JPH03181580A - Adhesive for flexible printed-wiring board and flexible printed-wiring board using same - Google Patents
Adhesive for flexible printed-wiring board and flexible printed-wiring board using sameInfo
- Publication number
- JPH03181580A JPH03181580A JP32091289A JP32091289A JPH03181580A JP H03181580 A JPH03181580 A JP H03181580A JP 32091289 A JP32091289 A JP 32091289A JP 32091289 A JP32091289 A JP 32091289A JP H03181580 A JPH03181580 A JP H03181580A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive
- flexible printed
- weight
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 51
- 239000000853 adhesive Substances 0.000 title claims abstract description 47
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 238000004132 cross linking Methods 0.000 claims abstract description 23
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 14
- 239000004640 Melamine resin Substances 0.000 claims abstract description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 5
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 229920000800 acrylic rubber Polymers 0.000 claims description 20
- 229920000058 polyacrylate Polymers 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 15
- 230000006866 deterioration Effects 0.000 abstract description 12
- -1 acryl Chemical group 0.000 abstract description 3
- 229920001971 elastomer Polymers 0.000 abstract 2
- 239000000806 elastomer Substances 0.000 abstract 2
- 239000011369 resultant mixture Substances 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 239000004020 conductor Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 229920000459 Nitrile rubber Polymers 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 125000005591 trimellitate group Chemical group 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 210000001787 dendrite Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000007974 melamines Chemical class 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 241001441571 Hiodontidae Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフレキシブル印刷配線板用接着剤組成物及びこ
れに使用して得られるフレキシブル印刷配線板に関する
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an adhesive composition for a flexible printed wiring board and a flexible printed wiring board obtained using the adhesive composition.
フレキシブル印刷配線板は、通常ポリイミドフィルムの
ような可撓性を有するベースフィルムと呼ばれる絶縁材
料と銅箔とを接着剤で貼り合わせた基材の配線に必要な
銅箔部分を残して他の部分をエツチング除去し、接続の
ために必要な導体部分以外をレジストインクや基材の絶
縁材料と同様の絶縁材料に接着剤を塗布したカバーレイ
シートで覆い、必要な場合には露出した導体部分にめっ
きするという製造方法によって製造されている。Flexible printed wiring boards are made by bonding copper foil and an insulating material called a flexible base film, usually polyimide film, with adhesive, leaving only the copper foil part necessary for wiring, and other parts. Remove the conductor by etching, and cover the conductor parts other than those necessary for connection with resist ink or a coverlay sheet coated with adhesive on an insulating material similar to the insulating material of the base material, and if necessary, cover the exposed conductor parts. It is manufactured using a manufacturing method called plating.
すなわち、フレキシブル印刷配線板の断面構造は、導体
とベースフィルムの間に接着剤が挟まれた構造であり、
さらに、カバーレイシートと導体との間に接着剤が挟ま
れていることもある。In other words, the cross-sectional structure of a flexible printed wiring board is such that an adhesive is sandwiched between a conductor and a base film.
Furthermore, an adhesive may be sandwiched between the coverlay sheet and the conductor.
このようなフレキシブル印刷配線板は、近年、電子機器
の高度化、多様化にともない軽量で立体機能的に実装で
きることから、多く使用されるようになり、民生機器に
特に多用されている。In recent years, as electronic equipment has become more sophisticated and diversified, flexible printed wiring boards of this type have come into widespread use because they are lightweight and can be mounted in three-dimensional functionality, and are particularly frequently used in consumer equipment.
民生機器に使用される場合は安全性の立場から、材料の
熱劣化後の接着性の維持及び難燃性が要求されている。When used in consumer electronics, from a safety standpoint, the material is required to maintain adhesion after thermal deterioration and to be flame retardant.
例えば、材料の熱劣化における接着性の維持については
ＵＬＬ格７９６がその代表的なものであり、１５０ ’
Ｃで１０日間処理した後でも室温においてその接着強さ
が０．３６ ｋｇ／ｃｍ以上なければ１０５°Ｃクラス
の用途に使用できず、また、耐熱焼性においてＵＬ９４
Ｌ格で最も厳しいＶ−Ｏクラスに適合する合成樹脂絶縁
シートのポリイミドフィルムを用いても、接着剤を難燃
化しなければＵＬ規規格−０に合格するフレキシブル印
刷配線板が得られない。For example, ULL rating 796 is a typical example for maintaining adhesion during thermal deterioration of materials, and 150'
Even after being treated with C for 10 days, if the adhesive strength at room temperature is not less than 0.36 kg/cm, it cannot be used for applications in the 105°C class, and it also meets UL94 in heat sintering resistance.
Even if a polyimide film, which is a synthetic resin insulating sheet that meets the strictest V-O class with L rating, is used, a flexible printed wiring board that passes UL Standard-0 cannot be obtained unless the adhesive is made flame retardant.
さらに、これらのほかに、高温時の接着強さの維持、例
えば１０５°Ｃでの接着強さが０．５咄ｆ ／ ｃｖｎ
以上であること、あるいは電食劣化によるデンドライト
の発生や導体間絶縁抵抗の低下が小さいことなどが要求
されている。Furthermore, in addition to these, maintaining adhesive strength at high temperatures, for example, adhesive strength at 105°C is 0.5 tf/cvn.
It is also required that dendrite formation due to electrolytic corrosion deterioration and decrease in inter-conductor insulation resistance be small.
従来、フレキシブル印刷配線板用の難燃化した接着剤と
しては、例えばアクリルエラストマーやアクリロニトリ
ルブタジェンゴム（ＮＢＲ）を主成分とし、臭素含有エ
ポキシ樹脂、臭素含有フェノール樹脂等の難燃性熱硬化
樹脂や二酸化アンチモン、水酸化アル多ニウム等の難燃
助剤を添加する方法が特開昭６２−５９６８３号公報や
特開昭５６−８１３８２号公報によって知られている。Conventionally, flame-retardant adhesives for flexible printed wiring boards include, for example, acrylic elastomers and acrylonitrile butadiene rubber (NBR) as main components, and flame-retardant thermosetting resins such as bromine-containing epoxy resins and bromine-containing phenol resins. A method of adding a flame retardant aid such as antimony dioxide or polyaluminum hydroxide is known from JP-A-62-59683 and JP-A-56-81382.
アクリロニトリルブタジェンゴムを主成分とする系では
熱劣化後の接着強さや耐電食性に劣る欠点がある。一方
、アクリルエラストマーを主成分とする系では熱劣化後
の接着強さは比較的良好であるが、難燃性と接着性を両
立しうる組成範囲が狭いこと、及び高温時の接着強さが
不充分であった。Systems containing acrylonitrile butadiene rubber as the main component have the drawback of poor adhesive strength and electrolytic corrosion resistance after thermal deterioration. On the other hand, systems based on acrylic elastomer have relatively good adhesive strength after thermal deterioration, but the composition range in which both flame retardance and adhesiveness can be achieved is narrow, and the adhesive strength at high temperatures is poor. It was insufficient.
本発明はこのような問題点を解決し、難燃性と熱劣化後
の接着性及び高温時の接着強さに優れたフレキシブル印
刷配線板用接着剤を提供スルモノである。The present invention solves these problems and provides an adhesive for flexible printed wiring boards that is excellent in flame retardancy, adhesive properties after thermal deterioration, and adhesive strength at high temperatures.
本発明は（Ａ、）カルボキシル基、ヒドロキシル基及び
エポキシ基から選ばれる１種以上の官能基を有するアク
リルエラストマー （Ｂ）アルキルフェノール樹脂及び
又はメラミン樹脂、（Ｃ）エポキシ樹脂及び（Ｄ）アク
リルエラストマーとアルキルフェノール樹脂及び／又は
メラミン樹脂との架橋並びにエポキシ樹脂の架橋の両者
を同時に行いうる架橋触媒であるイミダゾリウムトリメ
リテートを必須成分とする接着剤組成物を提供するもの
である。The present invention comprises (A) an acrylic elastomer having one or more functional groups selected from a carboxyl group, a hydroxyl group, and an epoxy group; (B) an alkylphenol resin and/or a melamine resin; (C) an epoxy resin; and (D) an acrylic elastomer. The present invention provides an adhesive composition containing as an essential component imidazolium trimellitate, which is a crosslinking catalyst capable of simultaneously crosslinking both an alkylphenol resin and/or a melamine resin and an epoxy resin.
本発明はまた、上述の接着剤組成物を使用してベースフ
ィルムと回路とを接着してなるフレキシブル印刷配線板
を提供するものである。The present invention also provides a flexible printed wiring board in which a base film and a circuit are bonded together using the above adhesive composition.
本発明の接着剤組成物に難燃性を付与するにはエポキシ
樹脂として臭素化エポキシ樹脂を用いることによってな
されるが、さらに臭素基含有のアクリルエラストマーや
、助剤として水酸化アルミニウムや三酸化アンチモンな
どの無機充填材を併用することも有効である。この場合
、接着剤固形分中の臭素含有量は、８．０〜２６．０重
量％の範囲が望ましい。８．０重量％未満では接着剤を
難燃化するのに不充分であり、２６．０重量％を超える
と、接着性、特に耐熱劣化後の接着強さが低下すること
がある。Flame retardance can be imparted to the adhesive composition of the present invention by using a brominated epoxy resin as the epoxy resin, and in addition, acrylic elastomer containing a bromine group, aluminum hydroxide or antimony trioxide can be used as an auxiliary agent. It is also effective to use inorganic fillers such as. In this case, the bromine content in the adhesive solid content is preferably in the range of 8.0 to 26.0% by weight. If it is less than 8.0% by weight, it is insufficient to make the adhesive flame retardant, and if it exceeds 26.0% by weight, the adhesive property, especially the adhesive strength after heat deterioration, may decrease.
本発明に用いる（Ａ）成分のカルボキシル基、ヒドロキ
シル基及びエポキシ基から選ばれる一種以上の官能基を
有するアクリルエラストマーとしては例えば帝国化学産
業株式会社製ティサンレジン５Ｇ−５１、ＳＣ；−８０
，５Ｇ−９０、ＨＴＲ−７００，ＷＳ−０２３、ＷＳ−
０２３Ｂ、東亜合戒株式会社製アロンタックＳ−１５１
１Ｌ、Ｓ−１５１１Ｘ、Ｓ−３４０３等がある。Examples of the acrylic elastomer having one or more functional groups selected from carboxyl group, hydroxyl group, and epoxy group as component (A) used in the present invention include Tisan Resin 5G-51 and SC;-80 manufactured by Teikoku Kagaku Sangyo Co., Ltd.
, 5G-90, HTR-700, WS-023, WS-
023B, Arontack S-151 manufactured by Toa Gokai Co., Ltd.
There are 1L, S-1511X, S-3403, etc.
（Ｂ）成分のこれらのアクリルエラストマーとの架橋樹
脂としてはアルキルフェノール樹脂、メラミン樹脂など
が使用できる。例えば、日立化成工業株式会社製フェノ
ール樹脂ヒタノール２１８１．２３００．２４００．２
４１０、日立化戒工業株式会社製ブチル化メラミン樹脂
、メラン２０．２６．２８．２９などが使用できる。As the resin crosslinked with these acrylic elastomers as component (B), alkylphenol resins, melamine resins, etc. can be used. For example, phenolic resin Hytanol 2181.2300.2400.2 manufactured by Hitachi Chemical Co., Ltd.
410, butylated melamine resin manufactured by Hitachi Kakai Kogyo Co., Ltd., Melan 20.26.28.29, etc. can be used.
（Ｃ）成分のエポキシ樹脂としてはビスフェノール型エ
ポキシ樹脂、ノボラック型エポキシ樹脂、及びこれらを
臭素化したエポキシ樹脂などの１種以上を使用できる。As the epoxy resin of component (C), one or more of bisphenol type epoxy resins, novolac type epoxy resins, and brominated epoxy resins of these can be used.
またこれらと架橋しうる樹脂としてノボラックフェノー
ル樹脂、ビニルフェノール樹脂、及び臭素化ビニルフェ
ノール樹脂などを使用することもできる。In addition, novolac phenol resins, vinyl phenol resins, brominated vinyl phenol resins, and the like can also be used as resins that can be crosslinked with these resins.
本発明に用いる（Ｄ）成分の架橋触媒すなわちアクリル
エラストマーとアルキルフェノール樹脂及び／又はメラ
ミン樹脂との架橋、並びにエポキシ樹脂の架橋を同時に
行いうる触媒としてイミダゾリウムトリメリテート、例
えば四国化戒工業株式会社製キュアゾール２ＭＺ−ＣＮ
Ｓ、２Ｅ４ＭＺ−ＣＮＳ、２ Ｐ Ｚ ＣＮ Ｓ 、
Ｃｒ ＋ Ｚ ＣＮ Ｓなどが使用できる。架橋触
媒の添加量はアクリルエラストマーとアルキルフェノー
ル樹脂及び／又はメラミン樹脂並びにエポキシ樹脂の総
量１００重景部に対して０．１〜１０重量部、望ましく
は０．５〜３．０重量部の範囲である。０．１重量部未
満では架橋不充分であり、１０重量部を超えると接着特
性が低下することがある。Imidazolium trimellitate, such as Shikoku Kakai Kogyo Co., Ltd., is used as a crosslinking catalyst for component (D) used in the present invention, that is, a catalyst capable of simultaneously crosslinking the acrylic elastomer with the alkylphenol resin and/or melamine resin, and crosslinking the epoxy resin. Curesol 2MZ-CN
S, 2E4MZ-CNS, 2PZCNS,
Cr + Z CN S etc. can be used. The amount of the crosslinking catalyst added is in the range of 0.1 to 10 parts by weight, preferably 0.5 to 3.0 parts by weight, based on 100 parts of the total amount of the acrylic elastomer, alkylphenol resin and/or melamine resin, and epoxy resin. be. If it is less than 0.1 parts by weight, crosslinking is insufficient, and if it exceeds 10 parts by weight, adhesive properties may deteriorate.
アクリルエラストマとアルキルフェノール樹脂及び／又
はメラミン樹脂群とエポキシ樹脂との配合量比（重量比
）は大凧８５／１５〜３５／６５程度であるが、難燃性
を確保するに必要な臭素含量を確保すること及び接着特
性とのバランスにより決められる。望ましくは７０／３
０〜５０１５０の範囲である。The blending ratio (weight ratio) of acrylic elastomer to alkylphenol resin and/or melamine resin group to epoxy resin is approximately 85/15 to 35/65, but the bromine content necessary to ensure flame retardancy is It is determined by the balance between securing the adhesive properties and adhesion properties. Preferably 70/3
It ranges from 0 to 50150.
本発明の接着剤組成物において、これらの成分を溶解又
は分散させて均一な接着剤溶液にするための溶媒として
はトルエン、キシレン、メチルエチルケトン、メチルセ
ロソルブ、酢酸ソロソルブ、ジメチルホルムア旦ドなど
の有機溶媒が好ましく、これらのうちから１種又は混合
したものが使用される。In the adhesive composition of the present invention, organic solvents such as toluene, xylene, methyl ethyl ketone, methyl cellosolve, acetic acid solosolve, and dimethyl formamide are used as solvents for dissolving or dispersing these components to form a uniform adhesive solution. are preferred, and one or a mixture of these is used.
フレキシブル印刷配線板用基板は接着剤溶液を、ポリイ
ミドフィルム又は銅箔に塗工乾燥したのち、加熱プレス
又は加熱ロール装置を使用して両者を貼り合わせ、さら
に加熱硬化させて製造される。A substrate for a flexible printed wiring board is manufactured by applying an adhesive solution to a polyimide film or copper foil, drying it, bonding the two together using a heated press or a heated roll device, and then heating and curing the adhesive solution.
そして常法により回路形成を行いフレキシブル印刷配線
板とする。またカバーレイ用としては、ポリイミドフィ
ルムに塗工乾燥したのち予備硬化を行った状態で供用さ
れる。Then, a circuit is formed by a conventional method to obtain a flexible printed wiring board. In addition, for coverlays, it is used after being applied to a polyimide film, dried, and then precured.
Ｃ作用〕
本発明の（Ａ）カルボキシル基、ヒドロキシル基及びエ
ポキシ基から選ばれる１種以上の官能基を有するアクリ
ルエラストマー （Ｂ）アルキルフェノール樹脂及び／
又はメラミン樹脂、（Ｃ）エポキシ樹脂及び（Ｄ）アク
リルエラストマーとアルキルフェノール樹脂及び／又は
メラミン樹脂との架橋、並びにエポキシ樹脂の架橋の両
者を同時に行いうる架橋触媒であるイミダゾリウムトリ
メリテートを必須成分とする接着剤組成物により、特に
高温時の接着強さが良好となり、難燃性、耐熱劣化接着
強さ等の要求特性及びフレキシブル印刷配線板に必要な
一般特性をそれぞれ満足できる。C action] (A) Acrylic elastomer having one or more functional groups selected from carboxyl group, hydroxyl group and epoxy group (B) Alkylphenol resin and/or
Alternatively, imidazolium trimellitate, which is a crosslinking catalyst capable of simultaneously crosslinking the melamine resin, (C) the epoxy resin, and (D) the acrylic elastomer with the alkylphenol resin and/or the melamine resin, and the crosslinking of the epoxy resin, is an essential component. The adhesive composition has particularly good adhesive strength at high temperatures, and can satisfy required properties such as flame retardancy and heat-resistant deterioration adhesive strength, as well as general properties required for flexible printed wiring boards.
本発明の効果を発揮する作用は、接着剤組成物中の各成
分の相乗作用に基づくものであるが、特にイミダゾリウ
ムトリメリテート架橋触媒を用いてアクリルエラストマ
ー群とエポキシ樹脂架橋とが同時に行われることにより
、接着剤塗膜の凝集力が高められ、高温時においても維
持されるためとみられる。また、電食劣化は、銅回路か
らの接着剤塗膜中への溶解銅イオンや接着剤中の不純物
イオンによるマイグレーションが主原因と考えられてお
り、本発明の共架橋により塗膜の凝集力が向上し、上記
マイグレーションを抑制するものと推定される。The effect of the present invention is based on the synergistic effect of each component in the adhesive composition, and in particular, the acrylic elastomer group and the epoxy resin are cross-linked simultaneously using an imidazolium trimellitate cross-linking catalyst. This seems to be because the cohesive force of the adhesive coating is increased by being heated and maintained even at high temperatures. In addition, electrolytic corrosion deterioration is thought to be mainly caused by migration of dissolved copper ions from the copper circuit into the adhesive coating film and impurity ions in the adhesive. It is estimated that the above migration is suppressed.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
実施例１
（Ａ）アクリルエラストマーとして、ティサンレジンＨ
ＴＲ−７００（帝国化学産業株式会社製、商品名）８３
重量部、ティサンレジンＷＳ−０２３Ｂ３７重量部
（Ｂ）アルキルフェノール樹脂として、ヒタノール２４
１０（日立化戒工業株式会社製、商品名）３７重量部
（Ｃ）エポキシ樹脂として、ノボラック型臭素化エポキ
シ樹脂ＢＲＥＮ−３（日本化薬株式会社製、商品名）６
３重量部
（Ｄ）架橋触媒としてｌ−シアノエチル−２−フェニル
イミダゾリウムトリメリテート、キュアゾール２ＰＺ−
ＣＮＳ （四国化或工業株式会社製、商品名）１．５重
量部を予めジメチルホルムアミド１３．５重量部に溶解
させた溶液１５重量部及び
（Ｅ）充填材として水酸化アル亀ニウム、ハイシライト
４３Ｍ（昭和電工株式会社製、商品名）４５重量部
からなる組成を、メチルエチルケトン：トルエン＝１：
１の混合溶媒８６０重量部に溶解分散させて接着剤を作
製した。なお、水酸化アルミニウムは予めニーダ混練り
装置を使用して若干量の混合溶剤とともにアクリルエラ
ストマーに強制分散させて供試した。Example 1 (A) As an acrylic elastomer, Tisan Resin H
TR-700 (manufactured by Teikoku Kagaku Sangyo Co., Ltd., product name) 83
Part by weight, Tisan Resin WS-023B37 Part by weight (B) As the alkylphenol resin, Hytanol 24
10 (manufactured by Hitachi Kakai Kogyo Co., Ltd., trade name) 37 parts by weight (C) As the epoxy resin, novolac type brominated epoxy resin BREN-3 (manufactured by Nippon Kayaku Co., Ltd., trade name) 6
3 parts by weight (D) l-cyanoethyl-2-phenylimidazolium trimellitate, Curazole 2PZ- as a crosslinking catalyst
15 parts by weight of a solution in which 1.5 parts by weight of CNS (manufactured by Shikoku Kaaru Kogyo Co., Ltd., trade name) was dissolved in 13.5 parts by weight of dimethylformamide, and (E) Alkamenium hydroxide and Hisilite 43M as a filler. (manufactured by Showa Denko Co., Ltd., trade name) A composition consisting of 45 parts by weight of methyl ethyl ketone: toluene = 1:
1 was dissolved and dispersed in 860 parts by weight of a mixed solvent to prepare an adhesive. Note that aluminum hydroxide was previously forcibly dispersed in an acrylic elastomer together with a small amount of a mixed solvent using a kneader kneading device.
該接着剤溶液を厚さ２５μｍのカプトンフィルム（デュ
ポン社、商品名）に乾燥後の膜厚が２５μｍとなるよう
に塗布し、１２０°Ｃ１１０分間乾燥した後、厚さ３５
μｍの圧延鋼箔マット面に１３０″Ｃの熱ロールを使用
してラミネートした。次いで、１５０℃で２時間加熱硬
化してフレキシブル印刷配線板用基材を作製した。The adhesive solution was applied to a Kapton film (DuPont, trade name) with a thickness of 25 μm so that the film thickness after drying would be 25 μm, and after drying at 120°C for 110 minutes, a film with a thickness of 35 μm was applied.
It was laminated onto the matte surface of a μm rolled steel foil using a 130″C hot roll.Then, it was heated and cured at 150°C for 2 hours to produce a base material for a flexible printed wiring board.
また、上記接着剤を塗布したカプトンフィルムを１２０
℃、１０分間乾燥した後１５０″Ｃ１２分間追加乾燥し
てカバーレイフィルムとした。In addition, Kapton film coated with the above adhesive was coated with 120
After drying at 150° C. for 10 minutes, the film was further dried at 150° C. for 12 minutes to obtain a coverlay film.
前記銅張り基体をエツチングにより回路形成して得たフ
レキシブル印刷配線板に、パンチプレスで所定の穴あけ
を行ったカバーレイフィルムを貼り合わせた後、熱圧ブ
レスを使用して温度１６０°Ｃ１圧力３０ｋｇ／ｃｄ、
加熱時間６０分の条件でカバーレイ被覆を行った。A coverlay film in which predetermined holes were punched using a punch press was attached to the flexible printed wiring board obtained by forming a circuit on the copper-clad substrate by etching, and then a heat-pressing press was used at a temperature of 160° C. and a pressure of 30 kg. /cd,
Coverlay coating was performed under conditions of heating time of 60 minutes.
これらのフレキシブル印刷配線板、カバーレイ及び銅張
り基体の特性を測定した結果を第１表に示す。なお、特
性の測定は、
ａ、 回路引き剥がし強さ
ＪＩＳ Ｃ−６４８１試験法
す、耐熱劣化後の引き剥がし強さ
ＵＬ−７９６試験法
Ｃ９はんだ耐熱性
２８０°Ｃのはんだ浴に浮かべ、フクレやハガレの生じ
る時間の測定
ｄ、耐燃焼性
ＵＬ−９４ＶＯ試験法
ｅ、 耐電食性
回路導体中と間隔が共に０．２ ｔｘｍの電食評価用ク
シ形パターンを作製して供試した。Table 1 shows the results of measuring the characteristics of these flexible printed wiring boards, coverlays, and copper-clad substrates. In addition, the characteristics were measured using the following methods: a. Circuit peel strength JIS C-6481 test method, peel strength after heat deterioration UL-796 test method C9 soldering heat resistance Float in a solder bath at 280°C to prevent blisters and Measurement of time for peeling d, Combustion resistance UL-94VO test method e, Electrolytic corrosion resistant circuit conductor A comb-shaped pattern for evaluating electrolytic corrosion with a spacing of 0.2 txm was prepared and tested.
電食評価の試験は、多数の試験片において、これを促進
して行うため、６５°Ｃ／９０％の加温加湿下で、導体
間に直流５０Ｖを印加して連続的に通電し所定時間毎に
その一部を取り出して、導体間の絶縁抵抗を調べ、デン
ドライト発生の有無を倍率１００倍の顕微鏡で観察した
。In order to accelerate the electrolytic corrosion evaluation test on a large number of test pieces, the conductor was heated and humidified at 65°C/90%, and DC 50V was applied between the conductors for a specified period of time. A portion of each sample was taken out, the insulation resistance between the conductors was examined, and the presence or absence of dendrite formation was observed using a microscope with a magnification of 100 times.
各特性測定結果を表１に示す（以下同様）。The results of each characteristic measurement are shown in Table 1 (the same applies below).
実施例２
（Ａ）アクリルエラストマーとして、アロンタックＳ−
３４０３（東亜合成株式会社製、商品名）５０重量部、
ティサンレジンＷＳ−０２３，７０重量部
（Ｂ）アルキルフェノール樹脂としてヒタノール２４０
０ （日立化或工業株式会社製、商品名）３９重量部、
ブチル化メラミン樹脂としてメラン２９（日立化威工業
株式会社製、商品名、樹脂分５０重量％）７，６重量部
（Ｃ）エポキシ樹脂として、ノボラック型臭素化エポキ
シ樹脂ＢＲＥＮ−３（前出）４８重量部、ビスフェノー
ル型臭素化エポキシ樹脂ＹＤＢ−４００（東部化戒株式
会社製、商品名）２０重量部（Ｄ） 架橋触媒として、
１−シアノエチル−２−ウンデシルイ陪ダゾリウムトリ
メリテート、キュアゾールｃ ＋ ＋ ｚ ｃ ＮＳ
（四国化成工業株式会社製、商品名）６．３重量部
からなる組成を、メチルエチルケトン：トルエン：ジメ
チルホルムアミド−５，０：４．６：０．４（重量比）
の混合溶媒７７０重量部に溶解分散させて接着剤を作製
した。その他については実施例１と同様にした。Example 2 (A) Arontac S- as an acrylic elastomer
3403 (manufactured by Toagosei Co., Ltd., trade name) 50 parts by weight,
Tisan Resin WS-023, 70 parts by weight (B) Hytanol 240 as alkylphenol resin
0 (manufactured by Hitachi Chemical Co., Ltd., trade name) 39 parts by weight,
As a butylated melamine resin, Melan 29 (manufactured by Hitachi Kaei Kogyo Co., Ltd., trade name, resin content 50% by weight) 7.6 parts by weight (C) As an epoxy resin, a novolak type brominated epoxy resin BREN-3 (mentioned above) 48 parts by weight, 20 parts by weight of bisphenol-type brominated epoxy resin YDB-400 (manufactured by Tobu Kakai Co., Ltd., trade name) (D) As a crosslinking catalyst,
1-Cyanoethyl-2-undecylidazolium trimellitate, Curazole c + + z c NS
(Manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name) 6.3 parts by weight of methyl ethyl ketone:toluene:dimethylformamide-5.0:4.6:0.4 (weight ratio)
An adhesive was prepared by dissolving and dispersing it in 770 parts by weight of a mixed solvent. The rest was the same as in Example 1.
実施例３
（Ａ）アクリルエラストマーとして、ティサンレジンＨ
ＴＲ−７００（前出）８３重量部、ティサンレジン５Ｇ
−８０４４重量部
（Ｂ）アルキルフェノール樹脂としてヒタノール２４０
０ （前出）３３重量部
（Ｃ）エポキシ樹脂として、ノボラック型臭素化エポキ
シ樹脂ＢＲＥＮ−３（前出）４１重量部、ビスフェノー
ル型エポキシ樹脂、エピコート１００１、ＦＲ（昭和シ
ェル株式会社製、商品名）８重量部、エポキシ樹脂との
架橋樹脂として、臭素化ビニルフェノール樹脂 レジン
ＭＢ （丸善石油株式会社製、商品名）１８重置部
（Ｄ）架橋触媒として、キュアゾール２ＰＺ−ＣＮＳ（
前出） ０．９５重量部
及び
（Ｅ）充填材としてハイシライト４２Ｍ（昭和電工株式
会社製、商品名）２８重量部
からなる組成をメチルエチルケトン：トルエン：ジメチ
ルホルムアミド＝５．０ ： ４．６ ： ０．４ （
重量比）の混合溶媒７６０重量部に溶解分散させて接着
剤を作製した。その他については実施例１と同様にした
。Example 3 (A) As the acrylic elastomer, Tisan Resin H
TR-700 (mentioned above) 83 parts by weight, Tisan Resin 5G
-8044 parts by weight (B) Hytanol 240 as alkylphenol resin
0 (above) 33 parts by weight (C) As the epoxy resin, novolak type brominated epoxy resin BREN-3 (above) 41 parts by weight, bisphenol type epoxy resin, Epicoat 1001, FR (manufactured by Showa Shell Co., Ltd., trade name ) 8 parts by weight, as a crosslinking resin with epoxy resin, brominated vinyl phenol resin Resin MB (manufactured by Maruzen Sekiyu Co., Ltd., trade name) 18 parts by weight (D) as a crosslinking catalyst, Curesol 2PZ-CNS (
Methyl ethyl ketone:toluene:dimethylformamide=5.0:4.6:0 .4 (
An adhesive was prepared by dissolving and dispersing it in 760 parts by weight of a mixed solvent (weight ratio). The rest was the same as in Example 1.
参考例１ （Ａ）アクリロニトリルブタジェンゴム（ＮＢＲ。Reference example 1 (A) Acrylonitrile butadiene rubber (NBR.
アクリロニトリルモノマー単位３３重量％含有、ムーニ
ー値５５）１１０重量部
（Ｂ）アルキルフェノール樹脂としてヒタノール２４０
０ （前出）３８重量部
（Ｃ）エポキシ樹脂としてＢＲＥＮ−３（前出）７８重
量部
（Ｄ）エポキシ樹脂の硬化剤としてジシアンジアミド２
．０重量部
からなる組成をメチルエチルケトン：トルエン：ジメチ
ルホルムアミド＝５．０ ： ４．６ ： ０．４ （
重量比）の混合溶媒７６０重量部に溶解分散させて接着
剤を作製した。Contains 33% by weight of acrylonitrile monomer units, Mooney value 55) 110 parts by weight (B) Hytanol 240 as alkylphenol resin
0 (Previously) 38 parts by weight (C) BREN-3 as an epoxy resin (Previously) 78 parts by weight (D) Dicyandiamide 2 as a curing agent for the epoxy resin
．． The composition consists of 0 parts by weight of methyl ethyl ketone: toluene: dimethyl formamide = 5.0: 4.6: 0.4 (
An adhesive was prepared by dissolving and dispersing it in 760 parts by weight of a mixed solvent (weight ratio).
参考例２
実施例２において、架橋触媒を使用しなかったほかは実
施例２に示したと同様に行った。Reference Example 2 The same procedure as shown in Example 2 was carried out except that the crosslinking catalyst was not used.
参考例３
実施例３において、アルキルフェノール樹脂及び架橋触
媒を使用しなかったほかは実施例３に示したと同様に行
った。Reference Example 3 The same procedure as in Example 3 was carried out except that the alkylphenol resin and crosslinking catalyst were not used.
（Ａ）Ｊｆｆ１分のアクリルエラストマーと（Ｂ）成分
のアルキルフェノール樹脂及び／又はメラミン樹脂群と
、（Ｃ）成分のエポキシ樹脂の両者を同時に架橋しうる
触媒としてイ旦ダゾリウムトリメリテートを必須成分と
するフレキシブル印刷配線板用接着剤組成物により、高
温接着強さ、熱劣化後の接着性、耐電食性及び難燃性そ
の他一般特性がバランスして優れるフレキシブル印刷配
線板が得られた。Dazolium trimellitate is now used as an essential component as a catalyst that can simultaneously crosslink both (A) the acrylic elastomer with a Jff of 1, the alkylphenol resin and/or melamine resin group as the component (B), and the epoxy resin as the component (C). By using the adhesive composition for a flexible printed wiring board, a flexible printed wiring board having a good balance of high-temperature adhesive strength, adhesiveness after thermal deterioration, electrolytic corrosion resistance, flame retardance, and other general properties was obtained.
Claims (2)
シ基から選ばれる１種以上の官能基を有するアクリルエ
ラストマー、（Ｂ）アルキルフェノール樹脂及び／又は
メラミン樹脂、（Ｃ）エポキシ樹脂及び（Ｄ）アクリル
エラストマーとアルキルフェノール樹脂及び／又はメラ
ミン樹脂との架橋並びにエポキシ樹脂の架橋の両者を同
時に行いうる架橋触媒であるイミダゾリウムトリメリテ
ートを必須成分とする接着剤組成物。1. (A) Acrylic elastomer having one or more functional groups selected from carboxyl group, hydroxyl group and epoxy group, (B) Alkylphenol resin and/or melamine resin, (C) Epoxy resin, and (D) Acrylic elastomer and alkylphenol resin. and/or an adhesive composition containing as an essential component imidazolium trimellitate, which is a crosslinking catalyst capable of simultaneously crosslinking both a melamine resin and an epoxy resin.
ルムと回路とを接着してなるフレキシブル印刷配線板。2. A flexible printed wiring board obtained by bonding a base film and a circuit using the adhesive composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1320912A JP2679316B2 (en) | 1989-12-11 | 1989-12-11 | Adhesive for flexible printed wiring board and flexible printed wiring board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1320912A JP2679316B2 (en) | 1989-12-11 | 1989-12-11 | Adhesive for flexible printed wiring board and flexible printed wiring board using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181580A true JPH03181580A (en) | 1991-08-07 |
| JP2679316B2 JP2679316B2 (en) | 1997-11-19 |
Family
ID=18126656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1320912A Expired - Lifetime JP2679316B2 (en) | 1989-12-11 | 1989-12-11 | Adhesive for flexible printed wiring board and flexible printed wiring board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2679316B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819747A4 (en) * | 1995-04-04 | 1998-06-10 | Hitachi Chemical Co Ltd | Adhesive, adhesive film and adhesive-backed metal foil |
| WO2001074962A1 (en) * | 2000-03-31 | 2001-10-11 | Hitachi Chemical Co., Ltd. | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
| JP2001288437A (en) * | 2000-04-07 | 2001-10-16 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for cover lay film and cover lay film for flexible printed circuit board using its adhesive composition |
| JP2002265906A (en) * | 2001-03-06 | 2002-09-18 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for lamination used in flexible printed circuit board and adhesive film |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584379A (en) * | 1978-12-20 | 1980-06-25 | Sony Corp | Flame retardant adhesive composition |
| JPS61183374A (en) * | 1985-02-09 | 1986-08-16 | Toshiba Chem Corp | Adhesive composition for flexible printed circuit board |
-
1989
- 1989-12-11 JP JP1320912A patent/JP2679316B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584379A (en) * | 1978-12-20 | 1980-06-25 | Sony Corp | Flame retardant adhesive composition |
| JPS61183374A (en) * | 1985-02-09 | 1986-08-16 | Toshiba Chem Corp | Adhesive composition for flexible printed circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819747A4 (en) * | 1995-04-04 | 1998-06-10 | Hitachi Chemical Co Ltd | Adhesive, adhesive film and adhesive-backed metal foil |
| US5965269A (en) * | 1995-04-04 | 1999-10-12 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
| WO2001074962A1 (en) * | 2000-03-31 | 2001-10-11 | Hitachi Chemical Co., Ltd. | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
| US7070670B2 (en) | 2000-03-31 | 2006-07-04 | Hitachi Chemical Co., Ltd. | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
| KR100815314B1 (en) * | 2000-03-31 | 2008-03-19 | 히다치 가세고교 가부시끼가이샤 | Adhesive composition, its manufacturing method, adhesive film using this, board | substrate for semiconductor mounting, and semiconductor device |
| JP2001288437A (en) * | 2000-04-07 | 2001-10-16 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for cover lay film and cover lay film for flexible printed circuit board using its adhesive composition |
| JP2002265906A (en) * | 2001-03-06 | 2002-09-18 | Hitachi Kasei Polymer Co Ltd | Adhesive composition for lamination used in flexible printed circuit board and adhesive film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2679316B2 (en) | 1997-11-19 |
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