JPH03190247A - Die bonding device - Google Patents

Abstract

PURPOSE:To adjust the attitude of a collet simply in a short time by installing a collet holder and a bonding arm, mounting a projected and arranged sphere on the collet holder and supporting the sphere in a rotatable and fixable manner by the bonding arm. CONSTITUTION:A semiconductor chip 2 is chucked to a collet 1 set up to a collet holder 12, and a sphere 21 is brought to a rotatable state and the underside of the semiconductor chip 2 is brought into contact with the top face of a die stage 4. Both surfaces of the collet holder 12 are brought into surface- contact and the gamma directions are conformed by hands as required, and the sphere 21 is fixed, thus completing the adjustment of the attitude of the collet 1. Accordingly, the attitude of the collet 1 can be adjusted simply in a short time.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a die bonding device that uses a collet that chucks a semiconductor chip to bond the semiconductor chip to a die stage of a lead frame or a package. and a bonding arm for supporting the collet holder and moving the collet, the collet holder having a protruding spherical body, The bonding arm is configured to rotatably and fixably support the spherical body, and allows the spherical body to rotate and adjust the posture of the collet by rotating the collet holder and swinging in an arbitrary direction. , the bonding is performed with the spherical body fixed.

[Industrial application field]

The present invention relates to a bonding apparatus for bonding a semiconductor chip to a lead frame or a die stage of a package using a collet that chucks the semiconductor chip, and particularly relates to a collet attitude adjustment mechanism.

The above-mentioned Gui bonding apparatus is used for assembling semiconductor devices, and it is necessary to replace the collet each time the size of the semiconductor chip to be bonded changes, and to adjust the posture of the collet each time.

As the number of types of semiconductor devices manufactured increases, the frequency of collet replacement increases, so it is desired to be able to easily adjust the posture of the collet in a short time.

[Conventional technology]

FIG. 2 is a perspective view of the main parts of a conventional die bonding apparatus, mainly showing the collet attitude adjustment mechanism.

In FIG. 2, the lateral direction, front-back direction, vertical direction, and rotation direction around the vertical direction are respectively referred to as the X direction, the X direction, the Z direction, and the θ direction, and in this conventional example, the collet holder 5
2 is supported at the tip of a bonding arm 51 that is movable in the x, y, and z directions via a mechanism that adjusts its posture, and chucks the semiconductor chip 2 to be bonded (with a collet suitable for its size). 1 is attached to the collet holder 52 with the chuck surface facing downward, and the semiconductor chip 2 chucked by the collet L is
Bonding is performed to a die stage 4 of a lead frame 3 (or package) arranged horizontally below it. Note that the chuck mechanism of the collet 1 is a vacuum chuck, and 53 in the figure is a vacuum piping for this purpose.

In this bonding, it is necessary to align the semiconductor chip 2 with respect to the die stage 4 in the X, Y, and θ directions, but at the same time, in order to prevent the semiconductor chip 2 from being damaged, the semiconductor chip The lower surface of the die stage 2 and the upper surface of the die stage 4 must be parallel to each other within several μm (necessary).
Alignment in the direction is performed by controlling the movement of the bonding arm 51, but the above-mentioned parallel and θ-direction alignment depends on the attitude adjustment of the collet 1, that is, the attitude adjustment of the collet holder 52.

The posture adjustment mechanism in the conventional example is as follows.

That is, the bonding arm 51 protrudes toward the front in the X direction.
an auxiliary arm 61 supported by a shaft 62 in the X direction at the tip thereof and rotatable in the X direction; a vertical shaft 71 supported perpendicularly to the auxiliary arm 61 and rotatable in the θ direction; It has a holder support 81 which is fixed to the lower end and supports the collet holder 52 rotatably in the X direction by a shaft 82 in the X direction.

The auxiliary arm 61 has a protruding piece 63 extending above the bonding arm 51, and adjusts a pair of screws 64 that are screwed together in the X direction to the upper protruding part of the bonding arm 51 and sandwich the protruding piece 63. As a result, a rotating position inclined in the X direction is set, and the vertical shaft 71 has a protruding piece 73 that protrudes in the X direction, and is screwed into the protruding part of the auxiliary arm 61 in the X direction to sandwich the protruding piece 73. By adjusting the pair of screws 74, the rotational position in the θ direction is set, and the collet holder 52 is screwed into the holder support 81 in the Pair of screws 8 that sandwich the position
By adjusting No. 4, the rotational position tilted in the X direction is set.

Thereby, the collet holder 52 can appropriately adjust the inclination in the X direction, the inclination in the X direction, and the rotation in the θ direction, making it possible to adjust the attitude of the collet l as desired. After the posture adjustment is completed, tighten the screws 64, 74, 84 and the lock nuts 65, 75, respectively.
85 to prevent the adjustment point from shifting.

[Problem to be solved by the invention]

However, in the above-mentioned attitude adjustment mechanism, for example, when adjusting the inclination in the The work is to drive the collet 1 to the adjustment point while taking into consideration the rotation of the collet 1, and the same goes for tilting in the Y direction and rotating in the θ direction. Therefore, adjusting the posture of the collet 1 is extremely complicated and requires a large amount of time, such as several hours. There is.

As the number of types of semiconductor devices manufactured increased, collet l
If the replacement frequency is too high, it becomes a problem that reduces the operating rate of the bonding device.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a bonding device that can easily adjust the posture of a collet in a short time.

[Means to solve the problem]

The above object is an apparatus for bonding a semiconductor chip to a lead frame or a die stage of a package using a collet that chucks the semiconductor chip,
The collet holder includes a collet holder for attaching the collet, and a bonding arm for supporting the collet holder and moving the collet, the collet holder having a protruding spherical body, and the bonding arm rotating the spherical body. - The spherical body is configured to be fixedly supported, the spherical body is rotatable, and the posture of the collet is adjusted by rotation of the collet holder and swinging in an arbitrary direction, and the spherical body is fixed and the bonding is performed. This is achieved by the Gui bonding device of the present invention.

[For production]

In this Gui bonding device, a semiconductor chip is chucked by a collet attached to a collet holder, the spherical body is made rotatable, the bottom surface of the semiconductor chip is brought into contact with the top surface of the die stage, and if necessary, the semiconductor chip is chucked by a collet attached to a collet holder. By placing a hand on the collet, the two surfaces are brought into surface contact and the θ directions are matched, and then the spherical body is fixed, thereby completing the alignment of the collet.

As a result, the posture of the collet can be easily adjusted in a very short time.

〔Example〕

Embodiments of the Gui bonding apparatus according to the present invention will be described below with reference to the perspective view of FIG. 1, which corresponds to FIG. 2 above. Similar to FIG. 2, FIG. 1 mainly shows the collet attitude adjustment mechanism.

In FIG. 1, 11 is a bonding arm corresponding to the above 51, and 12 is a collet holder corresponding to the above 52. In this embodiment, as in the conventional example, the collet holder 12 has a posture adjustment mechanism for it. via x,
The collet l is supported by the tip of a bonding arm 11 that is movable in the y and z directions, and the collet l is attached to the collet holder 12 with the chuck surface facing downward, and the semiconductor chip 2 chucked by the collet l is held there. Bonding is performed to a die stage 4 of a lead frame 3 (or package) arranged horizontally below.

Note that the chuck mechanism of the collet I is a vacuum chuck, and 13 in the figure is a vacuum piping for this purpose.

Therefore, parallel alignment and θ direction alignment of the lower surface of the semiconductor chip 2 with respect to the upper surface of the die stage 4 necessary for bonding depend on the attitude adjustment of the collet 1, that is, the attitude adjustment of the collet holder 12, as in the conventional example.

The posture adjustment mechanism in the embodiment utilizes a so-called ball link mechanism, and is as follows.

That is, the collet holder 12 has a spherical body (ball) 21 arranged to protrude upward, and the spherical body 21 is inserted into the inside of the bonding arm 11 from below the tip thereof. It has inside a clamper 22 on the tip side and a clamp cylinder 23 on the base side that support the body 21 so as to be rotatable and fixed, so that the collet holder 12 can be rotated in the θ direction and centered around the spherical body 22. It is supported so that it can swing in any XY direction, or it is fixedly supported so that rotation and swinging are prevented.

The clamp cylinder 23 is supplied with pressurized oil or air from a pressure pipe 25 with a valve 24 interposed therebetween, and when the valve 24 is opened, the spherical body 21 is moved to the clamper 22.
When the valve 24 is closed, the pressure is released to make the spherical body 21 rotatable.

If the above-mentioned swing is in the X direction, the collet holder 12
If it is the Y direction, the Y direction inclination is similarly changed.

Therefore, if the valve 24 is closed, the collet holder 12 can adjust the inclination in the X direction, the inclination in the Y direction, and the rotation in the θ direction as appropriate, and the posture of the collet 1 can be adjusted as desired. is possible. When the attitude adjustment is completed, the adjustment point is fixed by opening the valve 24.

The above adjustment is performed, for example, as follows. That is, the semiconductor chip 2 is chucked by the collet 1 attached to the collet holder 12, the valve 24 is closed, and the lower surface of the semiconductor chip 2 is brought into contact with the upper surface of the die stage 4.
The collet I can be placed in the desired posture simply by placing a hand on the collet holder so that both surfaces are in surface contact and the θ directions are aligned.

Then, by opening the valve 24, the alignment of the collet is completed.

In this way, the posture adjustment of the collet 1 can be easily performed in just a few minutes. The valve 24 is kept open during the bonding period.

〔Effect of the invention〕

As explained above, according to the configuration of the present invention, the posture of the collet can be adjusted in a short time with respect to a bonding device that uses a collet that chucks a semiconductor chip to bond the semiconductor chip to a die stage of a lead frame or a package. This can be done easily, and even if the number of types of semiconductor devices to be manufactured increases and the frequency of collet replacement increases, there is an effect of making it possible to suppress a decrease in the operating rate to a small extent.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the main parts of the embodiment. Figure 2 is a perspective view of the main parts of the conventional example. It is. In the figure, l is colette, 2 is a semiconductor chip, 3 is the lead frame, 4 is the die stage, 11, 51 are bonding arms, 1252 is collet holder 21 is a spherical body, 22 is a clamper, 23 is a clamp cylinder; 24 is a valve, 25 is pressure piping; It is. 3: Lead frame 11:Holding arm 13;X empty piping 4:9゛Istage 12: Collet holder 21-Spheroid Perspective view of main parts of actual example Figure 1

Claims (1)

[Claims] An apparatus for bonding a semiconductor chip to a lead frame or a die stage of a package using a collet that chucks the semiconductor chip, comprising: a collet holder for attaching the collet; and a collet holder for supporting the collet holder. a bonding arm for moving the collet, the collet holder having a protruding spherical body;
The bonding arm is configured to rotatably and fixably support the spherical body, and allows the spherical body to rotate and adjust the posture of the collet by rotating the collet holder and swinging in an arbitrary direction. . A die bonding apparatus, characterized in that the bonding is performed while the spherical body is fixed.