JPH03187792A - Ic card - Google Patents

Ic card

Info

Publication number
JPH03187792A
JPH03187792A JP1327222A JP32722289A JPH03187792A JP H03187792 A JPH03187792 A JP H03187792A JP 1327222 A JP1327222 A JP 1327222A JP 32722289 A JP32722289 A JP 32722289A JP H03187792 A JPH03187792 A JP H03187792A
Authority
JP
Japan
Prior art keywords
board
printed circuit
contact
circuit board
surface side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1327222A
Other languages
Japanese (ja)
Inventor
Koichiro Nakamura
中村 宏一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1327222A priority Critical patent/JPH03187792A/en
Publication of JPH03187792A publication Critical patent/JPH03187792A/en
Pending legal-status Critical Current

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  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE:To eliminate limitation of mounting position of an IC contact and to improve degree of freedom of design by providing electronic components on one side surface of a printed circuit board and an IC contact on the other side surface, and so bending the board at about 180 deg. from the midway as to dispose the contact on the outer surface side. CONSTITUTION:A both-side type printed circuit board 3 and a cell 7 are provided between sheath plates 1 and 1, and the board 3 is so bent at about 180 deg. from its midway as to dispose an IC contact 6 on the outer surface side. An integrated circuit element 4, a capacitor 5 and a liquid crystal display 12 are arranged on the inner surface side of the board 3, and a key input unit 8 is provided between the board 3 and the plate 1. Since the board 3 is bent at about 180 deg., the contact 6 can be, for example, provided at the reverse surface side of the unit 8 to improve the degree of freedoms of its design. The element 4 and the capacitor 5 are arranged between the opposed parts of the board 3, and protected against an external pressure by the board 3 to prevent a trouble.

Description

【発明の詳細な説明】 C発明の目的コ (産業上の利用分野) 本発明は、たとえば、クレジットカード、fDカードに
用いられるICカードに関する。
DETAILED DESCRIPTION OF THE INVENTION CObject of the Invention (Field of Industrial Application) The present invention relates to an IC card used for, for example, a credit card or an fD card.

(従来の技術) ICカードはその内部に両面型のプリント回路基板を備
え、このプリント回路基板の一面側に集積回路素子、コ
ンデンサーなどの電子部品を配設するとともに、他面側
にICコンタクトを取り付けたり、あるいは、片面型の
プリント回路基板の同一面に電子部品を配設するととも
に、接続部品を介してICコンタクトを取り付けたりし
ている。
(Prior art) An IC card has a double-sided printed circuit board inside, and electronic components such as integrated circuit elements and capacitors are arranged on one side of the printed circuit board, and IC contacts are placed on the other side. Alternatively, electronic components are disposed on the same side of a single-sided printed circuit board, and IC contacts are attached via connecting components.

(発明が解決しようとする課題) しかしながら、前者の場合には、ICコンタクトと電子
部品の表裏関係が設計上の制約になるとともに、後者の
場合にはICコンタクトの接続部品を必要とするため、
構造的に複雑化し、コスト高になるという問題があった
(Problem to be Solved by the Invention) However, in the former case, the front-back relationship between the IC contact and the electronic component becomes a design constraint, and in the latter case, connecting parts for the IC contact are required.
There were problems in that the structure was complicated and the cost was high.

そこで、本発明はICコンタクトと電子部品の表裏関係
に制約されることなく、自由に設計でき、また、構造的
にも簡略化し安価なICカードを提供することを目的と
する。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an IC card which can be freely designed without being restricted by the front-back relationship between IC contacts and electronic components, and which is structurally simple and inexpensive.

[発明の構成] (課題を解決するための手段) 上記課題を解決するため、第1の発明はプリント回路基
板の一面側に電子部品、他面側にICコンタクトを設け
、前記ICコンタクトが外面側に位置するように、前記
プリント回路基板をその中途部から略180’折曲させ
たことを特徴とし、また、第2の発明はプリント回路基
板の一面側に電子部品およびICコンタクトを設け、前
記ICコンタクトが外面側に位置するように、前記プリ
ント回路基板をその中途部から略180’折曲させたこ
とを特徴とするものである。
[Structure of the Invention] (Means for Solving the Problem) In order to solve the above problem, a first invention provides an electronic component on one side of a printed circuit board and an IC contact on the other side, and the IC contact is provided on the outer surface. The printed circuit board is bent approximately 180' from the middle so that the printed circuit board is located on the side, and the second invention is characterized in that electronic components and IC contacts are provided on one side of the printed circuit board, The printed circuit board is bent approximately 180' from the middle so that the IC contacts are located on the outer surface side.

(作用) 第1の発明の手段により、ICコンタクトを従来と逆面
側に位置して設けることを可能とし、また、第2の発明
の手段により、片面型のプリント回路基板であっても、
接続部品を用いることなくICコンタクトを取り付ける
ことができるようにした。
(Function) The means of the first invention makes it possible to provide an IC contact on the side opposite to the conventional one, and the means of the second invention makes it possible to provide an IC contact on the side opposite to the conventional one, and with the means of the second invention, even if the IC contact is a single-sided printed circuit board,
It is now possible to attach IC contacts without using any connecting parts.

(実施例) 以下、本発明を図面に示す実施例を参照して説明する。(Example) The present invention will be described below with reference to embodiments shown in the drawings.

第1図は第1の発明であるICカードKを示すもので、
図中1,1はスペーサ2を介して離間対向する外装板で
ある。
Figure 1 shows the first invention, the IC card K.
In the figure, numerals 1 and 1 are exterior plates facing each other with a spacer 2 in between.

上記外装板1.1間には両面型のプリント回路基板3お
よび電池7が設けられている。
A double-sided printed circuit board 3 and a battery 7 are provided between the exterior plates 1.1.

上記プリント回路基板3は後述するICコンタクト6が
外面側に位置するように、その中途部から略180’折
曲されている。
The printed circuit board 3 is bent approximately 180' from the middle so that an IC contact 6, which will be described later, is located on the outer surface side.

このプリント回路基板3の内面側には電子部品としての
集積回路素子(LSI)4、コンデンサ5および液晶表
示部(LCD)12が配設されている。
On the inner surface of this printed circuit board 3, an integrated circuit element (LSI) 4 as electronic components, a capacitor 5, and a liquid crystal display (LCD) 12 are arranged.

上記集積回路素子4およびコンデンサー5はプリント回
路基板3の対向部間に設けられている。
The integrated circuit element 4 and the capacitor 5 are provided between opposing parts of the printed circuit board 3.

上記集積回路素子4はワイヤーボンディング10を介し
て上記プリント回路基板3に電気的に接続され、エポキ
シ樹脂11によりモールドされている。
The integrated circuit element 4 is electrically connected to the printed circuit board 3 via wire bonding 10 and is molded with epoxy resin 11.

また、上記プリント回路基板3の外面側にはICコンタ
クト6が設けられ、このICコンタクト6の取付部6a
は上記外装板1と面一になるように、突出成形されてい
るとともに、その外周囲部は上記外装板1の内面に対向
されて重合されている。
Further, an IC contact 6 is provided on the outer surface side of the printed circuit board 3, and a mounting portion 6a of this IC contact 6 is provided.
is formed in a protruding manner so as to be flush with the exterior plate 1, and its outer periphery is opposed to and overlapped with the inner surface of the exterior plate 1.

また、上記プリント回路基板3と外装板1との間にはキ
ー人力部8が設けられている。
Further, a key manpower section 8 is provided between the printed circuit board 3 and the exterior board 1.

なお、9,9は上記プリント基板3の対向する位置に設
けられた位置決め孔である。
Note that reference numerals 9 and 9 are positioning holes provided at opposing positions on the printed circuit board 3.

しかして、上記ICカードには図示しないレーザプリン
タのICツカード挿入口に挿入され、そのICコンタク
6を介してレーザプリンタとの間で情報が授受され、画
像処理が行われる。
Then, the IC card is inserted into an IC card insertion slot of a laser printer (not shown), and information is exchanged with the laser printer via the IC contact 6, and image processing is performed.

上述したように、プリント回路基板3を略180’折曲
するため、ICコンタクト6をたとえばキー人力部8の
逆面側に設けることができ、設計の自由度を向上するこ
とができる。
As described above, since the printed circuit board 3 is bent approximately 180', the IC contact 6 can be provided, for example, on the opposite side of the key input section 8, and the degree of freedom in design can be improved.

また、集積回路素子(LSI>4およびコンデンサ5は
折曲されたプリント回路基板3の対向部間に配設される
ため、集積回路素子(LSI)4およびコンデンサ5は
プリント回路基板3により、外圧から保護され、故障の
発生を防止することができる。
Furthermore, since the integrated circuit element (LSI>4 and the capacitor 5 are arranged between the opposing parts of the bent printed circuit board 3), the integrated circuit element (LSI) 4 and the capacitor 5 are protected against external pressure by the printed circuit board 3. It is possible to prevent the occurrence of failures.

また、プリント回路基板3のICコンタクト6の取付部
6aを外装板1と面一になるように、突出成形するため
、外装板1とICコンタクト6との間の段差が減少し、
内部部品の収納容積を増大できる。
Furthermore, since the mounting portion 6a of the IC contact 6 of the printed circuit board 3 is formed in a protruding manner so as to be flush with the exterior plate 1, the level difference between the exterior plate 1 and the IC contact 6 is reduced.
The storage capacity for internal parts can be increased.

さらに、上記外装板1とプリント回路基板3をICコン
タクト6の周囲部で重ね合わせるため、機密性も向上で
きる。
Furthermore, since the exterior plate 1 and the printed circuit board 3 are overlapped around the IC contacts 6, airtightness can also be improved.

また、プリント回路基板3に位置決め孔9.9を形成す
るため、製造効率を向上することができる。
Furthermore, since the positioning holes 9.9 are formed in the printed circuit board 3, manufacturing efficiency can be improved.

なお、プリント回路基板3はその全幅に亘って折曲する
必要はなく、第2図に示すように、その一部を折曲して
、この折曲部3 a E I Cコンタクト6を設けて
も良い。
Note that the printed circuit board 3 does not need to be bent over its entire width, but as shown in FIG. Also good.

また、上記折曲部3aの基部の幅を狭くしたり、基板基
材を除去したり、配線パターンのみのフライブリードと
したり、カバーフィルムを除去するなどして剛性を低下
させて折曲し易くすることにより、製造性を向上させる
ようにしてもよい。
In addition, by narrowing the width of the base of the bending part 3a, removing the substrate base material, creating a fly lead with only a wiring pattern, or removing the cover film, the rigidity can be reduced to make it easier to bend. Manufacturability may be improved by doing so.

さらに、基板は一枚でなくても、2枚以上を接続し、そ
のどこかで折り曲げてもよい 一方、第3図は第2の発明のICカードを示すものであ
る。
Furthermore, the number of boards does not have to be one, but two or more boards may be connected and bent at some point. FIG. 3 shows an IC card of the second invention.

図中21.21はスペーサ22を介して離間対向する外
装板である。
In the figure, reference numerals 21 and 21 are exterior plates facing each other with a spacer 22 in between.

上記外装板21.21間にはプ・リント回路基板23が
設けられている。
A printed circuit board 23 is provided between the exterior plates 21 and 21.

このプリント回路基板23には電子部品としての集積回
路素子(LSI)24、電池25およびICコンタクト
26が配設されている。
This printed circuit board 23 is provided with an integrated circuit element (LSI) 24 as electronic components, a battery 25, and an IC contact 26.

上記集積回路素子24はワイヤーボンディング27を介
して上記プリント回路基板23に電気的に接続され、エ
ポキシ樹脂28によりモールドされている。
The integrated circuit element 24 is electrically connected to the printed circuit board 23 via wire bonding 27 and molded with epoxy resin 28.

上記プリント回路基板23はその中途部から略180°
折曲され、上記ICコンタクト26は外面側に位置され
ている。
The printed circuit board 23 is approximately 180 degrees from its midway point.
It is bent, and the IC contact 26 is located on the outer surface side.

この第2の発明によれば、プリント回路基板23は片面
型aのものであっても、コンタクト接続部品を用いるこ
となくICコンタクト26を取り付けることができ、構
造的に簡略化でき、コストを低減することができる。
According to this second invention, even if the printed circuit board 23 is a single-sided type a, the IC contacts 26 can be attached without using contact connection parts, the structure can be simplified, and the cost can be reduced. can do.

[発明の効果] 以上説明したように、第1の発明によれば、ICコンタ
クトの取付位置が限定されず、設計の自由度を向上する
ことができる。
[Effects of the Invention] As explained above, according to the first invention, the mounting position of the IC contact is not limited, and the degree of freedom in design can be improved.

また、第2の発明によれば、片面型のプリント回路基板
でも接続部品を用いることなく、ICコンタクトを取り
付けることができ、コストを低減することができる。
Furthermore, according to the second aspect of the invention, IC contacts can be attached even to a single-sided printed circuit board without using connection parts, and costs can be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は第1の発明の一実施例であるICカードを示す
構成図、第2図は他の実施例を示す斜視図、第3図は第
2の発明の一実施例であるICカードを示す構成図であ
る。 3.23・・・プリント回路基板、4・・・集積回路素
子(電子部品)、5・・・コンデンサ(電子部品)、6
・・・ICコンタクト。 第1図
Fig. 1 is a configuration diagram showing an IC card which is an embodiment of the first invention, Fig. 2 is a perspective view showing another embodiment, and Fig. 3 is an IC card which is an embodiment of the second invention. FIG. 3.23... Printed circuit board, 4... Integrated circuit element (electronic component), 5... Capacitor (electronic component), 6
...IC contact. Figure 1

Claims (2)

【特許請求の範囲】[Claims] (1)プリント回路基板の一面側に電子部品、他面側に
ICコンタクトを設け、前記ICコンタクトが外面側に
位置するように、前記プリント回路基板をその中途部か
ら略180゜折曲させたことを特徴とするICカード。
(1) An electronic component was provided on one side of the printed circuit board, and an IC contact was provided on the other side, and the printed circuit board was bent approximately 180 degrees from the middle of the board so that the IC contact was located on the outer side. An IC card that is characterized by
(2)プリント回路基板の一面側に電子部品およびIC
コンタクトを設け、前記ICコンタクトが外面側に位置
するように、前記プリント回路基板をその中途部から略
180゜折曲させたことを特徴とするICカード。
(2) Electronic components and ICs are placed on one side of the printed circuit board.
An IC card characterized in that the printed circuit board is provided with contacts and is bent approximately 180 degrees from the middle of the printed circuit board so that the IC contacts are located on the outer surface side.
JP1327222A 1989-12-19 1989-12-19 Ic card Pending JPH03187792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1327222A JPH03187792A (en) 1989-12-19 1989-12-19 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1327222A JPH03187792A (en) 1989-12-19 1989-12-19 Ic card

Publications (1)

Publication Number Publication Date
JPH03187792A true JPH03187792A (en) 1991-08-15

Family

ID=18196680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1327222A Pending JPH03187792A (en) 1989-12-19 1989-12-19 Ic card

Country Status (1)

Country Link
JP (1) JPH03187792A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998006060A3 (en) * 1996-08-01 2002-10-10 Siemens Aktiengesellschaft Chip card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998006060A3 (en) * 1996-08-01 2002-10-10 Siemens Aktiengesellschaft Chip card

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