JPH0319256B2 - - Google Patents
Info
- Publication number
- JPH0319256B2 JPH0319256B2 JP28566485A JP28566485A JPH0319256B2 JP H0319256 B2 JPH0319256 B2 JP H0319256B2 JP 28566485 A JP28566485 A JP 28566485A JP 28566485 A JP28566485 A JP 28566485A JP H0319256 B2 JPH0319256 B2 JP H0319256B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- composite material
- intermediate material
- material according
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 22
- 229920000728 polyester Polymers 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 239000004643 cyanate ester Substances 0.000 claims description 9
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 8
- 239000012779 reinforcing material Substances 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 8
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 7
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 4
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- -1 aliphatic amines Chemical class 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000012669 compression test Methods 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- HMHLDAMOJGEOMQ-UHFFFAOYSA-N (1-cyanato-4-phenylcyclohexa-2,4-dien-1-yl) cyanate Chemical group C1=CC(OC#N)(OC#N)CC=C1C1=CC=CC=C1 HMHLDAMOJGEOMQ-UHFFFAOYSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- SSUJUUNLZQVZMO-UHFFFAOYSA-N 1,2,3,4,8,9,10,10a-octahydropyrimido[1,2-a]azepine Chemical compound C1CCC=CN2CCCNC21 SSUJUUNLZQVZMO-UHFFFAOYSA-N 0.000 description 1
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- KPOXQAKDFUYNFA-UHFFFAOYSA-N 3-methyl-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(O)=O)C(C)CC2OC21 KPOXQAKDFUYNFA-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- WRDNCFQZLUCIRH-UHFFFAOYSA-N 4-(7-azabicyclo[2.2.1]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=C1C=C2 WRDNCFQZLUCIRH-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- ULPDSNLBZMHGPI-UHFFFAOYSA-N 4-methyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C)CCC2OC21 ULPDSNLBZMHGPI-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910002019 Aerosil® 380 Inorganic materials 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- AUYQDAWLRQFANO-UHFFFAOYSA-N [4-[(4-cyanatophenyl)methyl]phenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1CC1=CC=C(OC#N)C=C1 AUYQDAWLRQFANO-UHFFFAOYSA-N 0.000 description 1
- SIZDMAYTWUINIG-UHFFFAOYSA-N [4-[1-(4-cyanatophenyl)ethyl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)C1=CC=C(OC#N)C=C1 SIZDMAYTWUINIG-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 159000000032 aromatic acids Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- FDPIMTJIUBPUKL-UHFFFAOYSA-N dimethylacetone Natural products CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000029052 metamorphosis Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011269 tar Substances 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- JBCJMTUHAXHILC-UHFFFAOYSA-N zinc;octanoic acid Chemical compound [Zn+2].CCCCCCCC(O)=O JBCJMTUHAXHILC-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は優れた耐熱性、耐水性及び機械的性質
を与える複合材料用中間材に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an intermediate material for composite materials that provides excellent heat resistance, water resistance and mechanical properties.
従来、複合材料のマトリツクスとして各種の樹
脂組成物が使用されているが、特に熱硬化性樹脂
の分野においては、樹脂自身の優れた機械的性質
(特に強度、伸度)に加え補強材との接着性が良
好であり、補強材の強度発現性が他の熱硬化性樹
脂に比べて優れている点から、エポキシ樹脂が広
く用いられてきた。近年、複合材料に対する高性
能化、特に耐熱性、耐水性及び耐衝撃性の改良が
強く要望されており、その要求を満たすためマト
リツクスとして多官能性マレイミド、多官能性シ
アン酸エステルとそのオリゴマー及びこれらの予
備反応物が検討されている。その結果、樹脂の剛
性が増し複合材料の耐熱性及び耐水性は向したも
のの、伸びの低下及び耐衝撃性の低下が課題であ
つた。
Conventionally, various resin compositions have been used as matrices for composite materials, but especially in the field of thermosetting resins, in addition to the excellent mechanical properties of the resin itself (particularly strength and elongation), Epoxy resins have been widely used because they have good adhesive properties and the strength development of reinforcing materials is superior to other thermosetting resins. In recent years, there has been a strong demand for higher performance of composite materials, especially improvements in heat resistance, water resistance, and impact resistance. These pre-reactants are being considered. As a result, although the rigidity of the resin increased and the heat resistance and water resistance of the composite material improved, there were problems with a decrease in elongation and a decrease in impact resistance.
本発明者らは、高耐熱性、耐水性及び優れた耐
衝撃性を有する複合材料用中間材を開発すべく鋭
意検討した結果、本発明に到達した。
The present inventors have arrived at the present invention as a result of intensive studies aimed at developing an intermediate material for composite materials having high heat resistance, water resistance, and excellent impact resistance.
本発明は、多官能性マレイミド()及び多官
能性シアン酸エステル又はそのオリゴマー()
の混合物あるいは()と()の予備反応物(A)
の100重量部、エポキシ化合物(B)5〜100重量部及
び一般式
(式中Arはフエニレン基、R1は2価の脂肪族
基を示す)で表わされるポリエステル化合物(C)5
〜50重量部からなる樹脂組成物を、補強材に含浸
させた複合材料用中間材である。
The present invention provides polyfunctional maleimide () and polyfunctional cyanate ester or oligomer thereof ().
mixture of () or pre-reactant of () and () (A)
100 parts by weight, 5 to 100 parts by weight of epoxy compound (B) and general formula (In the formula, Ar is a phenylene group and R 1 is a divalent aliphatic group.) Polyester compound (C)5
This is an intermediate material for composite materials in which a reinforcing material is impregnated with ~50 parts by weight of a resin composition.
式(1)のポリエステル化合物(C)において置換基
Arのためのフエニレン基としては、o−フエニ
レン基、m−フエニレン基、p−フエニレン基の
いずれでもよく、またR1のための2価の脂肪族
基としては、炭素数2〜6の直鎖状又は分岐状の
脂肪族基が好ましく、例えば下記の基が挙げられ
る。基(−CH2)−2、(−CH2)−3、−CH2−CH(CH3)
−、CH−C2H5、(−CH2)−4、−CH2−CH
(CH3)−CH2−、(−CH2)−5、(−CH2)−3CH
(CH3)−、(−CH2)−2CH(CH3)−CH2−、(−CH2
)−2CH(C2H5)−、−CH2−C(CH3)2−CH2−等。 Substituent in polyester compound (C) of formula (1)
The phenylene group for Ar may be any o-phenylene group, m-phenylene group, or p-phenylene group, and the divalent aliphatic group for R 1 may be a straight C2-C6 aliphatic group. A chain or branched aliphatic group is preferred, and examples include the following groups. Group ( -CH2 ) -2 , ( -CH2 ) -3 , -CH2 -CH( CH3 )
−, CH−C 2 H 5 , (−CH 2 )− 4 , −CH 2 −CH
( CH3 ) −CH2− , ( −CH2 ) −5 , ( −CH2 ) −3 CH
(CH 3 )−, (−CH 2 )− 2 CH(CH 3 )−CH 2 −, (−CH 2
) -2CH ( C2H5 )-, -CH2 - C ( CH3 ) 2 - CH2- , etc.
本発明に用いられる多官能性マレイミド()
は、マレイミド基を2個以上有する化合物であつ
て、一般式
(式中R2は2価の芳香族基又は脂肪族基を示
す)で表わされるビスマレイミドの他、これらビ
スマレイミドとジアミンから得られるプリポリマ
ーを含む。式(2)のビスマレイミドは無水マレイン
酸とジアミンとを反応させビスマレアミド酸を調
製し、次いで脱水環化させる公知の方法で製造す
ることができる。ジアミンとしては耐熱性の点か
ら芳香族ジアミンが好ましいが、可撓性等の機能
を付与したい場合には脂肪族アミンを単独である
いは組み合わせて用いることもできる。ジアミン
としては例えばm−フエニレンジアミン、p−フ
エニレンジアミン4,4′−ジアミノジフエニルス
ルホン、3,3′−ジアミノジフエニルスルホン、
4,4′−ジアミノジフエニルメタン、4,4′−ジ
アミノジフエニルエーテル等が用いられる。 Polyfunctional maleimide () used in the present invention
is a compound having two or more maleimide groups, and has the general formula In addition to bismaleimide represented by the formula (in which R 2 represents a divalent aromatic group or aliphatic group), it also includes prepolymers obtained from these bismaleimides and diamines. The bismaleimide of formula (2) can be produced by a known method of preparing bismaleamic acid by reacting maleic anhydride with a diamine, and then cyclodehydrating it. As the diamine, aromatic diamines are preferred from the viewpoint of heat resistance, but aliphatic amines may be used alone or in combination if it is desired to impart functions such as flexibility. Examples of diamines include m-phenylenediamine, p-phenylenediamine 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone,
4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, etc. are used.
本発明に用いられる多官能性シアン酸エステル
()は、2個以上のシアン酸エステル基を有す
る有機化合物及びそのオリゴマーであり、一般式
R3(−0−C≡N)o (3)
(式中nは2〜5の整数、R3は芳香族性の有
機残基を示す)で表わされる化合物である。多官
能性シアン酸エステルとしては例えば1,3−又
は1,4−ジシアナートベンゼン、4,4−ジシ
アナートビフエニル、ビス(4−シアナートフエ
ニル)メタン、2,2−ビス(4−シアナートフ
エニル)エタン、2,2−ビス(4−シアナート
フエニル)プロパン、ビス(4−シアナートフエ
ニル)スルホン等が用いられる。前記の多官能性
シアン酸エステルはシアナートの三量化によるト
リアジンオリゴマーの他、アミンとの反応による
プレポリマーの形でも用いることができ、その目
的に用いられるアミンとしては前記の多官能性マ
レイミドの合成及び変成に用いられたものが挙げ
られる。 The polyfunctional cyanate ester () used in the present invention is an organic compound having two or more cyanate ester groups and an oligomer thereof, and has the general formula R 3 (-0-C≡N) o (3) ( In the formula, n is an integer of 2 to 5, and R 3 represents an aromatic organic residue. Examples of polyfunctional cyanate esters include 1,3- or 1,4-dicyanatobenzene, 4,4-dicyanatobiphenyl, bis(4-cyanatophenyl)methane, and 2,2-bis( 4-cyanatophenyl)ethane, 2,2-bis(4-cyanatophenyl)propane, bis(4-cyanatophenyl)sulfone, etc. are used. The polyfunctional cyanate ester described above can be used in the form of a triazine oligomer obtained by trimerizing cyanate, or in the form of a prepolymer obtained by reaction with an amine. and those used for metamorphosis.
本発明では、A成分として前記の多官能性マレ
イミド()及び多官能性シアン酸エステル又は
そのオリゴマー()の混合物、あるいは触媒の
不在又は存在において()を()を予備反応
させることにより得られる予備反応物が、用途に
応じて適宜選択使用される。 In the present invention, as component A, a mixture of the polyfunctional maleimide () and a polyfunctional cyanate ester or its oligomer (), or a mixture obtained by pre-reacting () with () in the absence or presence of a catalyst, is used. Preliminary reactants are appropriately selected and used depending on the purpose.
本発明に用いられるエポキシ化合物(B)として
は、公知のエポキシ樹脂でよく、例えば下記の化
合物が挙げられる。ジフエニロールプロパン、ジ
フエニロールエタン、ジフエニロールメタンなど
のジフエニロールアルカンのポリグリシジルエー
テル、ノボラツク、クレゾール、レゾールなどの
多価フエノールのポリグリシジルエーテル、シク
ロヘキサン、シクロペンタジエン、ジシクロペン
タジエンなどの脂環式化合物のエポキシ化により
生成されるエポキシ樹脂例えば3,4−エポキシ
−6−メチル−シクロヘキサン−カルボン酸の
(3,4−エポキシ−6−メチル−シクロヘキサ
ン)−メチルエステル、エチレングリコール、グ
リセリンなどの脂肪族ポリオキシ化合物のポリ
(エポキシアルキル)エーテル、芳香族又は脂肪
族カルボン酸のグリシジルエステルなどのカルボ
ン酸のエポキシアルキルエステルなど。また例え
ば米国特許第3390037号、同第2970983号及び同第
3067170号各明細書に記載されているようなエポ
キシ樹脂と硬化剤の予備反応物であつてもよく、
単なる混合物であつてもよい。これらは単独でも
二種以上配合して用いてもよい。好適なエポキシ
化合物としては、例えばビスフエノールAのジグ
リシジルエーテルもしくはビスフエノールFのジ
グリシジルエーテルあるいはそれらのエポキシ化
合物とジアミノジフエニルスルホンとのエポキシ
基/NH基比4/1での予備反応物が挙げられ
る。 The epoxy compound (B) used in the present invention may be any known epoxy resin, such as the following compounds. Polyglycidyl ethers of diphenylolalkanes such as diphenylopropane, diphenyloethane, and diphenylomethane; polyglycidyl ethers of polyhydric phenols such as novolac, cresol, and resol; cyclohexane, cyclopentadiene, dicyclopentadiene, etc. Epoxy resins produced by epoxidation of alicyclic compounds, such as (3,4-epoxy-6-methyl-cyclohexane)-methyl ester of 3,4-epoxy-6-methyl-cyclohexane-carboxylic acid, ethylene glycol, glycerin poly(epoxyalkyl)ethers of aliphatic polyoxy compounds such as, epoxyalkyl esters of carboxylic acids such as glycidyl esters of aromatic or aliphatic carboxylic acids, etc. Also, for example, U.S. Patent Nos. 3390037, 2970983, and
It may be a preliminary reaction product of an epoxy resin and a curing agent as described in each specification of No. 3067170,
It may also be a simple mixture. These may be used alone or in combination of two or more. Suitable epoxy compounds include, for example, diglycidyl ether of bisphenol A or diglycidyl ether of bisphenol F, or pre-reacted products of these epoxy compounds and diaminodiphenylsulfone at an epoxy group/NH group ratio of 4/1. Can be mentioned.
本発明に用いられる式(1)のポリエステル化合物
(C)は、酸成分が主としてテレフタル酸、グリコー
ル成分が主としてネオペンチルグリコール又はエ
チレングリコールである化合物が好ましい。本発
明に用いられるポリエステル化合物は、軟化点が
が100℃以下であることが必要であつて、70℃以
下であることが好ましい。軟化点が100℃を越え
る場合には多官能性マレイミド、多官能性シアン
酸エステル及びエポキシ化合物との相溶性が悪く
なり、均一な組成物を得ることが困難となる。こ
のポリエステル化合物は数平均分子量が500〜
10000、特に500〜3000であることが好ましい。
500未満では粘度が低下し、また10000を越えると
他の成分との混合作業性に欠けるため適当でな
い。本発明に用いられるポリエステル化合物は他
の線状ポリエステルの製造において用いられる一
般的な方法によつて製造できる。 Polyester compound of formula (1) used in the present invention
(C) is preferably a compound whose acid component is mainly terephthalic acid and whose glycol component is mainly neopentyl glycol or ethylene glycol. The polyester compound used in the present invention must have a softening point of 100°C or lower, preferably 70°C or lower. If the softening point exceeds 100°C, the compatibility with polyfunctional maleimide, polyfunctional cyanate ester, and epoxy compound deteriorates, making it difficult to obtain a uniform composition. This polyester compound has a number average molecular weight of 500~
10,000, particularly preferably 500 to 3,000.
If it is less than 500, the viscosity decreases, and if it exceeds 10,000, it is not suitable because it lacks workability in mixing with other components. The polyester compound used in the present invention can be produced by a general method used in the production of other linear polyesters.
本発明に用いられる樹脂組成物は、A成分100
重量部に対しB成分5〜100重量部、C成分5〜
50重量部の組成比とすることが必要である。B成
分であるエポキシ化合物の使用量が5重量部未満
の場合には基材に対する接着性が劣り、100重量
部を越えると満足な耐熱性が得られない。またC
成分であるポリエステル化合物の使用量が5重量
部未満の場合には充分な耐衝撃性が発揮されず、
50重量部を越えると耐熱性及び耐溶剤性が著しく
低下する。またA成分中の()/()の比は
5〜15/95〜85が好ましい。多官能性マレイミド
()の量が15より多いと耐熱性は向上するもの
の高い硬化温度が必要であり、また耐衝撃性が低
下し、5より低いと耐衝撃性は向上するものの、
耐熱水性が低下するため好ましくない。 The resin composition used in the present invention has an A component of 100%
5 to 100 parts by weight of component B, 5 to 100 parts by weight of component C
It is necessary to set the composition ratio to 50 parts by weight. If the amount of the epoxy compound used as component B is less than 5 parts by weight, the adhesion to the substrate will be poor, and if it exceeds 100 parts by weight, satisfactory heat resistance will not be obtained. Also C
If the amount of the component polyester compound used is less than 5 parts by weight, sufficient impact resistance will not be exhibited.
If it exceeds 50 parts by weight, heat resistance and solvent resistance will be significantly reduced. The ratio of ()/() in component A is preferably 5-15/95-85. If the amount of polyfunctional maleimide () is more than 15, heat resistance will improve, but a high curing temperature will be required, and impact resistance will decrease, and if it is less than 5, impact resistance will improve, but
This is not preferred because hot water resistance decreases.
本発明に用いられる樹脂組成物には、樹脂硬化
物に所望の特性を付与したり、あるいは樹脂の熱
硬化性を調節する目的で触媒を添加してもよい。
触媒としては例えば三弗化硼素アミン錯化合物の
ような潜在性硬化触媒の他、トリエチレンジアミ
ン、1,8−ジアザビシクロ(5,4,0)ウン
デセン、N,N−ジメチルベンジルアミン、N−
メチルモルホリン、トリ−n−ブチルアミン等の
第3アミン、ジクミルパーオキサイド、過酸化ベ
ンゾイル、t−ブチルヒドロパーオキサイド等の
有機過酸化物、オクチル酸亜鉛、オクチル酸錫、
ナフテン酸亜鉛、ナフテン酸コバルト等の有機酸
金属塩等が挙げられる。触媒の使用量は目的に応
じて決定すればよいが、樹脂組成物の安定性の面
から、全樹脂固形成分に対して0.2〜3重量%と
することが好ましい。 A catalyst may be added to the resin composition used in the present invention for the purpose of imparting desired properties to the cured resin product or adjusting the thermosetting properties of the resin.
Examples of catalysts include latent curing catalysts such as boron trifluoride amine complexes, triethylenediamine, 1,8-diazabicyclo(5,4,0)undecene, N,N-dimethylbenzylamine, N-
Tertiary amines such as methylmorpholine and tri-n-butylamine, organic peroxides such as dicumyl peroxide, benzoyl peroxide, and t-butyl hydroperoxide, zinc octylate, tin octylate,
Examples include organic acid metal salts such as zinc naphthenate and cobalt naphthenate. The amount of catalyst to be used may be determined depending on the purpose, but from the viewpoint of stability of the resin composition, it is preferably 0.2 to 3% by weight based on the total resin solid components.
本発明の複合材料用中間材の補強材としては、
ガラス繊維、炭素繊維、ボロン繊維、シリコンカ
ーバイド繊維等の無機繊維の他、ポリ−p−フエ
ニレンテレフタルアミド、ポリ−p−ベンズアミ
ド、ポリアミドヒドラジド等の有機繊維からなる
チヨツプ状、ヤーン状、テープ状、シート状、編
物状、マツト状、紙状物やアスベスト、マイカ、
タルク等、並びにこれらの2種以上の混合物が用
いられる。 As the reinforcing material for the intermediate material for composite materials of the present invention,
In addition to inorganic fibers such as glass fiber, carbon fiber, boron fiber, and silicon carbide fiber, chop-shaped, yarn-shaped, and tape-shaped products are made of organic fibers such as poly-p-phenylene terephthalamide, poly-p-benzamide, and polyamide hydrazide. , sheet, knitted, pine, paper, asbestos, mica,
Talc and the like, as well as mixtures of two or more thereof, are used.
また用途により酸化珪素微粉末などの流れ調整
剤、顔料、染料、安定剤、可塑剤、滑剤、ター
ル、アスフアルトなども単独もしくは他の補強材
と併用して用いることができる。 Depending on the purpose, flow control agents such as fine silicon oxide powder, pigments, dyes, stabilizers, plasticizers, lubricants, tar, asphalt, etc. may also be used alone or in combination with other reinforcing materials.
樹脂組成物を補強材に含浸させる場合は、樹脂
組成物を50〜120℃の温度で予備反応させてプレ
ポリマーを製造し、このプレポリマーを溶媒例え
ばメチレンエチルケトンに溶解して補強材に含浸
させることが好ましい。複合材料用中間材中の補
強材の含有率は0.5〜80容量%が好ましい。また
エポキシ樹脂以外の熱硬化性樹脂や熱可塑性樹脂
を併用することができる。 When impregnating a reinforcing material with a resin composition, the resin composition is pre-reacted at a temperature of 50 to 120°C to produce a prepolymer, and this prepolymer is dissolved in a solvent such as methylene ethyl ketone and impregnated into the reinforcing material. It is preferable to let The content of the reinforcing material in the intermediate material for composite material is preferably 0.5 to 80% by volume. Further, thermosetting resins and thermoplastic resins other than epoxy resins can be used in combination.
実施例 1
ビス(4−マレイミドフエニル)メタン、2,
2−ビス(4−シアナートフエニル)プロパン、
エポキシ当量172のエピコート807(シエル化学社
製)及び酸成分としてテレフタル酸、グリコール
成分としてネオペンチルグリコールから成る軟化
点25℃のポリエステル(a)の下記表に示す割合で混
合し、さらに酸化珪素微粉末AEROSIL380(日本
エアロジル社製)1.25部及び硬化触媒としてジク
ミルパーオキサイド0.2部を加え、70℃で30分間
予備反応させプレポリマーを得た。このプレポリ
マーを所定の厚さになるようにガラス板に挾み、
180℃で2時間硬化し樹脂板を得た。またこのプ
レポリマーをメチルエチルケトンに溶解し、炭素
繊維(パイロフイルT−3三菱レイヨン社製)に
含浸しつつドラムに巻きつけたのち乾燥し、次い
で切り開くことにより一方向プリプレグ(糸目付
145g/m2、樹脂含有率33重量%)を得た。この
プリプレグを〔0゜〕16に積層し、また〔+45゜/
0゜/−45゜/+90゜)4Sの擬等方性に積層し、180℃
で2時間硬化させ複合材を得た。そして樹脂及び
複合材について種々の試験を実施した。その結果
を下記表に示す。表中のガラス転移点(Tg)は
レオメトリツクス社製ダイナミツクメカニカルス
ペクトルメーターにより測定したtanδMAX温度
である。複合材の耐熱水性は、0゜16層の積層材コ
ンポジツトを71℃の水中に14日間放置したのち、
ASTMD695に従つて121℃で0゜方向の圧縮試験を
実施することにより判定した。また耐衝撃性は
NASA RP1092に準拠して、寸法4×6×0.25イ
ンチの板を3×5インチの穴のあいた台上に固定
し、その中心に1/2インチRのノーズをつけた4.9
Kgの分銅を落下させ、板厚1インチ当り1500lbin
の衝撃を加えたのち、その板を圧縮試験すること
により求めた。なお、コンポジツトのデータはい
ずれも繊維含有率60%換算値である。Example 1 Bis(4-maleimidophenyl)methane, 2,
2-bis(4-cyanatophenyl)propane,
Epikote 807 (manufactured by Schiel Kagaku Co., Ltd.) having an epoxy equivalent of 172 and polyester (a) with a softening point of 25°C consisting of terephthalic acid as an acid component and neopentyl glycol as a glycol component are mixed in the proportions shown in the table below, and a fine amount of silicon oxide is added. 1.25 parts of powder AEROSIL 380 (manufactured by Nippon Aerosil Co., Ltd.) and 0.2 parts of dicumyl peroxide as a curing catalyst were added, and a preliminary reaction was carried out at 70°C for 30 minutes to obtain a prepolymer. This prepolymer is sandwiched between glass plates to a predetermined thickness.
A resin plate was obtained by curing at 180°C for 2 hours. In addition, this prepolymer is dissolved in methyl ethyl ketone, impregnated with carbon fiber (Pyrofil T-3 manufactured by Mitsubishi Rayon Co., Ltd.), wound around a drum, dried, and then cut open to create a unidirectional prepreg (thread density).
145 g/m 2 , resin content 33% by weight). This prepreg was laminated to [0°] 16 , and also [+45°/
0゜/-45゜/+90゜) 4S pseudo-isotropically stacked and heated at 180℃
The mixture was cured for 2 hours to obtain a composite material. Various tests were then conducted on resins and composite materials. The results are shown in the table below. The glass transition point (Tg) in the table is the tan δ MAX temperature measured with a Dynamik mechanical spectrometer manufactured by Rheometrics. The hot water resistance of the composite material was determined after a 16-layer laminate composite was left in water at 71°C for 14 days.
Judgment was made by performing a compression test in the 0° direction at 121°C in accordance with ASTM D695. In addition, the impact resistance
In accordance with NASA RP1092, a board with dimensions of 4 x 6 x 0.25 inches was fixed on a table with a 3 x 5 inch hole, and a 1/2 inch radius nose was attached in the center.
Dropping a kg weight, 1500lbin per inch of plate thickness
It was determined by applying an impact to the plate and then performing a compression test. All composite data are calculated based on a fiber content of 60%.
実施例 2
ポリエステル(a)の代わりに酸成分としてテレフ
タル酸、グリコール成分としてエチレングリコー
ルとネオペンチルグリコールの1:1(重量)混
合物から成る軟化点20℃のポリエステル(b)を用
い、その他は実施例1と同様にして樹脂板及び複
合材を得た。各種試験の結果を下記表に示す。Example 2 Polyester (b) with a softening point of 20°C consisting of terephthalic acid as the acid component and a 1:1 (by weight) mixture of ethylene glycol and neopentyl glycol as the glycol component was used instead of polyester (a), and the other conditions were as follows. A resin plate and a composite material were obtained in the same manner as in Example 1. The results of various tests are shown in the table below.
実施例 3
エポキシ樹脂として、エポキシ当量184〜194の
エピコート828(シエル化学社製)を用い、その他
は実施例1と同様にして樹脂板及び複合材を得
た。試験結果を下記表に示す。Example 3 A resin plate and a composite material were obtained in the same manner as in Example 1 except that Epikote 828 (manufactured by Ciel Chemical Co., Ltd.) having an epoxy equivalent of 184 to 194 was used as the epoxy resin. The test results are shown in the table below.
実施例4、比較例1及び2
ポリエステル(a)の使用量を変え、その他は実施
例1と同様にして樹脂板と複合材を得た。試験結
果を下記表に示す。Example 4, Comparative Examples 1 and 2 A resin plate and a composite material were obtained in the same manner as in Example 1 except that the amount of polyester (a) used was changed. The test results are shown in the table below.
実施例5、比較例3及び4
エピコート807の使用量を変え、その他は実施
例1と同様にして樹脂板と複合材を得た。Example 5, Comparative Examples 3 and 4 A resin plate and a composite material were obtained in the same manner as in Example 1 except that the amount of Epicote 807 used was changed.
試験結果を下記表に示す。 The test results are shown in the table below.
実施例6及び7
ビス(4−マレイミドフエニル)メタン及び
2,2−ビス(4−シアナートフエニル)プロパ
ンの使用量を変え、その他は実施例1と同様にし
て樹脂板と複合材を得た。試験結果を下記表に示
す。Examples 6 and 7 Resin plates and composite materials were prepared in the same manner as in Example 1 except that the amounts of bis(4-maleimidophenyl)methane and 2,2-bis(4-cyanatophenyl)propane were changed. Obtained. The test results are shown in the table below.
Claims (1)
ン酸エステル又はそのオリゴマー()の混合物
あるいは()と()の予備反応物(A)の100重
量部、エポキシ化合物(B)5〜100重量部及び一般
式 (式中Arはフエニレン基、R1は2価の脂肪族
基を示す)で表わされるポリエステル化合物(C)5
〜50重量部から成る樹脂組成物を、補強材に含浸
させた複合材料用中間材。 2 多官能性マレイミド()がジアミノジフエ
ニルメタンのビスマレイミドであることを特徴と
する、特許請求の範囲第1項に記載の複合材料用
中間材。 3 多官能性シアン酸エステル()がビスフエ
ノールAのジシアナートであることを特徴とす
る、特許請求の範囲第1項に記載の複合材料用中
間材。 4 エポキシ化合物(B)がビスフエノールAのジグ
リシジルエーテルもしくはビスフエノールFのジ
グリシジルエーテルあるいはそれらのエポキシ化
合物とジアミノジフエニルスルホンとのエポキシ
基/NH基比4/1での予備反応物であることを
特徴とする、特許請求の範囲第1項に記載の複合
材料用中間材。 5 ポリエステル化合物(C)がテレフタル酸とネオ
ペンチルグリコールからの反応生成物であり、軟
化温度が100℃以下、その平均分子量が500〜
10000であることを特徴とする、特許請求の範囲
第1項に記載の複合材料用中間材。 6 酸化珪素微粉末を0.2〜3重量%含有するこ
とを特徴とする、特許請求の範囲第1項に記載の
複合材料用中間材。 7 A成分中の()/()の重量比が5〜
15/95〜85であることを特徴とする、特許請求の
範囲第1項に記載の複合材料用中間材。 8 触媒として三弗化硼素モノエチルアミン錯
体、ジクミルパーオキサイド及び/又はオクチル
酸亜鉛を0.2〜3重量%含有することを特徴とす
る、特許請求の範囲第1項に記載の複合材料用中
間材。[Scope of Claims] 1. 100 parts by weight of a mixture of polyfunctional maleimide () and polyfunctional cyanate ester or its oligomer () or a preliminary reaction product (A) of () and (), epoxy compound (B) 5-100 parts by weight and general formula (In the formula, Ar is a phenylene group and R 1 is a divalent aliphatic group) Polyester compound (C)5
An intermediate material for composite materials in which a reinforcing material is impregnated with ~50 parts by weight of a resin composition. 2. The intermediate material for a composite material according to claim 1, wherein the polyfunctional maleimide () is bismaleimide of diaminodiphenylmethane. 3. The intermediate material for a composite material according to claim 1, wherein the polyfunctional cyanate ester () is dicyanate of bisphenol A. 4. The epoxy compound (B) is diglycidyl ether of bisphenol A or diglycidyl ether of bisphenol F, or a preliminary reaction product of these epoxy compounds and diaminodiphenylsulfone at an epoxy group/NH group ratio of 4/1. An intermediate material for a composite material according to claim 1, characterized in that: 5 The polyester compound (C) is a reaction product from terephthalic acid and neopentyl glycol, has a softening temperature of 100°C or less, and has an average molecular weight of 500~
10,000, the intermediate material for composite material according to claim 1. 6. The intermediate material for a composite material according to claim 1, which contains 0.2 to 3% by weight of silicon oxide fine powder. 7 The weight ratio of ()/() in component A is 5 to
15/95-85, the intermediate material for composite material according to claim 1. 8. The intermediate material for a composite material according to claim 1, which contains 0.2 to 3% by weight of boron trifluoride monoethylamine complex, dicumyl peroxide and/or zinc octylate as a catalyst. .
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28566485A JPS62146927A (en) | 1985-12-20 | 1985-12-20 | Intermediate material for composite materials |
| EP19860117763 EP0230631B2 (en) | 1985-12-20 | 1986-12-19 | Intermediate for composite material |
| ES86117763T ES2016249T5 (en) | 1985-12-20 | 1986-12-19 | PROCEDURE FOR PREPARING AN INTERMEDIATE FOR A COMPOSITE MATERIAL. |
| DE8686117763T DE3673150D1 (en) | 1985-12-20 | 1986-12-19 | INTERMEDIATE PRODUCT FOR COMPOSITE MATERIALS. |
| US07/320,803 US5003013A (en) | 1985-12-20 | 1989-03-09 | Intermediate for composite of polymaleimide, polycyanate, epoxy resin and polyester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28566485A JPS62146927A (en) | 1985-12-20 | 1985-12-20 | Intermediate material for composite materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62146927A JPS62146927A (en) | 1987-06-30 |
| JPH0319256B2 true JPH0319256B2 (en) | 1991-03-14 |
Family
ID=17694456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28566485A Granted JPS62146927A (en) | 1985-12-20 | 1985-12-20 | Intermediate material for composite materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62146927A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6330558A (en) * | 1986-07-25 | 1988-02-09 | Yokohama Rubber Co Ltd:The | Thermosetting resin composition |
| US6534179B2 (en) | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
| JP5016998B2 (en) * | 2007-07-03 | 2012-09-05 | 三菱レイヨン株式会社 | Matrix resin and prepreg for fiber reinforced composite materials |
| JP2012131948A (en) * | 2010-12-24 | 2012-07-12 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg, laminate plate, resin sheet, printed wiring board, and semiconductor device |
| CN105542128A (en) * | 2015-12-15 | 2016-05-04 | 广东广山新材料有限公司 | Curing agent for epoxy resin as well as preparation method and application thereof |
| JP6354884B1 (en) | 2017-03-13 | 2018-07-11 | 横浜ゴム株式会社 | Cyanate ester resin composition and prepreg |
| CN110655791B (en) * | 2019-09-30 | 2022-03-01 | 艾蒙特成都新材料科技有限公司 | High heat-resistant low-dielectric active ester resin composition and preparation method of laminated board |
-
1985
- 1985-12-20 JP JP28566485A patent/JPS62146927A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62146927A (en) | 1987-06-30 |
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| Date | Code | Title | Description |
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| EXPY | Cancellation because of completion of term |