JPH03193694A - Crystal growing device - Google Patents

Crystal growing device

Info

Publication number
JPH03193694A
JPH03193694A JP1334101A JP33410189A JPH03193694A JP H03193694 A JPH03193694 A JP H03193694A JP 1334101 A JP1334101 A JP 1334101A JP 33410189 A JP33410189 A JP 33410189A JP H03193694 A JPH03193694 A JP H03193694A
Authority
JP
Japan
Prior art keywords
crucible
crystal
chamber
pulling
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1334101A
Other languages
Japanese (ja)
Inventor
Hideki Fujiwara
秀樹 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP1334101A priority Critical patent/JPH03193694A/en
Publication of JPH03193694A publication Critical patent/JPH03193694A/en
Pending legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Abstract

PURPOSE:To decrease the heat quantity required for melting raw materials and to reduce the cost of crystal production by providing a heat shielding plate held to cover the top of a crucible at the time of melting of the raw materials for a crystal in the crystal growing device by a pulling up method. CONSTITUTION:The raw materials for the crystal are charged to the crucible 1 provided in a chamber 10. The heat shielding plate 21 is hung via a jig 27 at the bottom end of the pulling up shaft 6 and is lowered from a pull chamber 11 via a shutter 4 into the chamber 10, by which the heat shielding plate 21 is so disposed as to cover the upper part of the crucible 1. The raw materials in the crucible 1 are then heated by a heater 2 and, thereafter, the pulling up shaft 6 is pulled up to pull in the heat shielding plate 21 into the pull chamber 11. The shutter 4 is closed/and after the pull chamber 11 is removed, a seed crystal provided at the bottom end of the pulling up shaft 6 is immersed into the melt layer in the crucible 1 and is pulled up to grow the crystal.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、主に半導体材料として用いられているシリコ
ン単結晶等の結晶成長装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for growing crystals such as silicon single crystals, which are mainly used as semiconductor materials.

〔従来の技術〕[Conventional technology]

一般にこの種の結晶の成長装置としては、チゴクラルス
キー法(CZ法)が広く用いられている。
In general, the Chigochralski method (CZ method) is widely used as an apparatus for growing this type of crystal.

第4図はCZ法を用いる結晶成長装置を示す模式図であ
り、図中1は水冷されているチャンバ内等に配設された
坩堝を示している。坩堝1は有底円筒状をなす黒鉛製の
外層容器1aと石英製の内層容器1hとを同心状に配し
て構成されており、ここに結晶用原料を装入し、軸1c
にて坩堝1を回転させつつ坩堝1の周囲に配したヒータ
2にて加熱溶融せしめた後、この溶融液り中に引上げ軸
6にて吊り下げた種結晶7を浸し、これを回転させつつ
上方に引上げ、種結晶7の下端に単結晶8を成長せしめ
るようになっている。
FIG. 4 is a schematic diagram showing a crystal growth apparatus using the CZ method, and numeral 1 in the figure indicates a crucible disposed in a water-cooled chamber or the like. The crucible 1 is constructed by concentrically arranging an outer layer container 1a made of graphite and an inner layer container 1h made of quartz, each having a cylindrical shape with a bottom.
After heating and melting the crucible 1 with a heater 2 arranged around the crucible 1 while rotating the crucible 1, a seed crystal 7 suspended by a pulling shaft 6 is immersed in this molten liquid, and while rotating the crucible 1, The seed crystal 7 is pulled upward to grow a single crystal 8 at the lower end of the seed crystal 7.

ところで通常単結晶を半導体基板等として用いる場合は
、単結晶の電気抵抗率、導電型を調節するために、坩堝
1内の溶融液中には不純物元素を添加するが、このよう
な不純物は単結晶8の引上げ方向に偏析し、単結晶8の
成長方向全長にわたって均一な濃度分布を維持すること
は極めて難しい。
By the way, when a single crystal is normally used as a semiconductor substrate, an impurity element is added to the melt in the crucible 1 in order to adjust the electrical resistivity and conductivity type of the single crystal. It segregates in the pulling direction of the crystal 8, and it is extremely difficult to maintain a uniform concentration distribution over the entire length of the single crystal 8 in the growth direction.

不純物の偏析は、溶融液と単結晶との成長界面における
単結晶中の不純物濃度C3と溶融液中の不純物濃度CL
との比Cs/Ct、即ち実効偏析係数keが1とならな
いことに起因して、単結晶の成長に伴う溶融液中の不純
物濃度が結晶引上げ這中で変化することによる。
Segregation of impurities is determined by the impurity concentration C3 in the single crystal at the growth interface between the melt and the single crystal and the impurity concentration CL in the melt.
This is due to the fact that the ratio Cs/Ct, that is, the effective segregation coefficient ke, is not 1, and the impurity concentration in the melt accompanying the growth of the single crystal changes during the crystal pulling process.

このような偏析を抑制する方法として溶融N注が知られ
ている。第5図は一般的な溶融層法による結晶成長装置
の模式図であり、ヒータ2の制樹によって坩堝lの底部
に結晶用原料の固体層Sをまたその上方に結晶用原料の
溶融層1.を共存さゼた状態で第4図に示す過程と同様
に単結晶8を惑長させるようになっている。
Molten N injection is known as a method for suppressing such segregation. FIG. 5 is a schematic diagram of a crystal growth apparatus using a general molten layer method, in which a solid layer S of the crystal raw material is formed at the bottom of the crucible l by a heater 2, and a molten layer 1 of the crystal raw material is formed above it. .. In this state, the single crystal 8 is made to elongate in the same manner as the process shown in FIG.

この単結晶8の引上げに際し、途中ヒータ2C制御によ
って単結晶8の引上げに伴う溶融層の厚さの減少を固体
層Sの溶融によって補充し、溶片層I5の体積を一定に
保持しく溶融層厚一定法という)、不純物元素は結晶引
上げ中連続的に添加し溶融液中の不純物濃度を一定に維
持して結晶を成長させる装置(特公昭34−8242号
公報)、或いは意図的に溶融液層の体積を変化させ、(
溶融層厚変化法という)、結晶引上げ中は不純物元素を
標加することなく溶融液中の不純物濃度を一定に維持し
て結晶を成長させる装置等がある。
During the pulling of the single crystal 8, the decrease in the thickness of the molten layer due to the pulling of the single crystal 8 is compensated for by the melting of the solid layer S by controlling the heater 2C midway, so that the volume of the flake layer I5 is kept constant. (called the constant thickness method), an apparatus in which impurity elements are continuously added during crystal pulling to maintain a constant impurity concentration in the melt to grow the crystal (Japanese Patent Publication No. 34-8242), or intentionally By changing the volume of the layer, (
There are devices that grow crystals by maintaining a constant impurity concentration in the melt without adding impurity elements during crystal pulling.

ところで上述した如きCZ法、溶融層法のいずれを採用
する場合にも原料としては多結晶を破砕して得た径が1
00mm程度の比較的大きいもの(ランプと称す)、径
が10mm程度の比較的小さいもの(チップと称す)を
混合して用いるが、坩堝に対する原料の仕込み量、即ち
チャージ量は固体層Sと溶融液層りとを併存させる必要
のある溶融層法ではCZ法に比較して1.5〜2倍程度
必要とされるのが普通であり、坩堝1自体もCZ法用に
比較して溶融層法用の方が大きくなっている。
By the way, when using either the CZ method or the fused layer method as described above, the raw material is a polycrystal with a diameter of 1
A relatively large one with a diameter of about 0.00 mm (referred to as a lamp) and a relatively small one with a diameter of around 10 mm (referred to as a chip) are used as a mixture. The molten layer method, which requires a liquid layer to coexist, usually requires about 1.5 to 2 times as much as the CZ method, and the crucible 1 itself also requires a molten layer less than the CZ method. The legal version is larger.

第6図は溶融層法を用いた単結晶成長装置における原料
溶解時の状態を示す模式的縦断面であり、チャンバ10
内の中央に坩堝1が軸1cにて回転並びに昇降可能に配
設され、その周囲にヒータ2及び保温筒3が同心状に配
設され、また上部には真空シャッタ4を介在させてプル
チャンバ11が設けられている。
FIG. 6 is a schematic longitudinal section showing the state during melting of raw materials in a single crystal growth apparatus using the molten layer method, and shows the chamber 10.
A crucible 1 is arranged at the center of the interior so as to be rotatable and movable up and down on a shaft 1c, a heater 2 and a heat insulating cylinder 3 are arranged concentrically around the crucible 1, and a pull chamber 11 is provided with a vacuum shutter 4 interposed in the upper part. is provided.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで上述した如き従来装置にあっては、ヒータ2の
長さは溶融液層りと固体層Sとを併存させるために短く
設定しているがら、原料溶解時には坩堝の下側過半部は
ヒータ2と対向しない状態となるため、伝導、放熱損失
がCZ法用坩堝に比較して大きくなり、原料の溶融に長
い時間を要し、多大の電力を必要とするという問題があ
った。
By the way, in the conventional apparatus as described above, the length of the heater 2 is set short in order to coexist the molten liquid layer and the solid layer S, but when melting the raw material, the lower half of the crucible is Since the crucible does not face the crucible, conduction and heat dissipation losses are larger than in a CZ method crucible, and there are problems in that it takes a long time to melt the raw material and a large amount of electric power is required.

本発明者等は原料溶解時の熱摸失を低減し、効率的な原
料の加熱溶解を行うべく実験、研究を行った結果、次の
ような事実を知見した。
The inventors of the present invention have conducted experiments and research to reduce heat loss during melting of raw materials and efficiently heat and melt raw materials, and have discovered the following fact.

原料溶解時にヒータから供給すべき熱量は、原料溶解の
ための溶解熱Q、と、原料表面がらの熱輻射等で上方に
放散される熱量Quと、原料層、坩堝軸(ペデスタル)
を通じて熱伝導により下方へ放散される熱量Qt+と、
坩堝下部から熱輻射等により下方に放散される熱IQ、
2との和で与えられる。
The amount of heat that should be supplied from the heater when melting the raw material is the melting heat Q for melting the raw material, the amount of heat Q dissipated upward by heat radiation from the raw material surface, and the raw material layer and crucible axis (pedestal).
The amount of heat Qt+ dissipated downward by thermal conduction through
Heat IQ radiated downward from the lower part of the crucible by thermal radiation, etc.
It is given by the sum of 2.

ところがQzl、 Qt□は坩堝底に下部固体層を形成
維持する必要上、小さくすることが出来ず、むしろ大き
くする必要がある。またQlは溶解すべき原料量によっ
て決定される。従ってこれらとは無関係のQuが熱量低
減の可能な対象である。
However, Qzl and Qt□ cannot be made smaller because it is necessary to form and maintain a lower solid layer at the bottom of the crucible, but rather need to be made larger. Moreover, Ql is determined by the amount of raw material to be dissolved. Therefore, Qu, which is unrelated to these, is a possible target for reducing the amount of heat.

本発明はかかる知見に基づきなされたものであって、そ
の目的とすることろは原料溶解に必要な熱量を低減し、
結晶製造コストを低減し得る結晶成長装置を捉供するに
ある。
The present invention was made based on this knowledge, and its purpose is to reduce the amount of heat required for melting raw materials,
An object of the present invention is to provide a crystal growth apparatus that can reduce crystal manufacturing costs.

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係る結晶成長装置は、装入した結晶用原料を溶
解して溶融液層を形成する坩堝と、前記坩堝の溶融液層
に種結晶を浸してこれを引上げ、結晶を成長させる結晶
引上げ手段とを具備する結晶成長装置において、結晶用
原料の溶解時に坩堝上を覆うよう保持される熱遮蔽板を
具備することを特徴とする。
A crystal growth apparatus according to the present invention includes a crucible that melts charged raw materials for crystal to form a molten liquid layer, and a crystal pulling system that immerses a seed crystal in the molten liquid layer of the crucible and pulls it up to grow a crystal. The crystal growth apparatus is characterized by comprising a heat shielding plate that is held so as to cover the crucible during melting of the crystal raw material.

〔作用〕[Effect]

本発明はこれによって、原料溶解時に坩堝上方への熱の
放散が熱遮蔽板によって抑制されることとなる。
According to the present invention, the heat shield plate suppresses the dissipation of heat upward into the crucible during melting of the raw material.

〔実施例) 以下本発明をその実施例を示す図面に基づき具体的に説
明する。第1図は本発明装置の模式的縦断面図であり、
図中10は水冷されているチャンバ、11はプルチャン
バ、1は坩堝、2はヒータ、3は保温筒を示している。
[Examples] The present invention will be specifically described below based on drawings showing examples thereof. FIG. 1 is a schematic longitudinal sectional view of the device of the present invention,
In the figure, 10 is a water-cooled chamber, 11 is a pull chamber, 1 is a crucible, 2 is a heater, and 3 is a heat-insulating cylinder.

水冷されているチャンバ10の内部中央に坩堝1が配設
され、この坩堝1の周囲にヒータ2が、またこのヒータ
2の周囲に保温筒3が配設されている。チャンバ1の上
部壁には坩堝1上に面してシャッタ4にて開閉されるプ
ルチャンバ11が立設してあり、このプルチャンバ11
上から昇、降並びに回転可能な引上げ軸6が吊り下げら
れている。
A crucible 1 is disposed in the center of a water-cooled chamber 10, a heater 2 is disposed around the crucible 1, and a heat insulating cylinder 3 is disposed around the heater 2. A pull chamber 11 that faces the crucible 1 and is opened and closed by a shutter 4 is erected on the upper wall of the chamber 1.
A pulling shaft 6 that can be raised, lowered, and rotated is suspended from above.

坩堝1は、外周にグラファイト類の外層容器1aを、ま
た内側に石英製の内層容器1bを配した二重構造に構成
されており、その底部中央にはチャンバ1の底壁を貫通
させた軸1cの上端が連結され、該軸1cにて回転させ
つつ昇降せしめられるようになっている。保温筒3は熱
伝導率の低い材料、例えばカーボンファイバー成形材等
を用いて円筒形に形成されており、坩堝1、ヒータ2の
外周を囲う態様でこれらと同心状に配設されている。
The crucible 1 has a double structure with an outer layer container 1a made of graphite on the outer periphery and an inner layer container 1b made of quartz inside, and a shaft penetrating the bottom wall of the chamber 1 in the center of the bottom. The upper end of 1c is connected, and it can be raised and lowered while being rotated by the shaft 1c. The heat retaining cylinder 3 is formed into a cylindrical shape using a material with low thermal conductivity, such as a carbon fiber molded material, and is disposed concentrically with the crucible 1 and the heater 2 so as to surround their outer peripheries.

プルチャンバ4の上方から回転、昇降機構(図示せず)
に連繋された引上げ軸6の上端が導入され、その下端に
は結晶成長時には第5図に示す場合と同様にチャックに
掴持させた種結晶が吊設され、この種結晶を坩堝1内の
溶融液になじませた後、回転させつつ上昇させることに
よって、種結晶の下端にシリコンの単結晶を成長せしめ
、また原料溶解時には第1図に示す如く熱遮蔽体21が
装着されるようになっている。
Rotating and lifting mechanism (not shown) from above the pull chamber 4
The upper end of the pulling shaft 6 connected to the is introduced, and a seed crystal held by a chuck is suspended from the lower end of the pulling shaft 6 during crystal growth, as in the case shown in FIG. After being blended with the melt, a silicon single crystal is grown at the lower end of the seed crystal by raising it while rotating it, and when melting the raw material, a heat shield 21 is attached as shown in Figure 1. ing.

第2図は熱遮蔽体21の拡大断面図であり、熱遮蔽体2
1はプルチャンバ11の内径よりも若干小さい2枚のグ
ラファイト類の円板22.23間にグラファイト類のフ
ェルト24を挟んだ3層構造に形成されており、周縁部
の複数個所をグラファイト類のボルト・ナツト25を用
いて一体的に結合せしめである。このボルト・ナツト2
5にはMo製のワイヤ26の各一端が連結されており、
その各他端は治具27を介して単結晶引上げ軸6の下端
に連結せしめられ、該引上げ軸6の昇降操作によって第
1図に示す如く坩堝1の上端部直上に臨む位置とプルチ
ャンバ11内とに移動されるようになっている。治具2
7は側面視で逆子字形に形成され、支持部27a、連結
部27bを備えており、各ワイヤ26の他端は支持部2
7aに連結され、また自らは連結部27bを介して引上
げ軸6に着脱可能に吊垂されている。
FIG. 2 is an enlarged sectional view of the heat shield 21.
1 has a three-layer structure in which a graphite felt 24 is sandwiched between two graphite discs 22 and 23 that are slightly smaller than the inner diameter of the pull chamber 11, and graphite bolts are connected at multiple points around the periphery.・It is integrally connected using a nut 25. this bolt nut 2
One end of each Mo wire 26 is connected to 5,
The other ends are connected to the lower end of the single crystal pulling shaft 6 via a jig 27, and by raising and lowering the pulling shaft 6, the position facing directly above the upper end of the crucible 1 as shown in FIG. It is now being moved to Jig 2
7 is formed in an inverted letter shape when viewed from the side, and includes a support portion 27a and a connecting portion 27b, and the other end of each wire 26 is connected to the support portion 2.
7a, and is itself detachably suspended from the pulling shaft 6 via a connecting portion 27b.

熱遮蔽体21の材質、構造については特に限定するもの
ではなく、融点が高く、しかも熱伝導性の低い材料であ
れば何でもよい。
The material and structure of the heat shield 21 are not particularly limited, and any material may be used as long as it has a high melting point and low thermal conductivity.

而してこのような本発明装置にあっては、図示しない原
料供給器を通じて坩堝1内に結晶用の固体原料、例えば
高純度の多結晶シリコンを装入する。チャンバ10内の
雰囲気ガスを不活性ガス等と置換した後、ヒータ2の電
力を溶解条件に設定し、充填された固体原料の溶解を行
いつつ溶融液中に図示しない不純物供給器から不純物を
添加する。
In the apparatus of the present invention, a solid raw material for crystallization, for example, high-purity polycrystalline silicon, is charged into the crucible 1 through a raw material feeder (not shown). After replacing the atmospheric gas in the chamber 10 with an inert gas or the like, the power of the heater 2 is set to melting conditions, and while the filled solid raw material is melted, impurities are added into the melt from an impurity feeder (not shown). do.

次に引上げ軸6の下端部に治具27を介して熱遮蔽体2
1を吊垂し、プルチャンバ】1からシャッタ4を通して
チャンバ10内に下降し、坩堝1の上部を覆う態様で熱
遮蔽体21を配置する。この状態で装入した固体原料は
予め定めた初期融液率が得られる迄溶解し、溶融層りと
、その下部の固体層Sとが共存する状態に設定する。
Next, a heat shield 2 is attached to the lower end of the pulling shaft 6 via a jig 27.
1 is suspended from the pull chamber 1 and descends into the chamber 10 through the shutter 4, and a heat shield 21 is arranged so as to cover the upper part of the crucible 1. The solid raw material charged in this state is melted until a predetermined initial melt rate is obtained, and a state is set in which the molten layer and the solid layer S below it coexist.

初期溶解が終了すると、引上げ軸6を引き上げ、熱遮蔽
体21をシャッタ4を通してプルチャンバll内に引出
し、シャッタ4を閉じてプルチャンバ11を取り外し、
引上げ軸6の下端にチャックを介して種結晶を吊垂し、
これをシャッタ4を通してチャンバエ0内に垂下し、種
結晶の下端を溶融液層Sにひたした後、回転させつつ引
上げ、種結晶の下端に単結晶を成長せしめる。単結晶の
成長に伴う溶融層I5の厚さの減少はヒータ2により固
体層Sを溶融することによって補充する。
When the initial melting is completed, the pull shaft 6 is pulled up, the heat shield 21 is pulled out through the shutter 4 into the pull chamber 11, the shutter 4 is closed, and the pull chamber 11 is removed.
A seed crystal is suspended from the lower end of the pulling shaft 6 via a chuck,
This is suspended into the chamber 0 through the shutter 4, and after the lower end of the seed crystal is immersed in the melt layer S, it is pulled up while being rotated, and a single crystal is grown at the lower end of the seed crystal. The decrease in the thickness of the molten layer I5 due to the growth of the single crystal is compensated for by melting the solid layer S by the heater 2.

引上げた単結晶はシャッタ4を通してプルチャンバll
内に引き込んだ後、シャッタ4を閉じ、プルチャンバ1
1と共に取り外して別の種結晶を取り付け、前述した過
程を反復する。
The pulled single crystal passes through the shutter 4 into the pull chamber 11.
After pulling in the pull chamber 1, close the shutter 4 and close the pull chamber 1.
1 and install another seed crystal and repeat the process described above.

第3図は本発明の他の実施例を示す部分断面図であり、
この実施例では熱遮蔽体28は円板部28aとその上面
中央に突設したMo製の雨垂部28bとを備えており、
円板部28aは熱伝導性の小さい材料を用いてプルチャ
ンバ11の内径よりも若干小さい直径に設定されており
、雨垂部28bを介して引上げ軸6に着脱可能に連結せ
しめられている。
FIG. 3 is a partial sectional view showing another embodiment of the present invention,
In this embodiment, the heat shield 28 includes a disk portion 28a and a Mo raindrop portion 28b protruding from the center of its upper surface.
The disc part 28a is made of a material with low thermal conductivity and has a diameter slightly smaller than the inner diameter of the pull chamber 11, and is removably connected to the pulling shaft 6 via the raindrop part 28b.

他の構成及び作用は実質的に第1回に示す実施例と同じ
であり、対応する部分には同じ番号を付して説明を省略
する。このような実施例にあっては第1,2図に示す実
施例に比較して構成が簡略化される利点がある。
The other configurations and operations are substantially the same as the embodiment shown in the first part, and corresponding parts are given the same numbers and explanations are omitted. Such an embodiment has the advantage that the configuration is simplified compared to the embodiments shown in FIGS. 1 and 2.

次に本発明装置と従来装置とを用いた比較試験結果につ
いて説明する。試験は表1に示す如き寸法諸元の溶融層
法用坩堝において、熱遮蔽体を使用した場合と使用しな
い場合とについてその消費電力及び溶解時間を測定した
。結果は表2に示す通りである。
Next, the results of a comparative test using the device of the present invention and a conventional device will be explained. In the test, power consumption and melting time were measured in a crucible for molten layer method having the dimensions shown in Table 1, with and without a heat shield. The results are shown in Table 2.

表   1 表 表2から明らかなように本発明装置に依った場合にはヒ
ータ電力(kW)、溶解時間が共に大幅に低減されてい
ることが解る。なお上述の実施例は溶融層法を用いる結
晶成長装置に適用した場合について説明したが、CZ法
を用いる結晶成長装置その他の結晶成長装置にも適用し
得ることは勿論である。また熱遮蔽体21.28は単結
晶引上げ軸6に雨垂する構成について説明したが、何ら
これに限らず他のワイヤ等を用いてもよい。
As is clear from Table 1 and Table 2, both the heater power (kW) and the melting time are significantly reduced when the apparatus of the present invention is used. Although the above-described embodiments have been described with reference to the case where the present invention is applied to a crystal growth apparatus using the fused layer method, it goes without saying that the present invention can also be applied to a crystal growth apparatus using the CZ method and other crystal growth apparatuses. Although the heat shields 21 and 28 have been described as having a structure in which they are dripped onto the single crystal pulling shaft 6, the present invention is not limited thereto, and other wires or the like may be used.

〔効果〕〔effect〕

以上の如く本発明装置にあっては原料溶解時における坩
堝上方への熱放散を抑制して熱損失を低減出来、熱効率
の大幅な向上が図れ、溶解時間も短縮されて結晶成長の
能率向上も図れる等本発明は優れた効果を奏するもので
ある。
As described above, the apparatus of the present invention can suppress heat dissipation upwards in the crucible during raw material melting, thereby reducing heat loss, greatly improving thermal efficiency, shortening melting time, and improving crystal growth efficiency. The present invention has excellent effects such as:

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明装置の原料溶解時の状態を示す模式的縦
断面図、第2図は熱遮蔽体の拡大断面図、第3図は本発
明の他の実施例を示す模式的部分断面図、第4.5図は
一般的なCZ法、溶融層法の実施状態を示す模式的縦断
面図、第6図は溶融層法を用いた従来の結晶成長装置に
おける原料溶解時の状態を示す模式的縦断面図である。 1・・・坩堝 2・・・ヒータ 3・・・保温筒 4・
・・シャッタ 10・・・チャンバ 11・・・プルチ
ャンバ 21.28・・・熱遮蔽体
FIG. 1 is a schematic vertical cross-sectional view showing the state of the apparatus of the present invention during raw material melting, FIG. 2 is an enlarged cross-sectional view of the heat shield, and FIG. 3 is a schematic partial cross-sectional view showing another embodiment of the present invention. Figure 4.5 is a schematic vertical cross-sectional view showing the implementation state of the general CZ method and fused layer method, and Figure 6 shows the state of raw material melting in a conventional crystal growth apparatus using the fused layer method. FIG. 1... Crucible 2... Heater 3... Heat insulation tube 4.
...Shutter 10...Chamber 11...Pull chamber 21.28...Heat shield

Claims (1)

【特許請求の範囲】 1、装入した結晶用原料を溶解して溶融液層を形成する
坩堝と、前記坩堝の溶融液層に種結晶を浸してこれを引
上げ、結晶を成長させる結晶引上げ手段とを具備する結
晶成長装置において、 結晶用原料の溶解時に坩堝上を覆うよう保 持される熱遮蔽板を具備することを特徴とする結晶成長
装置。
[Scope of Claims] 1. A crucible that melts charged crystal raw materials to form a molten liquid layer, and a crystal pulling means that immerses a seed crystal in the molten liquid layer of the crucible and pulls it up to grow the crystal. A crystal growth apparatus comprising: a heat shield plate held to cover a crucible during melting of a crystal raw material.
JP1334101A 1989-12-21 1989-12-21 Crystal growing device Pending JPH03193694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1334101A JPH03193694A (en) 1989-12-21 1989-12-21 Crystal growing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1334101A JPH03193694A (en) 1989-12-21 1989-12-21 Crystal growing device

Publications (1)

Publication Number Publication Date
JPH03193694A true JPH03193694A (en) 1991-08-23

Family

ID=18273538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1334101A Pending JPH03193694A (en) 1989-12-21 1989-12-21 Crystal growing device

Country Status (1)

Country Link
JP (1) JPH03193694A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814148A (en) * 1996-02-01 1998-09-29 Memc Electronic Materials, Inc. Method for preparing molten silicon melt from polycrystalline silicon charge
EP0921213A1 (en) * 1997-12-02 1999-06-09 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Process and apparatus for melting semiconductor material
JP2008297186A (en) * 2007-06-04 2008-12-11 Covalent Materials Corp Crucible handling device and crucible replacement method
WO2017012733A1 (en) * 2015-07-17 2017-01-26 Siltronic Ag Method for melting solid silicon
JP2023539379A (en) * 2020-09-01 2023-09-13 グローバルウェーハズ カンパニー リミテッド Crystal pulling system having a cover member for covering a silicon filling and method for growing a silicon melt in a crucible assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02283693A (en) * 1989-04-26 1990-11-21 Nkk Corp Method and device for preparing silicon single crystal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02283693A (en) * 1989-04-26 1990-11-21 Nkk Corp Method and device for preparing silicon single crystal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814148A (en) * 1996-02-01 1998-09-29 Memc Electronic Materials, Inc. Method for preparing molten silicon melt from polycrystalline silicon charge
EP0921213A1 (en) * 1997-12-02 1999-06-09 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Process and apparatus for melting semiconductor material
US6171395B1 (en) 1997-12-02 2001-01-09 Wacker Siltronic Gesellschaft f{umlaut over (u)}r Halbleitermaterialien AG Process and heating device for melting semiconductor material
JP2008297186A (en) * 2007-06-04 2008-12-11 Covalent Materials Corp Crucible handling device and crucible replacement method
WO2017012733A1 (en) * 2015-07-17 2017-01-26 Siltronic Ag Method for melting solid silicon
JP2023539379A (en) * 2020-09-01 2023-09-13 グローバルウェーハズ カンパニー リミテッド Crystal pulling system having a cover member for covering a silicon filling and method for growing a silicon melt in a crucible assembly

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