JPH03183793A - Stripe-plating device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement in an apparatus for producing striped plating strips using a plating solution injection method, and in particular, the present invention relates to an improvement in an apparatus for producing striped plating strips using a plating solution injection method, and in particular, to prevent the plating solution from adhering to the stripes to be plated as it travels during plating work. The present invention relates to a plating apparatus configured to prevent contamination of surfaces other than the plating surface when the plating apparatus is taken out.

[Prior art] Electronic component materials such as lead frames for ICs are required to have high reliability, and their bonding surfaces and electrical contacts are plated with expensive precious metals such as gold. It is usual to apply solder plating to facilitate wire bonding.

Stripe plating was developed to plate such precious metals, solder, etc. to the minimum necessary range, and to save materials and reduce costs.

In the conventional stripe plating described above, only the surface to be plated of the strip to be plated is left, all other surfaces are blocked from infiltration of the plating solution with a resist agent or masking tape, and then this is immersed in the plating solution. It was common to plate the surface by stirring and spraying an electrolyte onto the surface.

However, in this conventional method, the outside of the plated part is masked with masking tape, so a large amount of masking tape is required compared to the size of the plated surface, which is unavoidably expensive. If a large amount of liquid is carried out, and if the parts to be plated are entirely masked and passed through the plating tank or guide rolls, breakage may occur due to cracks at the slit ends of the liquid removal plating strips. As a result, the plating solution penetrates through the torn portion, causing displacement plating, which may cause poor appearance.

Therefore, the inventors previously proposed a plating apparatus as shown in FIGS. 2 and 3.

That is, the strip 20 to be plated is slid in the longitudinal direction while keeping its wide surface vertical, and the surface 21 to be plated is left and is partially masked to the minimum using a masking tape 22 in a separate masking step. The plating solution 2 stored in the plating tank 4 is forced to circulate as shown by the arrow in the figure using a bong 15, and is temporarily stored in an auxiliary tank 6, after which the pressurized plating solution is passed through the nozzle 3 to the surface to be plated 21. Inject to. On the outer periphery of the nozzle 3 is a mantle having an interval somewhat wider than the width of the surface to be plated 21 divided by the masking tape 22 of the strip to be plated, or having an opening surface whose inner diameter is in sufficient contact with the masking tape 22. 1 is provided between the mantle 1 and the nozzle 3 or a liquid tank 4.
A collection lower is formed at the entrance to the plating solution tank 4.
The plating solution is evacuated by the suction pump 8 at the upper part of the plating tank 4, and the inside of the plating solution tank 4 is made negative pressure, so that the plating solution sprayed onto the surface to be plated 21 is sucked by the recovery lower, and the excess plating solution 2 is removed from the plating tank 4. It is sucked and collected into liquid m4.

The auxiliary tank 6 is provided to stabilize the pressure for spraying the plating solution and to install the anode material 10, and the pressurized plating solution 2 is temporarily stored in the auxiliary tank 6. It is stored under pressure and is injected through a nozzle 3.

In addition, in FIG. 2, the auxiliary tank 6 is installed outside the plating solution tank 4, and the anode material 10 is configured so that the opening rR119 can be opened and closed.
Figure 3 shows an example where the installation and replacement of the plating solution tank 4 is simplified. ! 11 is provided so that the empty taff for creating a negative pressure in the plating liquid tank 4 is narrowed, so that even if the suction capacity of the suction pump 8 is reduced, the necessary negative pressure can be obtained sufficiently. It is something that

[The invention tries to solve g! [Issue] The previously proposed device described above can perform excellent stripe plating, and has already been put into practical use and has been well received. However, the plating solution sprayed onto the plating surface is collected inside the plating tank by negative pressure suction. However, it is impossible to completely recover the plating solution sprayed onto the plating surface, and it is difficult to completely recover the plating solution sprayed onto the plating surface. The tamping liquid attached to the casing may be spread upward and downward on the plating strip by the edge of the mantle and spread, causing contamination of the outside of the plating area or causing plating smearing.

The purpose of the present invention is to eliminate the drawbacks of the prior art as described above, and to provide a stripe plating strip of higher quality that is free from contamination by plating solution outside the plating section and plating bleeding, etc.
f! The present invention is intended to provide a new licking device that can be used in various ways.

[Means for Solving the Problems] The present invention provides a nozzle for injecting a plating solution in a plating solution tank toward a plating surface, a mantle that partitions the periphery of the nozzle to form a plating opening surface, and a plating method. and a suction means for making the inside of the tank a negative pressure and collecting the injected plating liquid into the plating tank, and sliding the strip to be plated on the open surface of the mantle to coat the surface to be plated. In a plating device, a small gap opening is formed at the end edge of the mantle on the longitudinal side of the strip to be plated, through which outside air having an internal diameter larger than the width of the plating surface can be introduced.

[Function] If a small gap is formed at the edge of the mantle on the longitudinal side along which the strip to be plated runs, a small gap through which outside air can be introduced will allow the small amount of plating solution remaining on the plated surface to flow into the small gap. The remaining adhering plating liquid is collected by being sucked into the inside of the plating tank by the negative pressure of the plating inspection, and if there is a gap at the edge of the mantle, it is removed by holding the edge as in the conventional case. This eliminates the effect of rubbing the surface to be plated, and eliminates the effect of the remaining plating solution being spread above and below the plated strips, which is the cause of contamination by the plating solution and bleeding of the plating, as in the conventional case. This means that all of the particles that become M are removed, making it possible to consistently perform normal plating at all times.

[Example] The present invention will be described below with reference to the drawings.

FIG. 1 shows the frontage surface IA of the outer mantle of the plating apparatus according to the present invention.
FIG. 2 is an explanatory perspective view showing a specific example of a nearby structure.

As already explained, the pressurized plating solution is temporarily stored in the auxiliary 1ff6 and is injected from the nozzle 3 onto the plated object 21.

Masking tape 22 to be plated is placed on the outer periphery of the nozzle 3.
The jacket 1 is provided with an opening surface (in the case of a cylindrical type, an opening surface whose inner diameter dimension sufficiently contacts the masking tape 22) IA having a somewhat wider interval than 111 of the surface to be plated 21 divided by, As mentioned above, the minimum surface is masked by the partial masking tape 122, and the plated strip 20 forming the plated surface 21 is attached to the edge 1 of the mantle 1.
1 and moves in the direction of the arrow in the figure while sliding, and during this running movement, stripe plating is performed on the surface to be plated 21 with the plating solution sprayed from the nozzle 3.

During this plating, in the conventional example, a small amount of plating solution remains attached and is taken out, and it is rubbed up and down by the edge 11a of the outer coat in the moving direction of the plated shape, causing contamination and plating smearing. It was causing this.

In the present invention, a small gap opening 12 through which outside air can be introduced is formed at the end edge 11a of the mantle 1 on the longitudinal side of the plating strip along which the plating strip moves.

As for the inner part rt1 of the gap opening 12, it is desirable to form it in the middle of the opening surface IA.
There is no problem as long as it is larger than the width of .

The depth of this gap opening 12 is also related to the suction force of the suction bong 18 described earlier, but in short, the adhering plating liquid that has adhered to the plating surface and is about to be taken out is removed by the negative pressure of the suction pump 8. It is fine as long as it can soak into the inside of the plating tank, but if the depth is too large, a large amount of outside air will be sucked in and
The internal negative pressure becomes extremely insufficient, and the pressurized plating solution flows out through the gap opening 12 due to the pressurizing force, causing the opposite effect.

In order to prevent such liquid from flowing out and to allow the adhering plating liquid to sip between the interior spaces, it is practically desirable to have a depth of 1 mm or less.

As shown in FIG. 2, the small gap opening 12 is naturally formed at the edge 11a of the mantle 1 on the running exit side of the strip to be plated. Considering that the traveling speed of the plating strip cannot be increased that much, it is desirable to form a similar small gap opening on the opposite side, that is, on the edge of the inlet side of the strip to be plated.

[Effects of the Invention] As described above, the plating apparatus according to the present invention can sufficiently prevent contamination of the plating strip or bleeding of the plating due to removal of the plating solution, and can not only contribute to improving the quality of the stripe plating strip, but also improve the plating. As a result of the drastic reduction in the amount of liquid taken out, the contamination of the wash water after plating with the plating solution is greatly reduced, and the secondary benefit of simplifying the treatment of waste liquid after cleaning can be expected. .

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing the specific configuration near the frontage of the mantle of the device according to the present invention, and Figs. 2 and 3 are the previously proposed 2I.
It is an explanatory cross-sectional view of the plating apparatus in a. 1: Mantle, IA: Mantle front surface, 3: Nozzle, 6. Auxiliary tank, 11. Mantle end edge, 12: Outside air introduction small gap, 20: Plating strip. , 2: Plated surface, 22: Masking chi 1°

Claims (1)

[Claims] (1) A nozzle that sprays the plating solution in the plating solution tank toward the plating surface, a jacket that partitions the area around the nozzle to form a plating opening surface, and a negative pressure inside the plating tank that sprays the plating solution. and a suction means for recovering the plating into the plating tank, and in the device for plating the surface to be plated by sliding the strip to be plated on the opening surface of the jacket, the longitudinal direction of the strip to be plated at the edge of the jacket. A stripe plating device in which a small gap opening, which has an inner width larger than the width of the plating surface and can introduce outside air, is formed on the side edge.