JPH03182088A - Ceramic heat emitting member with al fin - Google Patents

Abstract

PURPOSE:To have a heat emitting member with high reliability by furnishing an ion beam mixing layer between a surface Al film and a ceramic base board, wherein the mixing layer includes mixedly the constituents of said film and base board, raising the bond strength of the two to very high level, and brazing Al fins to the Al film. CONSTITUTION:By vacuum evaporation method, etc., an Al film is formed on a ceramic base board 11 selected according to the purpose of application, and this is irradiated with ion beam of Ar ions, etc. Atoms, etc., as constituent of Al film are implanted into the surface of the ceramic base board by the ion bombardment energy, to build an ion beam mixing layer 12 on the surface area, and the film is tightly secured to the base board by the anchor effect. Fins 2 consisting of Al core 21 and Al brazing material layers 22, 23, a ceramic heat-emitting body 1, and Al frames 4, 5 are arranged as specified and brazed by vacuum heating to complete intended product.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application J] The present invention relates to a ceramic heating member with aluminum fins, and more particularly, to a resistance heating ceramic heating member with aluminum fins used in hair dryers, hot air blowers, dryers, etc. It relates to a heat generating member.

[Prior Art] In recent years, heaters such as hair dryers, hot air blowers, dryers, etc. that use ceramic heat generating members with aluminum fins, which are made by bonding aluminum fins to a heat generating element made of a resistance heating type ceramic substrate, have become popular. There is. This type of heater generates heat in the ceramic substrate heating element by passing electricity through the aluminum fins, and then blows hot air into the gap between the fins, which are heated to a high temperature by thermal conduction. It is to take out.

[Problems to be Solved by the Invention] The above-mentioned conventional aluminum fin-equipped ceramic heat-generating member has a method of attaching the aluminum fins to the ceramic substrate heat-generating element using, for example, epoxy or acrylic in which conductive carbon or metal powder is dispersed. Since the adhesive is bonded using a conductive organic adhesive such as a phenolic adhesive, there is a limit to the heat resistance of the bonded part and the durability is also poor.

This drawback of conventional aluminum finned ceramic heat generating members can be solved by forming a thin aluminum film on a resistance heating type ceramic substrate by vacuum evaporation, sputtering, plating, etc. without using the above-mentioned conductive organic adhesive. This problem could be solved if the aluminum fin could be directly joined to the ceramic heating element by soldering or the like to the formed thin layer, but such a method would not provide enough joint strength to withstand use. The only way to bond the aluminum fins to the ceramic substrate heating element was to rely on the adhesives mentioned above.

[Means for Solving the Problems] The present invention solves the above-mentioned problems of the prior art, and provides a structure in which the aluminum fins are bonded to the ceramic substrate heating element with sufficient bonding strength, and An object of the present invention is to provide an aluminum finned ceramic heat generating member with improved heat resistance in its parts.

In order to achieve this object, the present invention takes the following configuration. Namely, the present invention provides a ceramic heating member with aluminum fins, which is formed by soldering aluminum fins to a ceramic heating element in which an ion beam mixing layer is formed between a surface aluminum thin film layer and a resistance heating type ceramic substrate. This is what we provide.

[Function] In the aluminum finned ceramic heat generating member of the present invention, an ion beam mixing layer in which constituent components of the two are mixed is formed between the aluminum thin film layer on the surface of the ceramic heat generating element and the ceramic substrate. Therefore, the adhesion strength between the aluminum thin film layer and the ceramic substrate is extremely high, and since the aluminum fins are soldered to the aluminum thin film layer, the bond between the ceramic heating element and the aluminum fins is extremely strong. Moreover, since the ceramic heating element and aluminum fin are joined by soldering as described above,
The bonded part will not melt up to about 600℃, and the heat resistance of the bonded part is extremely high.The ion beam mixing layer referred to here is a layer that mixes aluminum atoms, etc., into a ceramic substrate using the collision energy of ion beam irradiation. It is an atomic mixed layer formed by folding into the atomic layer.

[Examples] Next, the present invention will be described in detail by way of examples with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to the examples.

FIG. 1 is an enlarged cross-sectional view of a joint portion between a fin and a ceramic heat generating element of an example of the aluminum finned ceramic heat generating member of the present invention, and clearly shows the structure of the present invention. The ceramic heating element 1 has an ion beam mixing layer 12 on a ceramic substrate 11, and an aluminum thin layer 11Qfi13 on top of the ion beam mixing layer 12. As mentioned above, the ion beam mixing layer 12 is formed by pushing aluminum atoms etc. into the ceramic substrate by ion beam irradiation, so the interface between the living room and the living room is not necessarily as clear as shown in the figure. The aluminum fin 2 has an aluminum brazing material (AI-Si alloy or Al-51-Mg alloy) on both sides of the core material 21.
It has brazing filler metal layers 22 and 23 such as. A brazing core portion 3 is formed between the aluminum fin 2 and the ceramic heating element l.

FIG. 2 is a perspective view of an example of the aluminum finned ceramic heating member of the present invention. In this diagram,
Illustration of the fine layered structure as shown in FIG. 1 is omitted.

The aluminum thin film layer of the ceramic heating weight and the brazing material layer of the aluminum fins 2 are joined by soldering, and the other brazing material layer of the aluminum fins 2 is connected to the terminal portions A and B for wiring. It is soldered to aluminum outer frames 4 and 5 provided with aluminum fins to constitute an aluminum finned ceramic heat generating member. In the conventional ceramic heating member with aluminum fins, the connection between the aluminum fin 2 and the ceramic heating element l in FIG. 2 is not a joint as shown in FIG. It may be considered that an aluminum plate brazed to the fins is provided between them, and that the ceramic substrate heating element and the aluminum plate are further bonded with a conductive organic adhesive.

Next, a method of manufacturing the aluminum finned ceramic heating member as described above will be described.

As the resistance heating type ceramic substrate 11, various types can be used. For example, a ceramic material such as silicon carbide or molybdenum silicide is fired or sintered using a conductive material as its main component. ceramic substrates, metal powders, fibers, carbon black,
Ceramic substrates are manufactured by uniformly dispersing graphite powder, carbon fiber, conductive metal oxide powders and whiskers in ceramic materials, and then firing or sintering them. Examples include ceramic substrates manufactured by firing or sintering depending on the material. Also,
For example, a characteristic (PTC) ceramic thermistor substrate characterized by BaT i03 can also be used as the ceramic substrate 11. Such a PTC ceramic thermistor substrate conducts current at low temperatures and generates heat due to its resistance, but when it reaches a certain temperature range, its electrical resistance increases rapidly and almost no current passes through it. Therefore, when such a PTC ceramic thermistor substrate is used, a heater that can control temperature and has high safety can be obtained.

Ion beam mixing on ceramic substrate 11! fj1
2 and a method for forming the aluminum thin film layer 13 will be explained. Simultaneously with or after forming the aluminum thin film layer on the ceramic substrate, an ion beam mixing layer is formed by irradiating the ceramic substrate with an ion beam. The method for forming the aluminum thin film layer is not particularly limited, and may be any known thin film forming method such as vacuum evaporation, electron beam evaporation, sputtering, ion blasting, or plating. There are two cases in which an ion beam mixing layer is formed by irradiating an ion beam such as argon (Ar) ions, neon (Ne) ions, nitrogen (N) ions, etc. at the same time as the formation of an aluminum thin film layer; There are cases where an ion beam mixing layer is formed by beam irradiation. When forming an ion beam mixing layer by irradiating an ion beam at the same time as forming an aluminum thin film layer, Ar, N, etc. are used in addition to the aluminum evaporation source, etc.
Use equipment equipped with an ion beam source such as E or N.

On the other hand, in the case of the plating method, the shape of the aluminum thin film layer is f
& Later, ion beam irradiation is performed to form an ion beam mixing layer. The composition of the aluminum thin film layer may be pure aluminum, or may be an alloy containing aluminum as a main component as long as conductivity is ensured.

When ion beam irradiation is performed, the aluminum Pi film Pf
The constituent atoms, etc., are driven into the surface of the ceramic substrate by the collision energy of the ions, and an ion beam mixing layer is formed on the surface, and the atoms, etc. that make up the aluminum evaporation source layer are embedded in the ceramic substrate. state, causing the so-called anchor effect,
The aluminum thin film layer will firmly adhere to the ceramic substrate.

The effects of ion beam irradiation include the sputtering effect and atomic mixing on the surface of a substrate or thin film, as well as the effect of promoting chemical bonding and adsorption due to electronic excitation, even at approximately room temperature. Therefore, it goes without saying that the ion beam mixing layer, ie, the atomic mixed layer, referred to herein includes a layer that contains chemical bonds as described above in addition to mere atomic mixing.

A method of simultaneously performing ion irradiation and forming a thin film of aluminum, etc. is called ion vapor deposition (IVD), which is preferable to a method of performing ion irradiation after thin film deposition. This is because there are advantages such as the fact that an atomic mixed layer of sufficient depth can be easily formed with high reliability and high adhesion strength by low-energy ion irradiation. In such ion deposition, the deposited material deposited on the substrate is driven into the substrate by colliding ions, and a mixing layer is formed near the boundary between the substrate and the deposited film, and as ion deposition continues, a thin film is formed on the mixing layer. It is formed.

Next, an example will be described in which an ion beam mixing layer and an aluminum thin film layer are formed on a ceramic substrate by the above-described ion vapor deposition method using an ion vapor deposition thin film forming apparatus. While vacuum evaporating aluminum vapor from an aluminum evaporation source onto the surface of a ceramic substrate 11 attached to a substrate holter in the vacuum evaporation chamber of the apparatus, an argon ion beam accelerated at an acceleration voltage of 20 keV from an ion beam source is applied. The ion beam mixing layer 12 with a thickness of about 50 OA is formed by irradiation, and the aluminum thin film layer 13 with a thickness of about 950 OA is formed by vacuum evaporation of aluminum without argon ion beam irradiation.

Next, the aluminum fin 2 used in this embodiment is soldered to the ceramic heating element 1 made of a ceramic substrate having the ion beam mixing layer 12 and the aluminum thin film layer 13 formed on both sides. consists of an aluminum core material 21 and aluminum brazing material layers 22 and 23, as shown in FIG. 1, which are joined together by rolling. Two aluminum fins 2, a ceramic heating element 1, and an aluminum outer frame 4 and 5 are arranged as shown in FIG.
Brazing is carried out in a vacuum heating furnace at 0° C. In this case, for example, the time required to raise the temperature from around room temperature to 600 to 620° C. is about 10 minutes.

Holding time at 600-620℃ is about 3 minutes, 600-620℃
Since the aluminum brazing material layers 22 and 23 are provided on both sides of the aluminum core material 21, the cooling time from 0° C. to around room temperature is approximately 10 minutes. The soldering and the soldering of the aluminum fins 2 and the aluminum outer frames 4 and 5 are performed at the same time, and the desired ceramic heat generating member with aluminum fins is manufactured. Note that the material of the aluminum core material and the aluminum outer frame may be pure aluminum, or may be an alloy containing aluminum as a main component as long as conductivity is ensured.

In this example, an aluminum fin 2 in which aluminum brazing material layers 22 and 23 are provided on both sides of an aluminum core material 21 is used, but an aluminum fin in which an aluminum brazing material layer is provided on one side of an aluminum core material 2 is used. It goes without saying that the ceramic heat generating member with aluminum fins of the present invention can be manufactured even by using a ceramic heat generating element with an aluminum brazing material layer provided on an aluminum thin film layer. The object of the present invention can be achieved if there is a brazing material in the contact area. However, the method of this embodiment is advantageous in terms of cost.

Although one embodiment of the present invention has been described above, the present invention is not limited to this embodiment, nor is the aluminum finned ceramic heating member limited to the structure shown in FIG.

For example, in the above embodiment, the aluminum fins and the ceramic heating element were brazed directly, but they may also be brazed with an aluminum plate interposed between them. The same as in Figure 2 except that the brazing material layer was placed between the aluminum fins and the ceramic heating element, similar to those used in the above embodiment, and in contact with the ceramic heating element. Even if each component is arranged in an assembly and heated and soldered in the same manner as in the above embodiment, the desired aluminum finned ceramic heat generating member can be manufactured.

[Effect] The aluminum finned ceramic heat generating member of the present invention has an ion beam mixing layer formed between the surface aluminum thin film layer and the ceramic substrate in which the components of both are mixed, so that the adhesion between the two is strong. The structure uses a ceramic heating element with extremely high heat resistance, and the aluminum fins are soldered to the aluminum thin film layer, so the bond between the ceramic heating element and the aluminum fins is extremely strong. Since the ceramic heating element and the aluminum fin are joined together, the joined part will not melt up to about 600°C, and the joined part has extremely high heat resistance and excellent durability. Therefore, in the case of the conventional aluminum finned ceramic heating member using a conductive organic adhesive, it could only be used in a heating temperature range up to about 100°C, for example, whereas the aluminum finned ceramic heating member of the present invention The heating element has the advantage that it can be used in a heating temperature range up to a fairly high temperature.

In addition, compared to the case where a conductive organic adhesive is used, the joining part between the ceramic heating element and the aluminum fins is made of a brazing filler metal mainly composed of aluminum, which has excellent thermal conductivity. The heat generated in the aluminum fins has the advantage of being efficiently transferred to the aluminum fins.

Furthermore, conductive organic adhesives have low radiation resistance, and conventional aluminum finned ceramic heating members cannot be used in environments with high radiation levels, such as near nuclear reactors, whereas brazing, which has high radiation resistance, The aluminum finned ceramic heating member of the present invention used has the advantage that it can be used even in environments with high radiation doses, such as near nuclear reactors.

The ceramic heating member with aluminum fins of the present invention can be used in various heaters, and can be particularly advantageously used in hair dryers, hot air blowers, dryers, etc., and can also be used in a high heating temperature range. So,
We can expect the development of a wide range of applications.

[Brief explanation of drawings]

FIG. 1 is an enlarged cross-sectional view of a joint portion between a fin and a ceramic heating element of an example of the aluminum finned ceramic heating member of the present invention. FIG. 2 is a perspective view of an example of the aluminum finned ceramic heating member of the present invention. DESCRIPTION OF SYMBOLS 1... Ceramic heating element, 2... Aluminum fin, 3... Brazing core, 11... Ceramic substrate, 12... Ion beam mixing layer,
13... Aluminum thin film layer, 21... Aluminum core material, 22 and 23... Brazing metal layer.

Claims (2)

[Claims] (1) An aluminum fin is soldered directly or via an aluminum plate to a ceramic heating element in which an ion beam mixing layer is formed between a surface aluminum thin film layer and a resistance heating type ceramic substrate. Ceramic heating element with aluminum fins. (2) The aluminum finned ceramic heating member according to claim 1, wherein the ion beam mixing layer is formed by an ion evaporation method.