophthalic acid, tetrachlorophthalic acid, chlorendic acid, and halogenated dibasic acids such as acid hydrates thereof. Examples of trifunctional or higher-functional polybasic acids include trimellitic acid, viromenotic acid, and acid anhydrides thereof. These can be used alone or in combination.
また、上記飽和多価アルコールとしては、エチレングリ
コール、l、2−7”ロピレングリコール、14−ブタ
ンジオール、1. 、 6−ヘキサ/フォール、ネオペ
ンチルグリコール、l、 4−7クロヘキサンジメタ
ノール、バラキシレングリコール等の脂肪族、脂環族ま
たは芳香族を含んだ−1ftt[のアルコールの他、一
般式H○(CHRCH、O)。H(Rは11またはC,
、l−(、、、、mは1〜5の整数、rlは2〜10の
整数)で表わされるエチレンオキサイド、プロピレンオ
キサイド等のアルキレンオキサイドの付加反応によって
得られる二価のアルコールかあげられる。三価以上の多
価アルコールとしては、例えばグリセリン、トリメチロ
ールプロパン等の脂肪族の三fdfiのアルコールやペ
ンクエリスリト−ル、′ノルビト−ル等の四(ali以
七のアルコールかあ(ヂられる。また、シフ゛ロムネオ
ペンチルグリコール、テトラフロモビスフェノールAエ
チレンオキサイt′付bn 拘のようなハロケン原子を
含む脂肪族、脂環族または芳香族のハロゲン化多価アル
コールがあげられる。これらは、(11独でちまたは配
合しても用いることかできる。In addition, the above-mentioned saturated polyhydric alcohols include ethylene glycol, 1, 2-7" propylene glycol, 14-butanediol, 1., 6-hexa/fall, neopentyl glycol, 1, 4-7 chlorohexanedimethanol, In addition to alcohols of the general formula H○ (CHRCH, O) containing aliphatic, alicyclic or aromatic compounds such as baraxylene glycol, H (R is 11 or C,
, l-(, , , m is an integer of 1 to 5, rl is an integer of 2 to 10) dihydric alcohols obtained by addition reaction of alkylene oxides such as ethylene oxide and propylene oxide. Examples of trihydric or higher polyhydric alcohols include aliphatic trihydric alcohols such as glycerin and trimethylolpropane, and polyhydric alcohols such as penquerythritol and norbitol. Examples include aliphatic, alicyclic, or aromatic halogenated polyhydric alcohols containing a halogen atom such as , cyphroneopentyl glycol, and tetrafluorobisphenol A with ethylene oxide.These include ( 11 can be used alone or in combination.
一方、本発明にいう臭素または塩素を含む添加型難燃性
化合物とは、分子内に1個または設数個の臭素原子また
は塩素原子を有する化合物であって、かつラジカル和合
しない添加型の脂肪族系、脂環族、芳香族系炭化水素化
合物をいう。例えば、モノブロモベンセン、ジブロモヘ
ノセン、トリフロモベンゼン、ブロモクロロベンセン等
の置換ヘンイン類、プロモフエ/−ル、ジフロモフェノ
ール、トリブロモフェノール、ぺ/タブロモフェノール
等のπを換フェノール頌、テトラブロムノフェニルエー
テル、ペンタブロムジフェニルエーテル、ヘキサブロム
ジフェニルエーテル、オクタフロムジフェニルエーテル
、デカブロムジフェニルエーテル等の置換ジフェニルエ
ーテル類、テトラブロモビスフェノールA1テトラブロ
モビスフエノールへのエチレンオキサイド付加物、テト
ラクロロビスフェノールA1臭素化エポキシ化合物、エ
チルブロマイド、プロピルブロマイド、ブチルブロマイ
ド、アミルブロマイド、ヘキ/ルブロマイド、オクチル
ブロマイド、ラウリルブロマイド、7′ブロモプロパン
、ジブロモデカン、テトラクロモメタン、テトラブロモ
ブタン、ヘキサブロモ/クロドデカン、ジブロモネオペ
ンチルグリコール、/ブロモプロパツール、エビブロモ
ヒドリン、ブロモトルエン、ペンタブロモトルエン、フ
ロモキ/レン、ブロモナフタレン、塩素化ハラフィン、
塩素化ポリエチレン、塩素化ポリプロピレン、パークロ
ロペンタンクロデカン、クロレンド酸、テトラクロロ無
水フタル酸、テトラブロモ無水フタルM、fii化ポリ
スチレン、ポリシフロモフJニルオキサイド等があげら
れるか、これらに限定されるしのではない。これらは単
I虫または複数(因の組み合わせで(重用できる。On the other hand, the additive type flame retardant compound containing bromine or chlorine as used in the present invention is a compound having one or several bromine atoms or chlorine atoms in the molecule, and is an additive type fat that does not radically combine. Refers to group-based, alicyclic, and aromatic hydrocarbon compounds. For example, substituted heynes such as monobromobenzene, dibromohenocene, triflomobenzene, and bromochlorobenzene; Substituted diphenyl ethers such as bromnophenyl ether, pentabrom diphenyl ether, hexabrom diphenyl ether, octafrom diphenyl ether, decabrom diphenyl ether, tetrabromo bisphenol A1, ethylene oxide adduct to tetrabromo bisphenol, tetrachlorobisphenol A1 brominated epoxy compound, Ethyl bromide, propyl bromide, butyl bromide, amyl bromide, hex/rubromide, octyl bromide, lauryl bromide, 7'bromopropane, dibromodecane, tetrachromomethane, tetrabromobutane, hexabromo/chlordodecane, dibromoneopentyl glycol, /bromo Propatool, shrimp bromohydrin, bromotoluene, pentabromotoluene, furomoki/ren, bromonaphthalene, chlorinated halafine,
Examples include, but are not limited to, chlorinated polyethylene, chlorinated polypropylene, perchloropentane clodecane, chlorendic acid, tetrachlorophthalic anhydride, tetrabromophthalic anhydride M, fii polystyrene, polysifromof J nyl oxide, etc. do not have. These can be used either as a single insect or as a combination of insects.
アリルエステル樹脂の製造法は既に公知であり、例えば
持頼昭63−262217号に述べられている。例えば
、アリルエステル樹脂はジアリルテレフタレ−1・のよ
うな飽和二塩基酸のジアリルエステルと飽和多価アルコ
ールとをエステル交換触媒と共に反応器に仕込みアリル
アルコールを留去させなから反応させ製造される。工業
的に更に有功な方法としては、ジアリルテレフタレート
の代わりにンメチルテレフタレートのような胞和二塙;
I(酸のンアルキルエステルをアリルアルコール、>
fr 7 ルコール及びエステル交換触媒と共に反応2
HHに仕込み、メタノール等の副生ずるアルコールを留
去させながら反応させて得ることができる。Methods for producing allyl ester resins are already known, and are described, for example, in Mochiyori No. 63-262217. For example, allyl ester resin is produced by charging the diallyl ester of a saturated dibasic acid such as diallyl terephthalate 1 and a saturated polyhydric alcohol together with a transesterification catalyst into a reactor and reacting without distilling off the allyl alcohol. . A more industrially effective method is to use methyl terephthalate instead of diallyl terephthalate;
I (alkyl ester of acid, allyl alcohol, >
Reaction 2 with fr 7 alcohol and transesterification catalyst
It can be obtained by charging it into HH and reacting it while distilling off by-product alcohol such as methanol.
また、反応温度によっては]\イドロキノンのようなπ
合′、λ止剤を反応C夜中に共存させてもよい。このよ
うにして飽(ロポリエステルの末端にアリルエステル1
.(を有するアリルエステル樹脂を製造することかでき
る。Also, depending on the reaction temperature]\π such as hydroquinone
In this case, a λ inhibitor may be present during reaction C. In this way, allyl ester 1 is added to the end of polyester.
.. It is possible to produce an allyl ester resin having (
本発明の樹脂組成物に使用できるアリルエステル樹脂の
種類は、一種類でも二種類以−1−混合してもよい。飽
(l多塩県酸と飽和多価アルコールの種類を種々選択す
ることによって、耐熱性を維持しながら電気特性、難燃
性等の良好な積層板用組成物を得ることができる。The types of allyl ester resins that can be used in the resin composition of the present invention may be one type or a mixture of two or more types. By selecting various types of polyhydric acid and saturated polyhydric alcohol, it is possible to obtain a composition for a laminate with good electrical properties, flame retardance, etc. while maintaining heat resistance.
本発明者の検討によれば、臭素または塩素を含む添加型
難燃性化合物を配合することにより、臭素またはj話素
による自己消火性を発現できる一方、耐熱性の高いアリ
ルエステル樹脂ととちに配合して使用しているために添
加をの′N撚剤でしばしば問題となる1制電圧特性等の
耐熱劣化の程度が小さく、非常にすぐれた電気用積層板
等の積層板を52造することができる。According to the study of the present inventor, by blending an additive type flame retardant compound containing bromine or chlorine, self-extinguishing property due to bromine or the chlorine can be expressed, while the same Because it is used in combination with N twisting agents, the degree of heat resistance deterioration such as voltage control characteristics, which is often a problem with N twisting agents, is small, and the laminates such as electrical laminates have excellent properties. can do.
本発明の樹脂組成物中に配合するアリルエステル樹脂と
臭素または塩素を含む添加型難燃性化合物との混合比率
は積層板性能の必要によって適宜彦根できるが、アリル
エステル461 tlM 20〜85wt%に対して、
臭素または塩素を含む添加型難燃性化合物80〜15w
(%、さらに好ましくはアリルエステル樹脂25〜80
wt%に対して臭素または塩素を含む添加型難燃性化合
物75〜20wt%かQFましい。アリルエステル樹脂
20wt%未満にス・1して80wt%を越える臭素ま
たは塩素を含む添加!j−1!、雌燃it化合物を配合
した場合、充分な積層板強度を出すには不都合であり、
また、85wt%を越えるアリルエステル樹脂に対して
15wt%未満の臭素または塩素を含む添加型難燃性化
合物を配合した場合、高度な難燃性を発揮させることか
難しい。例えば紙糸積層板の場合、銅箔エツチング後の
積層(灰中の樹脂含有量が40〜60wt%のときは、
樹脂中に脂肪族臭素として最低4〜5wt%含まれるよ
うに設定することにより、高度な難燃効果を発揮するこ
とができ、機械特性、電気特性等らすくれた電気用積層
板等の積層板を得ることかL″iJ能である。The mixing ratio of the allyl ester resin and the additive flame retardant compound containing bromine or chlorine to be blended into the resin composition of the present invention can be adjusted as appropriate depending on the needs of the laminate performance, but it is preferably 20 to 85 wt% for allyl ester 461 tlM. for,
Additive flame retardant compound containing bromine or chlorine 80-15w
(%, more preferably allyl ester resin 25-80
QF is preferably 75 to 20 wt % of an additive flame retardant compound containing bromine or chlorine based on the wt %. Addition containing more than 80 wt% of bromine or chlorine to less than 20 wt% of allyl ester resin! j-1! , it is inconvenient to produce sufficient laminate strength when a female combustion compound is blended,
Furthermore, when an additive flame retardant compound containing less than 15 wt% of bromine or chlorine is blended with an allyl ester resin of more than 85 wt%, it is difficult to exhibit a high degree of flame retardancy. For example, in the case of paper yarn laminates, lamination after copper foil etching (when the resin content in the ash is 40 to 60 wt%,
By setting the resin to contain at least 4 to 5 wt% of aliphatic bromine, it is possible to exhibit a high degree of flame retardant effect, and it is suitable for laminating electrical laminates with poor mechanical and electrical properties. It is L″iJ ability to get a board.
また、本発明の樹脂組成物には、上記アリルエステル樹
脂及び臭素または塩素を含む添加型難燃性化合物以外に
リン系の難燃剤を併用することし可能である。リン系の
′f!4撚剤としては、トリメチルホスフェート、トリ
エチルホスフェート、トリブチルホスフェート、トリオ
クチルホスフェ−1・、l・リフェニルホスフエート、
トリクレジルホスフェート、トリス(クロルエチル)ホ
スフェート、トリス(ジクロルプロピル)ホスフェート
、タレンルジフェニルホスフェート、トリフェニル十ス
ファイト等があげられる。また、三酸化アンチモン、五
酸化アンチモン等のアンチモン化合物、ホウ酸亜鉛、水
酸化アルミニウム等の無代系難燃剤を併用することも可
能である。Furthermore, in addition to the allyl ester resin and the additive type flame retardant compound containing bromine or chlorine, a phosphorus-based flame retardant can also be used in the resin composition of the present invention. Phosphorus 'f! 4 Twisting agents include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate-1, l-riphenyl phosphate,
Examples include tricresyl phosphate, tris (chlorethyl) phosphate, tris (dichloropropyl) phosphate, talenyl diphenyl phosphate, triphenyl decasphite, and the like. It is also possible to use antimony compounds such as antimony trioxide and antimony pentoxide, and non-synthetic flame retardants such as zinc borate and aluminum hydroxide.
さらに、本発明の樹脂Ill成物には1、L記アリルエ
ステル樹脂及び臭素または塩素を含む添加型難燃性化合
物以外に必要に応してランカル重音1り能な架橋性モノ
マーを使用することかでき、公知のものはいずれも使用
可能であるが、例えば、ジアリルオルソフタレート、ジ
アリルイソフタレート、ジアリルテレフタレートのよう
なジアリルフタレート類:スチレン、α−メチルスチレ
ン、p−メチルスチレン、p−クロルスチレン、フロム
スチレン、ジビニルベンセンのような置換スチレン類(
メタ)アクリル酸メチル、(メタ)アクリル酸エチル、
(メタ)アクリル酸ブチル、(メタ)アクリル酸2−エ
チルヘキ/ル、(メタ)アクリル酸ラウリル、(メタ)
アクリル酸ベン/ル、フロム化フェニル(メタ)アクリ
ル酸エステルのようなアクリル酸またはメタアクリル酸
エステル頌:エチレングリコールシ(メタ)アクリレー
ト、■、4−ブタンジオール/(メタ)アクリレ−]・
、トトリメチロールプロパントクリ(メタ)アクリレー
ト、ジアクリル化インンアヌレート、ペンタエリスリト
−ルトリ(メタ)アクリレート、ペンタエリスリト−ル
トラ(メタ)アクリレート、グリセリンン(メタ)アク
リレ−1−、ネオペンチルグJコールジ(メタ)アクリ
レート、ビスフェノールAジ(メタ)アクリレート等の
ビニル多實能アクリル酸またはメタアクリル酸エステル
類;ポリウレタン(メタ)アクリレート、ポリエーテル
(メタ〉アクリレート、エピクロルヒドリン変性ビスフ
ェノールバ/(メタ)アクリレート、エチレ/オキシド
変性ビスフェノールノ〜ジ(メタ)アクリレート、ポリ
エチレングリコールジ(メタ)アクリレート、ボリブロ
ピレングリコールジ(メタ)アクリレート等のビニル多
官能オリコニステル頌等が含まれる。Furthermore, in the resin composition of the present invention, in addition to 1. L allyl ester resin and the additive type flame retardant compound containing bromine or chlorine, a crosslinking monomer capable of carrying Rancal polycarbonate may be used as necessary. Any of the known ones can be used; for example, diallyl phthalates such as diallyl orthophthalate, diallyl isophthalate, and diallyl terephthalate; styrene, α-methylstyrene, p-methylstyrene, p-chlorostyrene; , fromstyrene, and substituted styrenes such as divinylbenzene (
Methyl acrylate, ethyl (meth)acrylate,
Butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, (meth)
Acrylic acid or methacrylic esters such as ben/ru acrylate, fromated phenyl (meth)acrylic ester: ethylene glycol cyclo(meth)acrylate, 4-butanediol/(meth)acrylate]・
, totrimethylolpropane tocri(meth)acrylate, diacrylated inanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tri(meth)acrylate, glycerin(meth)acrylate-1-, neopentyl glycol di(meth) Acrylate, vinyl multifunctional acrylic acid or methacrylic esters such as bisphenol A di(meth)acrylate; polyurethane (meth)acrylate, polyether (meth)acrylate, epichlorohydrin-modified bisphenolba/(meth)acrylate, ethylene/oxide Vinyl polyfunctional oriconisters such as modified bisphenol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and polypropylene glycol di(meth)acrylate are included.
これらの架橋性モノマーは目的に応じて二種類またはそ
れ以上を組み合わせて用いても何ら度しつかえない。こ
のような架橋性モノマーを配合すると、本来、固形もし
くは粘稠な、皮体であるアリルエステル樹脂の粘度を下
げることかでき、かつ、溶剤等を使用したプリプレグ状
牲を♀¥ることなく、積層板の製造工程を簡略化するこ
とか可能となって好適である。Two or more of these crosslinking monomers may be used in combination depending on the purpose. By blending such a crosslinking monomer, it is possible to lower the viscosity of the allyl ester resin, which is originally a solid or viscous shell, and without having to prepare a prepreg using a solvent or the like. This is preferable because it allows the manufacturing process of the laminate to be simplified.
本発明の樹脂組成物は汎用の有機過酸化物を用いて硬化
させることができ、有機過酸化物とともにまたは単独で
、光に感応する重合開始剤や放射線、電子線に感応する
重合開始剤等の公知の重合開始剤も利用できる。The resin composition of the present invention can be cured using a general-purpose organic peroxide, and may be used together with the organic peroxide or alone, such as a polymerization initiator that is sensitive to light, a polymerization initiator that is sensitive to radiation, or an electron beam. Known polymerization initiators can also be used.
有機過酸化物としては、例えば、メチルエチルケトンバ
ーイサイド、アセチルアセトンノく一オキサイド等のケ
トンパーオキサイド類、I、1−ビス(i−プチルバー
オキン)3,3.5−)リメチルシクロヘキサン、n−
ブチル−4,4−ビス(【ブチルパーオキン)バレレー
ト等のバーオキ/ケタール類、t−ブチルハイ5ドロパ
ーオキサイド、クメンハイドロパーオキサイド、p−メ
ンタンハイドロパーオキサイド等のハイドロパーオキサ
イド鎮、シーt−ブチルパーオキサイド、ジクミルパー
オキサイド、2,5−ジメチル−2,5−7(+−ブチ
ルパーオキ/ンヘキサン等のジアルキルパーオキサイド
類、ラウロイルパーオキサイド、ベンゾイルパーオキサ
イド等のンアンルバーオキサイド頌、ジー1so−プロ
ピルパーオキシ7カーボネート、ジミリスチルバーオキ
ンジカーボ不一ト、ビス(4−t−ブチル/クロヘキ/
ル)パーオキシジカーボネート等のバーオキシジカーホ
不−1・類、t−ブチルパーオキ/ビバレート、t−フ
ナルバーオキ7−2−エチルヘキサノエート、tブチル
パーオキ/ベンツエート等のパーオキシエステル類があ
げられる。これらは一種類または二種類以上混合して、
樹脂の種類、硬化条件に応じて用いることができる。Examples of organic peroxides include ketone peroxides such as methyl ethyl ketone biside and acetylacetone oxide, I,1-bis(i-butylvaquine)3,3.5-)limethylcyclohexane, n-
Peroxide/ketals such as butyl-4,4-bis([butylperoquine)valerate], hydroperoxide compounds such as t-butylhydroperoxide, cumene hydroperoxide, p-menthane hydroperoxide, and sheet t-butyl peroxide. oxide, dicumyl peroxide, 2,5-dimethyl-2,5-7(+-butyl peroxide/dialkyl peroxides such as hexane, lauroyl peroxide, benzoyl peroxide, etc.), di-1so-propyl Peroxy 7 carbonate, Dimyristyl carbonate, Bis(4-t-butyl/chlorohexyl/
Examples include peroxydicarbonates such as peroxydicarbonate, peroxyesters such as t-butyl peroxy/bibarate, t-funalperoxy 7-2-ethylhexanoate, and t-butyl peroxy/benzoate. . These can be one type or a mixture of two or more types,
It can be used depending on the type of resin and curing conditions.
本発明において樹脂組成物には必要に応じて充填材、補
強材、離型剤、着色剤、硬化剤、促進剤、安定剤等を併
用して積層板の性能を一層高めることも可能である。In the present invention, it is also possible to further enhance the performance of the laminate by using fillers, reinforcing materials, mold release agents, coloring agents, curing agents, accelerators, stabilizers, etc. in combination with the resin composition as necessary. .
本発明の樹脂組成物は公知方性に従って電気用積層板な
どの積層板の製造に使用することかできる。即ち、基材
に上記樹脂組成物を含浸し、3dした基材を複数枚積層
し、金属箔張り積層板にあっては片面もしくは両面にあ
らかじめ接青剤を塗布した、あるいは塗布しない金属箔
を重ね、無床または加圧下で加熱、硬化、成形すること
によって、電気用積層板を製造することができる。この
とき、金属箔は含浸積層基材の硬化成形後、貼りつけて
もよい。上記基材としては、従来の電気用積層板に用い
られている基材と同じものか使用でき、例えば、ガラス
繊維布、ガラス不織布等のガラス系基材、クラフト紙、
リンター紙、コノトン抵等のセルロース系紙基材、無機
質繊維系のンー)・状または帯状基材等をさす。基材と
して紙を用いる場合、含d仕や品質の観点から風乾時の
密度が03〜0 、7 g/ cm3であるようなセル
ロース繊1゛1tを主体とした紙、例えばクラフト紙が
好ましい。The resin composition of the present invention can be used in the production of laminates such as electrical laminates according to known isotropy. That is, a plurality of base materials are impregnated with the above-mentioned resin composition, and a plurality of 3D base materials are laminated, and in the case of a metal foil-clad laminate, metal foil is coated with a blue tint agent on one or both sides in advance, or is not coated. Electrical laminates can be produced by stacking, heating, curing, and forming without a bed or under pressure. At this time, the metal foil may be attached after the impregnated laminated base material is cured and molded. The above-mentioned base material can be the same as the base material used for conventional electrical laminates, such as glass base materials such as glass fiber cloth and glass non-woven fabric, kraft paper,
Refers to cellulose-based paper base materials such as linter paper and Konoton paper, and inorganic fiber-based materials in the form of or strips. When paper is used as the base material, from the viewpoint of d content and quality, paper mainly composed of cellulose fibers having a density of 0.3 to 0.7 g/cm3 when air-dried, such as kraft paper, is preferable.
これら基材は、本発明の樹脂組成物で含浸する前にあら
かじめ、尿素樹脂、メラミン樹脂、グアナミン樹脂等の
N−メチロール化合物、フェノール樹脂、ンランカソブ
リング剤等によって含d乾燥処浬を施すことにより、1
気特性の向−Lを図ることも可能である。Before impregnating these base materials with the resin composition of the present invention, they are pre-dry treated with N-methylol compounds such as urea resins, melamine resins, and guanamine resins, phenolic resins, and phosphoric acid soaking agents. By this, 1
It is also possible to aim for the direction -L of the air characteristics.
金属箔としては、電気回路用銅箔張りfa層成仏の用途
を目的とした電解銅箔が市販されており、これを用いる
ことが、61食性、エツチングf生、接台f生の観点か
ら好ましい。金属箔の厚さは10〜100μm程度か好
ましい。As the metal foil, electrolytic copper foil is commercially available for the purpose of forming a copper foil clad fa layer for electric circuits, and it is preferable to use this from the viewpoints of 61 etchability, etching resistance, and mounting resistance. . The thickness of the metal foil is preferably about 10 to 100 μm.
金属箔と樹脂e&?2基材との接着を効果的に達成する
ためには、接着剤を用いることか好ましく、接1り削と
しては硬化過程で不必要な副反応生成物の発生しないi
it状もしくは半流動状のものが好ましい。かかる観点
から、アクリレート系接着剤、エポキシ系接着剤、エポ
キシアクリレート系接着剤、イソンアネート系接着剤、
もしくはこれらの各種変性接着剤が用いられる。Metal foil and resin e&? In order to effectively achieve adhesion between two substrates, it is preferable to use an adhesive, and as a bonding agent, it is preferable to use an adhesive that does not generate unnecessary side reaction products during the curing process.
It is preferable to use it in an IT state or a semi-liquid state. From this point of view, acrylate adhesives, epoxy adhesives, epoxy acrylate adhesives, isonanate adhesives,
Alternatively, various modified adhesives may be used.
このようにして得られる積層板の厚みは、基材の種類、
硬化配合樹脂酸の組成、積層板の用途によって異なるが
、通常、0.5〜5mmである。また、積層板中の樹脂
組成物の割合は30〜80wt%である。The thickness of the laminate thus obtained depends on the type of base material,
Although it varies depending on the composition of the cured compound resin acid and the use of the laminate, it is usually 0.5 to 5 mm. Further, the proportion of the resin composition in the laminate is 30 to 80 wt%.
以下、本発明を実施例によって詳しく述べるが、本発明
の要旨を逸脱しない限り、これらの実施例のみに限定さ
れるものではない。なお、この明細書を通じて、温度は
すべて°Cであり、部及び%は特記しない限り重量基準
である。Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples unless it departs from the gist of the present invention. Throughout this specification, all temperatures are in degrees Celsius, and parts and percentages are by weight unless otherwise specified.
「実施例」
製造例1 アリルエステル樹脂(1)の製造蒸留装置を
具備した11の反応器に、ンアリルテレフタレ−)60
0g (2,44mo(り 、プロピレングリコール9
5.9g (]、26mo(2) 、ジブチル錫オキサ
イド0.1gを仕込んで窒素気流下で180’Cに加熱
し、生成してくるアリルアルコールを留去した。アリル
アルコールが140g(2,4]moc)留出したとこ
ろで、反応器内を5011ml1gまで減圧にし留去速
度を速めた。プロピレングリコールと当量のアリルアル
コールが留出した後、反応液を薄膜蒸留器を用いて20
0 ’Cに維持しながらI mm11gにおいて未反応
のジアリルテレフタレートを留出した。反応液をバット
にあけ、冷却、粉砕して粉状のアリルエステル樹脂(1
)をf、:、) 、iこ 。"Example" Production Example 1 Production of allyl ester resin (1) Into 11 reactors equipped with a distillation apparatus, 60
0g (2,44mo(ri), propylene glycol 9
5.9 g (2,4 ]moc) After distillation, the pressure inside the reactor was reduced to 5011 ml 1 g to accelerate the distillation rate.After allyl alcohol equivalent to propylene glycol was distilled out, the reaction liquid was distilled using a thin film distiller to
Unreacted diallyl terephthalate was distilled off at 11 g of I mm while maintaining the temperature at 0'C. Pour the reaction solution into a vat, cool and crush to obtain powdered allyl ester resin (1
) to f, :, ), iko.
牡4〕Ml 2− 臭素を含有するアリルエステル樹脂
(2)の製ノ告
第1表に示した条件を除いてはアリルエステル樹脂(1
)と同様に操作し、臭素を含有するアリルエステル樹脂
(2)を得た。4] Ml 2- Notice for the manufacture of allyl ester resin (2) containing bromine Except for the conditions shown in Table 1, allyl ester resin (1
) to obtain a bromine-containing allyl ester resin (2).
実施例1〜5
I平tl l 55 g / m 2、厚さ300μm
のクラフト紙をメラミン樹脂(日本カーバイトl[5−
305)水メタノール溶液に浸してローラで絞り、12
0”C130分乾燥させた。得られた紙基材中にメラミ
ン樹脂が15%付青した。この紙基材を第2表に示した
樹脂組成物の配6i&にlfかべ片面より樹脂液を含浸
させ、7枚を重ね合わせ、更に片面に接着剤付き銅箔(
三片金属鉱業製MK−61)を重ね合わせ、両面に50
μmのポリエステルフィルムをラミネートした後、プレ
ス機で加熱、加圧成形した。加熱加圧条件は140°C
130分、30 kg/ Cm”であった。プレス後、
熱風乾燥炉内で150’c、5時間加熱を行ない、厚さ
I 、 6 mmの銅箔張り積層板を得た。該銅箔張り
積層板の試験結果を第3表に示す。Examples 1-5 I flat tl l 55 g/m2, thickness 300 μm
kraft paper with melamine resin (Japan Carbide L [5-
305) Soak in water-methanol solution and squeeze with a roller, 12
It was dried for 130 minutes at 0"C. The resulting paper base material contained 15% of melamine resin and turned blue. This paper base material was coated with the resin composition shown in Table 2. The resin solution was applied from one side of the lf wall. 7 sheets are superimposed, and one side is coated with copper foil (
MK-61) made by Mikata Metal Mining Co., Ltd.
After laminating a μm polyester film, it was heated and pressure-molded using a press machine. Heating and pressurizing conditions are 140°C
130 minutes, 30 kg/cm”. After pressing,
Heating was carried out in a hot air drying oven at 150°C for 5 hours to obtain a copper foil-clad laminate having a thickness of I and 6 mm. The test results of the copper foil clad laminate are shown in Table 3.
比較例1〜4
第2表に示した比較例の樹脂組成物の配合液を使用した
他は実施例1〜5と同様にして銅箔張り積層板を製造し
た。該銅箔張り積層板の試験結果を第3表に示す。Comparative Examples 1 to 4 Copper foil-clad laminates were produced in the same manner as Examples 1 to 5, except that the blended resin compositions of the comparative examples shown in Table 2 were used. The test results of the copper foil clad laminate are shown in Table 3.
比較例5
市販の紙フエノール銅箔張り積層板(厚さ(,6+nm
、、XPCグレード)について実施例と同様にして物性
を試験した。試験結果を第3表に示す。Comparative Example 5 Commercially available paper phenol copper foil clad laminate (thickness (,6+nm
, XPC grade) were tested for physical properties in the same manner as in the examples. The test results are shown in Table 3.
第3表から明らかなように、アリルエステル樹脂及び臭
素または塩素を含む添加型難燃性化合物を含む樹脂組成
物から得られる電気用積層板は、比較例1.2の不飽和
ポリエステル樹脂系積層板より耐熱性が高く、比較例5
のフェノール樹脂系積層板より電気特性に優れている。As is clear from Table 3, the electrical laminate obtained from the resin composition containing an allyl ester resin and an additive flame retardant compound containing bromine or chlorine is the unsaturated polyester resin laminate of Comparative Example 1.2. Higher heat resistance than the board, Comparative Example 5
It has better electrical properties than phenolic resin-based laminates.
「発明の効果」
以上の説明から明らかなように、本発明の積層成用樹脂
組成物は、アリルエステル樹脂20〜85wt%と、臭
素または塩素を含む添加型難燃性化合物80=15wt
%を配合したものであるので、耐外性、難燃性に優れ、
しかも他の特性を充分に満足した銅箔張り積層板などの
電気用等の積層板を得ることができる。"Effects of the Invention" As is clear from the above description, the resin composition for lamination of the present invention contains 20 to 85 wt% of allyl ester resin and 80 = 15 wt% of an additive flame retardant compound containing bromine or chlorine.
%, it has excellent external resistance and flame retardancy.
Furthermore, it is possible to obtain electrical laminates such as copper foil-clad laminates that fully satisfy other characteristics.
出廓人 昭和電工株式会社Outsourcer: Showa Denko Co., Ltd.
Claims (1)
たは塩素を含む添加型難燃性化合物80〜15wt%を
配合することを特徴とする積層板用樹脂組成物。A resin composition for a laminate, characterized in that 80 to 15 wt% of an additive flame retardant compound containing bromine or chlorine is blended to 20 to 85 wt% of an allyl ester resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32095189A JPH03181548A (en) | 1989-12-11 | 1989-12-11 | Resin composition for laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32095189A JPH03181548A (en) | 1989-12-11 | 1989-12-11 | Resin composition for laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03181548A true JPH03181548A (en) | 1991-08-07 |
Family
ID=18127113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32095189A Pending JPH03181548A (en) | 1989-12-11 | 1989-12-11 | Resin composition for laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03181548A (en) |
-
1989
- 1989-12-11 JP JP32095189A patent/JPH03181548A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5116670A (en) | Allyl ester resin composition and laminated sheet using the same | |
| US4990409A (en) | Flame retardant electrical laminate | |
| US4486505A (en) | Flame-retarded copper clad laminates | |
| JPH0113418B2 (en) | ||
| JPH03181548A (en) | Resin composition for laminated sheet | |
| JPH03182514A (en) | Laminating resin composition | |
| JPH03182515A (en) | Laminating resin composition | |
| JPH0236218A (en) | Thermosetting resin composition and laminated sheet for electric use | |
| JPH0559597B2 (en) | ||
| JPH0410928A (en) | Fire-retardant copper-clad laminated sheet | |
| JPH0412843A (en) | Metal foil clad laminated sheet | |
| JPH04105932A (en) | Electric laminated sheet | |
| JPH04129738A (en) | Fire retardant electric laminated sheet | |
| JPH04314536A (en) | Electric laminate | |
| JPH04106995A (en) | Electric laminate | |
| JPH04129737A (en) | Electric laminated sheet | |
| JPH0568112B2 (en) | ||
| JPH0618908B2 (en) | Method for manufacturing electrical laminate | |
| KR950011045B1 (en) | Manufacturing method of electric laminate | |
| JPH03115415A (en) | Resin composition for laminate and laminate prepared by using same | |
| JPH03134032A (en) | Production of laminated board | |
| JPH04141413A (en) | Electric laminate | |
| JPH04107978A (en) | Laminated plate for electricity | |
| JPS5930813A (en) | Flame-retardant unsaturated polyester resin composition and laminated board | |
| JPH03264351A (en) | Copper clad laminate |