JPH03192360A - Photosensitive resin composition - Google Patents

Abstract

PURPOSE:To provide the heat resistant photosensitive polyimide resin compsn. which allow spray development and has high sensitivity by using a biscumarine compd. as a sensitizer in combination with a glycine compd. as a polymn. initiator. CONSTITUTION:This compsn. is the photosensitive resin compsn. which consists of the polymer (A) essentially consisting of the constitutional unit expressed by general formula [I], (B) the biscumarine compd. subjected to carbonyl substitution in the third position expressed by general formula [II] and the glycine compd. (C) expressed by general formula [III] as its essential components. The amt. of the biscumarine compd. to be compounded is >= 1 pt. wt., most preferably <= 10 pts. wt. per 100 pts. wt. polyamic acid. The sensitizers in addition to the biscumarine compd. may be used in combination therewith. The amt. of the glycine compd. to be compounded is essentially 1 to 20 pts. wt. per 100 pts. wt. polyamic acid and the initiators in addition to the glycine compds. may be used as well in combination therewith.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a photosensitive polyimide resin composition with high sensitivity and high heat resistance.

[Conventional technology] Conventionally, surface protection films and interlayer insulating films of semiconductor elements, etc.
Polyimide resin is used because it has excellent heat resistance and outstanding electrical and mechanical properties. However, in recent years, semiconductor devices have become more highly integrated and larger, sealing resin packages have become thinner and smaller, and solder With the shift to surface mounting methods using reflow, there is a demand for significant improvements in heat cycle resistance, heat shock resistance, etc., and conventional polyimide resins have
It has become difficult to respond.

On the other hand, technology for imparting photosensitivity to polyimide resin itself has recently attracted attention.

The use of polyimide resins with these photosensitizers not only simplifies the pattern creation process compared to polyimide resins without the photosensitizers, but also eliminates the need to use highly toxic etching solutions. It is also superior in terms of safety and pollution, and photosensitization of polyimide resin is expected to become an important technology in the future.

As the photosensitive polyimide resin, for example, a polyimide precursor composition to which a photosensitive group is added with an ester group having a structure as shown in the following formula () (Japanese Patent Publication No. 55-41422) or a polyimide precursor composition as shown in the following formula (V) A polyamic acid with a structure such that 2'! Compositions containing compounds containing monomerizable or polymerizable carbon-carbon double bonds and amino groups, or quaternized salts thereof (for example, Japanese Patent Publication No. 59-52822) are known.

All of these are dissolved in a suitable organic solvent, applied in a face state, dried, exposed to ultraviolet light through a photomask, developed and rinsed to obtain the desired pattern, and then heat-treated to form polyimide. It is a coating.

However, such conventional compositions have the following drawbacks. That is, the composition shown by the formula (IV) is manufactured through an extremely complicated process of first causing an esterification reaction between a tetracarboxylic dianhydride and an alcohol having a photosensitive group, and then performing an amidation reaction with a diamine. Therefore, it was difficult to stabilize the product. In the composition shown by formula (V), the manufacturing process is extremely simple because it is only necessary to add and mix the photosensitizer to the polyamic acid, but since the ionic bonding force between the polyamic acid and the photosensitizer is extremely weak, ( I
V) Spray development (a method of rapidly developing in a short period of time by spraying a developing solution) which is possible with the composition shown in formula V) was not possible.

[Problems to be Solved by the Invention] An object of the present invention is to provide a heat-resistant photosensitive polyimide resin composition that has a simple manufacturing process, has no product variation, is spray developable, and is highly sensitive. There is something to do.

[Means to solve the problem] The present invention is based on the following general formula [I] (In the formula, R5, .RenyH, alkoxy group.

A biscoumarin compound (B) substituted with carbonyl at the 3-position represented by dialkylamino group) and the following general formula (1) (in which R1, R2:
Aromatic cyclic group.

R3: -H, -CH3, -C2H5 R4: -H, -CH3, -C2H5゜-CH20H,
-CeHs n: 1-2. m:0-2) A polymer (A) whose main component is a structural unit represented by
The following general formula (ii) (in the formula R7: -H, -CH3, -C2H5, -CeH
6°-0CH3,-0COCH3,-0CzHa.

-0COCaH+s, -N(CH3)2゜-N(C2H
5)2. -NHCOOCH3゜-COCR3, -COC
2Hs.

-NHC0NH2, -CH20H, -OH.

-CH(CH3)2. The glycine compound (C) represented by -C(CH3):I) is an essential component, and 1 part (B) per 100 parts by weight of (A).
This is a photosensitive resin composition comprising ~10 parts by weight and 1 to 20 parts by weight of (C).

[Function] The polymer (A) used in the present invention is synthesized, for example, by the following method.

That is, the following formula (VI) (when n=1) (when n=2)...
(Vl) and the following formula [■] (COOH).

An amine represented by H2N-R2-NH2 and an N-methylolacrylamide represented by the following formula [■] [■] 0HzC \ N-CO-C= CH2 / I R4R3 [■], (V
It is synthesized by reacting l) and [■], then adding [■] and further reacting. The reaction between (Vl) and [■] is usually completed in several hours at room temperature, and the reaction with [■] is completed in half an hour to several hours at 50 to 100°C. The reaction will complete more quickly if a catalyst is used, but it will proceed satisfactorily even without a catalyst. In this way, the reaction can be completed extremely easily and consistently.

In general formula (VI), as the acid having an aromatic cyclic group in RX, tricarboxylic acid anhydride with n=1 or tetracarboxylic dianhydride with n=2 are used, and the number of acid anhydride components is one type. However, a mixture of two or more types may be used.

The types of acid anhydrides used include, for example, trimellitic anhydride, pyromellitic dianhydride, benzene-1
, 2,3,4-tetracarboxylic dianhydride, 3.3'
, 4.4'-benzophenone tetracarboxylic dianhydride, 2.2', 3.3'-benzophenone tetracarboxylic dianhydride, 2,3.3'.

4'-benzophenone tetracarboxylic dianhydride, naphthalene-2,3,8,7-tetracarboxylic dianhydride,
Naphthalene-1,2,5,6-tetracarboxylic dianhydride, Naphthalene-1,2,4,5-tetracarboxylic dianhydride, Naphthalene-1,4,5,8-tetracarboxylic dianhydride , naphthalene-1,2,6,7-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5,
6,7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,
3,5,6,7-hexahydronaphthalene-2,3,6
, 7-tetracarboxylic dianhydride, 2,6-cyclonaphthalene-1.4,5.8-tetracarboxylic dianhydride, 2,7-cyclonaphthalene-1.4,5.8-tetra Carboxylic dianhydride, 2,3,6.7-titrachloronaphthalene-1.4,5.8-tetracarboxylic dianhydride,! , 4.5゜8-tetrachloronaphthalene-2
, 3,6,7-tetracarboxylic dianhydride, 3.3'
, 4.4'-diphenyltetracarboxylic dianhydride, 2
．． 2', 3.3'-diphenyltetracarboxylic dianhydride, 2,3.3', 4'-diphenyltetracarboxylic dianhydride, 3.3", 4.4"-p-terphenyltetracarboxylic dianhydride Acid dianhydride, 2.2", 3.3"-p-
Terphenyltetracarboxylic dianhydride, 2,3°3”
, 4”-p-terphenyltetracarboxylic dianhydride,
2,2-bis(2,3-dicarboxyphenyl)-propanidanhydride, 2,2-bis(3,4-dicarboxyphenyl)-propanidanhydride, bis(2,3-dicarboxyphenyl)ether dianhydride bis(3,4-dicarboxyphenyl) i-ternianhydride, bis(2,3-
dicarboxyphenyl)methanihydride, bis(3,4
-dicarboxyphenyl)methane dianhydride, bis(2,
3-dicarboxyphenyl)sulfone dianhydride, bis(
3,4-dicarboxyphenyl)sulfone dianhydride, 1
．． 1-bis(2,3-dicarboxyphenyl)ethane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, perylene-2,3,8,9-tetracarboxylic dianhydride , perylene-3,4,9,10-tetracarboxylic dianhydride, perylene-4,5,10,1
1-tetracarboxylic dianhydride, perylene-5,6,1
1,12-tetracarboxylic dianhydride, phenanthrene-1,2,7,8-tetracarboxylic dianhydride, phenanthrene-1,2,6,7-tetracarboxylic dianhydride, phenanthrene-1,2゜9.10-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrazine-2゜3.5.6-tetracarboxylic dianhydride, pyrrolidine-2゜3.4.5-
Tetracarboxylic dianhydride, thiophene-2゜3.4.
Examples include, but are not limited to, 5-tetracarboxylic dianhydride.

- In formula [■], as the amine having an aromatic cyclic group for R2, diamine with m=00, diaminocarboxylic acid with m=1, diaminodicarboxylic acid with m=2, etc. are used, and even if the amine component is one type, , a mixture of two or more types may be used. Examples of the type of amine used include I
-phenylene-diamine, 1-isopropyl-2,4-
Phenylene diamine, p-phenylene diamine, 4
, 4'-diamino-diphenylpropane, 3.3'-diamino-diphenylpropane, 4.4'-diamino-diphenylethane, 3.3'-diamino-diphenylethane, 4.4'-diamino-diphenylmethane, 3. 3'
-diamino-diphenylmethane, 4,4'-diamino-
diphenyl sulfide, 3.3'-diamino-diphenyl sulfide, 4.4'-diamino-diphenyl sulfone, 3.3'-diamino-diphenyl sulfone, 4.4
'-Diamino-diphenyl ether, 3,3'-diamino-diphenyl ether, benzidine, 3,3'-diamino-biphenyl, 3,3'-dimethyl-4,4'-diamino-biphenyl, 3,3'-dimethoxy-benzidine , 4.4"-diamino-p-terphenyl, 3.3"
Diamino-p-terphenyl, bis(p-amino-cyclohexyl)methane, bis(p-β-amino-t-butylphenyl)ether, bis(p-β-methyl-δ-aminopentyl)benzene, p-bis (2-methyl-4-
Amino-pentyl)benzene, p-bis(1,1-dimethyl-5-amino-pentyl)benzene, 1,5-diamino-naphthalene, 2,6-dichloronaphthalene, 2,
4-bis(β-amino-t-butyl)toluene, 2,4
-diamino-toluene, -xylene-2,5-diamine, p-xylene-2゜5-diamine, 1-xylylene-
Diamine, p-xylylene-diamine, 2,6-diamitubiridine, 2,5-diamino-pyridine, 2,5-
Diamino-1,3,4-oxadiazole, 1,4-diamino-cyclohexane, piperazine, methylene-diamine, ethylene-diamine, propylene-diamine, 2
, 2-dimethyl-propylene-diamine, tetramethylene-diamine, pentamethylene-diamine, hexamethylene-diamine, 2゜5-dimethyl-hexamethylene-
diamine, 3-methoxy-hexamethylene-diamine,
Heptamethylene-diamine, 2,5-dimethyl-hebutamethylene-diamine, 3-methyl-hebutamethylene-diamine, 4,4-dimethyl-hebutamethylene-diamine, octamethylene-diamine, nonamethylene-diamine, 5-methylene/l , -nonamethylene-diamine, 2.5-
Dimethyl-nonamethylene-diamine, decamethylene-diamine, i,io-diamino-1,10-dimethyl-decane, 2.11-diamino-dodecane, 1,12-diamino-octadecane, 2.12-diamino-octadecane, 2. Examples include, but are not limited to, 17-diaminosiloxane, diaminosiloxane, 2,6-diamino-4-carboxylic benzene, and 3,3'-diamino-4,4'-dicarboxylic benzidine.

-N-methylolacrylamides represented by the formula [■] include N-methylolacrylamide, N-methylolmethacrylamide, N,N-dimethylolacrylamide, N,N-dimethylolmethacrylamide, N-methylolmethacrylamide,
-Methylol-N-methylacrylamide, N-methylol-N-methylmethacrylamide, N-methylol-
Examples include, but are not limited to, N-ethylacrylamide and N-methylol-N-ethylmethacrylamide.

The sensitizer as component (B) in the present invention has the following formula (where Rs
, Re-He alkoxy group.

It is a biscoumarin compound substituted with carbonyl at the 3-position represented by a dialkylamino group.

As this biscoumarin compound, for example, 3.3'-
Carbonyl-bis(7-ethylaminocoumarin), 3
．． Examples include, but are not limited to, 3'-carbonyl-bis(5,7-simethoxycarbonylcoumarin).

Sensitizers used in the photosensitive resin composition include benzophenone, acetophenone, anthrone, p,p'-tetramethyldiaminobenzophenone (Michler ketone),
Phenanthrene, 2-nitrofluorene, 5-nitroacenaphthene, benzoquinone, N-acetyl-p-nitroaniline, p-nitroaniline, 2-ethylanthraquinone, 2-tert-butylanthraquinone, N-acetyl-4-nitro-1 -Naphthylamine, biclamide, 1,2-benzanthraquinone, 3-methyl-1,3
-Diaza-1,9-benzanthrone, p,p'-tetraethyldiaminobenzophenone, 2-chloro-4-nitroaniline, dibenzalacetone, 1,2-naphthoquinone, 2,5-bis-(4'-diethylamino benzal)-cyclopentane, 2.6-bis-(4'-diethylaminobenzal)-cyclohexanone, 2.6-bis-
(4'-dimethylaminobenzal)-4-methyl-cyclohexanone, 2,6-bis-(4'-diethylaminobenzal)-4-methyl-cyclohexanone, 4.4'
-bis-(dimethylamino)-chalcone, 4.4'-bis-(diethylamino)-chalcone, p-dimethylaminobenzylideneindanone, 1.3-bis-(4'-dimethylaminobenzal)-acetone, 1 .3-bis-(
Examples include 4'-diethylaminobenzal)-acetone, N-pheny)L-jetanolamine, N-p-tolyl-diethylamine, etc., but the biscoumarin compound discovered in the present invention can be used as an initiator in the present invention. It shows a surprisingly excellent sensitizing effect only when used in combination with the glycine compound used. The reason for this surprising synergistic effect is not yet clear.

The amount of biscoumarin compound is 1 to 1 polyamic acid.
It is most preferably 1 part by weight or more and 10 parts by weight or less per 00 parts by weight, and sensitizers other than biscoumarin compounds may also be used in combination.

When the amount of the biscoumarin compound is less than 1 part by weight,
If it exceeds 10 parts by weight, the amount of light energy transmitted will be insufficient and photocuring in deep areas will not progress rapidly, which is not preferable.

The initiator of component (C) used in the present invention has the following formula (III) (wherein R7: -H, -CH3, -C2H6, -C@H
6°-OCH3, -OCOCH3, -OCzHs.

-OCOCzH5,-N (CH3)2. -N (C2
H5) 2゜-NHCOOCHs, -COCHs, -CO
C2Hs.

-NHCONH2, -CHaOH, -OH.

-CH(CH3)2. It is a glycine compound with a phenyl group represented by -C(CH3)3).

As an initiator used in the photosensitive resin composition, 2.2-
Dimethoxy-2-phenyl-acetophenone, i-hydroxy-cyclohexyl-phenylketone, 2-methyl-(4-(methylthio)phenyl 1-2-morpholino-1-propane, 3.3', 4.4'- Tetra (t
-butylperoxycarbonyl)benzophenone, benzyl, benzoin-isopropyl ether, benzoin-isobutyl ether, 4,4'-dimethoxybenzyl, 1,4-dibenzoylbenzene, 4-benzoylbiphenyl, 2-benzoylnaphthalene, methyl-Q- Benzoylbenzoate, 2,2'-bis(0-chlorophenyl)-4,4', 5,5'-tetraphenyl-1,
2'-biimidazole, lO-butyl-2-chloroacridone, ethyl/1-4-dimethylaminobenzoate,
Dibenzoylmethane, 2,4-diethylthioxanthone, 3,3-dimethyl-4-methoxy-benzophenone,
2-Hydroxy-2-methyl-1-phenylpropane-
1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-
dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)oxime, 1-phenyl-propanebutanedione-2-(0- benzoyl)
Oxime, 1,2-diphenyl-ethanedione-1-(
O-benzoyl)oxime, 1,3-diphenynotoprobantrione-2-(o-benzoyl)oxime, l-
Phenyl-3-ethoxy-propanetrione-2-(o
-bezoyl) oxime, etc., but the glycine compound discovered in the present invention exhibits a remarkable photoreaction initiation effect compared to other initiators when combined with a biscoumarin compound as a sensitizer. Ta.

The reason for how this surprising effect is expressed is currently not clear.

The amount of glycine compound is polyamic acid 10
It is essential to use 1 to 20 parts by weight relative to 0 parts by weight, and initiators other than glycine compounds may also be used in combination.

If the amount of glycine compound as an initiator is less than 1 part by weight, the photosensitivity will be insufficient, which is not preferable.

Moreover, if it exceeds 20 parts by weight, the film properties after heat treatment and curing will deteriorate.

An adhesion aid, a leveling agent, and various other fillers may be added to the heat-resistant, photosensitive resin composition of the present invention.

The method for using the photosensitive resin composition according to the present invention is to first apply the composition to a suitable support such as a silicon wafer or a ceramic substrate. Coating methods include spin coating using a spinner, spray coating using a spray coater, dipping, printing, and roll coating. Next, after pre-baking at a low temperature of 60-80℃ and drying the coating,
Actinic radiation is applied to the desired pattern shape. As the actinic radiation, X-rays, electron beams, ultraviolet rays, visible light, etc. can be used, but those having a wavelength of 200 to 500 nm are preferable.

Next, a relief pattern is obtained by dissolving and removing the unirradiated areas with a developer. As a developer, N-methyl-2
-pyrrolidone, N,N-dimethylacetamide, N,N
-Dimethylformamide, methanol, isopropyl alcohol, water, toluene, xylene, etc. are used alone or in combination. Development methods include spray,
Although paddle, immersion, and ultrasonic methods are possible, spray development is the most preferred, as it has the shortest development time, can be incorporated in-line into the process, and provides the cleanest finished pattern. In spray development, the developer is sprayed under considerable pressure, so unless the coating film has zero or extremely low solubility in the irradiated areas, it will dissolve together with the unirradiated areas, leaving no relief pattern. Put it away. Although many conventional compositions cannot be spray developed, the composition according to the present invention can be developed and can be directly incorporated into an in-line process.

Next, the relief pattern formed by development is rinsed. As the rinsing liquid, methanol, ethanol, isopropyl alcohol, butyl acetate, etc. are used. Next, heat treatment is performed to form imide rings and obtain a final pattern with high heat resistance.

The photosensitive resin composition according to the present invention is useful not only for semiconductor applications but also as a glabella insulating film for multilayer circuits, a cover coat for flexible copper clad boards, a solder resist film, a liquid crystal alignment film, and the like.

The present invention will be specifically explained below using Examples.

Example 1 A mixture of 57 g of 3.3', 4.4'-benzophenone tetracarboxylic acid dianhydride, 33 g of 4,4'-diaminodiphenyl ether as an amine, and 10 g of silicone diamine represented by the following formula was N-
The mixture was poured into methylpyrrolidone and reacted at 20°C for 6 hours.

60 g of N-methylolacrylamide was added to the obtained polyamic acid and reacted at 80°C for 1 hour. The molecular weight of the obtained polymer was 24,500, which was as expected.

Next, 3,3'-carbonyl-bis(7-
dinitylaminocoumarin) and 8 g of N-phenylglycine as an initiator were added and mixed and dissolved at room temperature to obtain a photosensitive resin composition.

The obtained composition was applied onto an aluminum plate using a spinner and dried at 65°C for 1 hour using a dryer.

This film is coated with Kodak's Photographic Step Tablet No. 2.21 Step (in this gray scale, as the number of steps increases, the amount of transmitted light is 1/1 of that of the previous step).
(The sensitivity decreases to f2, so the larger the residual stage after development, the better the sensitivity).

Next, this was set in a spray developing machine and developed using a developer containing 60% by weight of N-methylpyrrolidone and 40% by weight of xylene. When the pattern was further rinsed with isopropyl alcohol, the pattern remained up to 12 steps, and the pattern remained with high sensitivity. I found out something.

Development time was only 30 seconds.

Next, the coating was applied onto a silicon wafer in the same manner as described above, the entire surface was exposed, development and rinsing steps were performed, and further 15
Each was heated and cured at 0.250°C and 350°C for 30 minutes.

For the adhesion test, 100 pieces were cut into 1mo+ square pieces and an attempt was made to peel them off using cellophane tape, but none of them came off, indicating that they had high adhesion.

Separately, it was coated on an aluminum plate, exposed to light over the entire surface, developed, rinsed, and cured with heat, and then the aluminum plate was removed by etching to obtain a film.

Tensile strength of the obtained film (JIS K-6760)
was as high as 15 Kg/am'' (the higher the better), and the thermal decomposition initiation temperature was as high as 410°C (the higher the better).

Volume resistivity of the obtained film (JISC-6481)
was large at 3X10"Ω・cm (bigger is better), and the rust train was also low at 3.2 (IMH2) (lower is better)
.

Comparative Examples 1 to 6 The same experiments as in Example 1 were carried out by changing the types and amounts of the sensitizer and initiator, and the results shown in Table 1 were obtained.

In Comparative Example 1, the amount of initiator added was 0.5 parts by weight, and the photosensitivity was extremely low.

In Comparative Example 2, the amount was 28 parts by weight, contrary to Comparative Example 1, and in this case, the initiator remained in the film, resulting in a low thermal decomposition initiation temperature.

Comparative Example 3 used an initiator other than the one according to the invention, had low photosensitivity, and was not practical.

In Comparative Example 4, the amount of sensitizer added was 0.5 parts by weight, and in this case, the photosensitivity was extremely low and the crosslinking was insufficient.

In Comparative Example 5, the amount of sensitizer was 35 parts by weight, and in this case, the amount of light transmitted to the deep part was insufficient, curing in the deep part was insufficient, voids were generated, and a uniform film was not obtained. .

Comparative Example 6 used a sensitizer other than the one of the present invention and had low photosensitivity, making it impractical.

Comparative Example 7 After dissolving 57 g of 3.3', 4.4'-benzophenone tetracarboxylic dianhydride and 48 g of 2-hydroxyethyl methacrylate in γ-butyrolactone, 30 gm of pyridine was added as a catalyst, and the mixture was heated at 20°C for 24 hours. react,
An esterified product was obtained. Next, 73 g of dicyclohexylcarbodiimide was added as an amidation catalyst, and then 33 g of 4,4'-diaminodiphenyl ether and 10 g of silicone diamine described in Example 1 were added, followed by reaction at 20°C for 8 hours. Next, this slurry was filtered, and the filtrate was
The mixture was added dropwise to 0 liter of ethanol with vigorous stirring to precipitate a polymer, and then allowed to stand for 12 hours. Shen N! te
1 was filtered off, dried and ground. The molecular weight of the obtained polymer (photosensitive resin of formula (IV)) was 7000, which was much smaller than expected. Therefore, a polymer was synthesized again using the same method, but the molecular weight remained at 11,000 in this case as well. It was found that this method not only requires a long and complicated process, but also has large variations.

Next, this polymer was dissolved in N-methyl-2-pyrrolidone, and the same sensitizer and initiator as in Example 1 were added to obtain a photosensitive resin composition, which was then coated, exposed, and developed in the same manner. did.

In this case, spray development is performed twice, and the development time is 3G seconds.
The sensitivity was as high as 11 steps.

However, when an attempt was made to heat-treat and evaluate the film in the same manner as in Example 1, the tensile strength of the film was 3K.
g/am" or less, and other characteristics could not be evaluated.

Comparative Example 8 60 g of diethylamino methacrylate was added to the polyamic acid in Example 1 and mixed at room temperature (formula (V)
photosensitive resin). Next, the same amounts of the same sensitizer and initiator as in Example 1 were added to obtain a photosensitive resin composition. An attempt was made to apply this composition to a silicon wafer, expose it to light, and develop it, but during spray development, not only the unexposed areas but also the exposed areas were dissolved, and no relief pattern could be obtained.

[Effects of the Invention] According to the present invention, it has become possible to obtain a photosensitized composition that can exhibit the inherent durability characteristics of a polyimide resin rich in heat resistance.

Moreover, since the method is simple, there is no variation, and since spray development is possible during the processing process, it has excellent processability and can be flowed in-line.

Furthermore, they discovered a special combination of sensitizer and initiator that has extremely high photosensitivity, making it possible to obtain good patterns with a small irradiation dose (which speeds up the process).

Claims (1)

[Claims] (1) Polymer (A) whose main component is a structural unit represented by the following formula [I] ▲There are numerical formulas, chemical formulas, tables, etc.▼... [I] (In the formula, R_1, R_2: aromatic cyclic group, R_3:-H, -CH_3, -C_2H_5R_4:-
H, -CH_3, -C_2H_5, -CH_2OH, -
C_6H_5 n: 1-2, m: 0-2) Biscoumarin compound (B) with carbonyl substitution at the 3-position represented by the following formula [II] ▲Mathematical formulas, chemical formulas, tables, etc. are available▼・・・・・・[II] (In the formula, R_5, R_6: -H, alkoxy group, dialkylamino group) Glycine compound (C) represented by the following formula [III] ] (In the formula, R_7: -H, -CH_3, -C_2H_5, -
C_6H_5, -OCH_3, -OCOCH_3, -O
C_2H_5, -OCOC_2H_5, -N(CH_3
)_2, -N(C_2H_5)_2, -NHCOOCH
_3, -COCH_3, -COC_2H_5, -NHCONH_2, -CH_2OH, -OH, -CH
(CH_3)_2, -C(CH_3)_3) is an essential component, and (B) 1 to 10 parts by weight and (C) 1 to 20 parts by weight are arranged for 100 parts by weight of (A). Resin composition.