JPH03186742A - Image pickup device for radiation image - Google Patents

Abstract

PURPOSE:To execute the image pickup of a radiation image of high resolution in an image pickup device using an array type radiation detector by forming each unit element in a slender shape, and arranging them in its lateral direction. CONSTITUTION:Three pieces of unit elements 1a, 1b and 1c collect and constitute a secondary unit C, and one array sensor is constituted by arranging many secondary units thereof C. Each unit element 1a, 1b and 1c is formed in a slender shape, and in its rear end, a bonding electrode part 2 is formed so as to be protruded to the side. These electrode parts 2 are combined to each other and held within width of the secondary unit C in which three pieces of unit elements are arranged closely in the width direction. In such a state, it is irradiated with a radiant ray through a slit so that its projection with becomes the same degree as an array pitch (p) of the unit elements. The resolution in the X direction of a radiation image is determined by the array pitch (p), and the resolution in the Y direction is determined by projection width W on an array sensor of the slit. Also, by moving a projection of this slit in the lengthwise direction of each unit element on the array sensor, a two-dimensional image dissection can be executed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a radiation image capturing apparatus equipped with a radiation detector in which unit radiation detection elements are arranged in an array.

(Prior art) When capturing a radiation image - A method is used in which a dimensional array sensor is used to scan the radiation image in a direction perpendicular to the direction in which the unit elements of the array sensor are arranged.The radiation image obtained in this case is The resolution of is determined by the vertical and horizontal size of the receiving surface of each unit element on the array.Each unit element on the array must be provided with a bonding electrode for connection with the substrate. There is a limit to how small the unit element itself can be, making it impossible to increase the resolution of radiation images.

(Problems to be Solved by the Invention) The present invention aims to enable high-resolution, high-power radiation image capturing in an imaging apparatus using an array-type radiation detector.

(Means for Solving the Problem) Each unit element is made into an elongated shape and arranged in the short direction to form an array sensor, and the slits arranged in parallel with the array sensor are placed on the array sensor. The projection width of the slit is approximately the same as the unit element arrangement pitch of the array sensor, and the slit and the array sensor are integrated, or the projection of the slit onto the array sensor moves on the array sensor. did.

(Function) Since each unit element is elongated, the resolution of the imaging device in the unit element arrangement direction is determined by the width of the unit element in the lateral direction.

On the other hand, the resolution in the direction perpendicular to the unit element arrangement direction is determined by the slit width, and the slit width can be set arbitrarily small, so the resolution in the slit width direction can be easily increased regardless of the length of each unit element. Since resolution is obtained and each unit element is not limited in length in the longitudinal direction, bonding electrodes can be arranged freely, and resolution in the arrangement direction of the unit elements can also be easily increased.

(Example) FIG. 1 shows an embodiment of the present invention. In the figure la.

lb and lc are unit elements, and three unit elements together constitute a secondary unit C, and a large number of these secondary units C are lined up to constitute one array sensor. Each unit element 1a
, lb, and lc are elongated, and have a bonding electrode part 2 protruding laterally at the rear end thereof, and these bonding electrode parts 2 are combined with each other to form a unit element of 3.
It is placed within the width of the secondary units C arranged closely in the width direction.

FIG. 2 shows another embodiment of the present invention, in which three unit elements constitute one secondary unit.
are arranged in a triangular shape with different combinations. FIG. 3 shows yet another embodiment, in which four unit elements constitute a secondary unit C, and the four bonding electrodes are combined to form a chevron shape. There is.

In FIGS. 1 to 3, 3 is the projection of radiation from a slit (not shown) onto the array sensor, and the resolution of the radiation image in the X-ray direction is unit sensor la, b.

The resolution in the Y direction is determined by the width W of the projection of the slit on the array sensor. By moving the projection of this slit on the array sensor in the length direction of each unit element, two-dimensional resolution can be achieved.

Figure 4 shows a radiation image capturing device using the above-mentioned array sensor.
Show the entire example. In this example, the slit and array sensor are moved integrally to scan the object. X is a point X-ray source and B is the object. X across subject B
A vertically long slit S is arranged on the radiation source side, and an array sensor P is arranged on the rear side, and the slit S and the array sensor P are integrally driven in the direction of the arrow to scan the subject. If the subject is not a human being but an industrial product, there is no need to reduce the amount of unnecessary radiation exposure, so the slit and array sensor may be placed one on top of the other behind the subject.

(Effects of the Invention) With the arrangement described above, the array sensor of the present invention has an image resolution determined not only by the size of each unit element, but also the resolution in the direction perpendicular to the unit element arrangement direction of the array sensor is determined by the size of the unit element. Since it is determined by the width of the slit regardless of the length in that direction, high resolution can be easily achieved by 1η, and the length of each unit element in the direction perpendicular to its arrangement direction can be determined without regard to resolution. Therefore, the bonding electrodes can be freely arranged, and the resolution in the unit element arrangement direction can be easily increased. In addition, since the radiation incident area of the unit element is smaller, the amount of incident radiation per unit time is lower than before, and even with the same radiation intensity, it takes longer than before for the output of the signal processing circuit to saturate, so signal processing The effect of widening the dynamic range of the circuit can also be obtained.

[Brief explanation of drawings]

FIG. 1 is a partially enlarged plan view of one embodiment of the present invention, FIG. 2 is a partially enlarged plan view of another embodiment, and FIG. 3 is a partially enlarged plan view of still another embodiment. FIG. 4 is an overall perspective view of an apparatus using the array sensor of the present invention. la, lb, lc...unit element, 2...bonding electrode section, C...secondary unit, X...point X-ray source, S...slit, B...subject , P...Array sensor of the present invention.

Claims (1)

[Claims] An array sensor in which unit elements for detecting radiation are elongated and arranged in the short direction thereof, a slit whose longitudinal direction is the arrangement direction of the unit elements of the array sensor, and the array sensor and the slit. means for integrally moving the slit in the direction perpendicular to the length direction of the slit, or means for moving the projection of the slit onto the array sensor in the direction perpendicular to the length direction of the slit on the same array sensor. A radiation image capturing apparatus, characterized in that a slit width in projection of the slit onto the array sensor is approximately equal to a unit element arrangement pitch of the array sensor.