JPH03195079A - Flexible circuit board substrate and manufacture of flexible circuit board - Google Patents

Abstract

PURPOSE:To maintain high rigidity of a flexible wiring part while electronic component are mounted by a method wherein a wiring board substrate from which required wiring parts are not yet punched out and a reinforcing board substrate from which required reinforcing parts are not yet punched out are bonded to each other. CONSTITUTION:A wiring board substrate 23 which is composed of flexible wiring part 2 having required wiring patterns 12 and excessive parts 25 which are connected to each other and a reinforcing board substrate 29 which is composed of reinforcing parts 15-17 corresponding to the regions of the flexible wiring parts 2 to be reinforced and excessive parts 32 which are connected to each other are bonded together. Therefore, the respective excessive parts 25 and 32 are unified and the regions to be reinforced and the reinforcing parts 15-17 are unified. With this constitution, the rigidity of the flexible wiring parts 2 is apparently increased, so that electronic components can be stably mounted regardless of manual mounting or automatic mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION The flexible circuit board base material and the method for manufacturing a flexible circuit board of the present invention will be explained in detail according to the following items.

AJJ Field of industrial application B9 Summary of the invention C9 Prior art [Figure 4] a. General background, conventional manufacturing method [Figure 4] D9 Problem to be solved by the invention [Figure 4] E, 1JI
Means F for solving iFI, Example [Figs. 1 to 3] a. Flexible circuit board [Fig. 1 (D), Fig. 3 a-1, flexible wiring board a-2, reinforcing plate , Electronic components, Flexible circuit board manufacturing method [Figures 1 to 3
Figure] b-1, Wiring board base material and its formation -2, Reinforcement board base material and its formation -3, Bonding of wiring board base material and reinforcing board base material b-4, Mounting of electronic components [ FIG. 1(C)] b-5, Cutting of connecting portion Each surplus part of the reinforcing plate base material to be punched out,
That is, by using the remaining parts of the flexible wiring board and the reinforcing plate after being punched out, the rigidity of the flexible wiring board can be increased at least until the mounting of electronic components is completed. Thereby, it is an object of the present invention to provide a new flexible circuit board base material and a method for manufacturing a flexible circuit board, which make it possible to easily manufacture this type of circuit board and reduce manufacturing costs.

(A. Industrial Application Field) The present invention relates to a novel flexible circuit board and a method for manufacturing the flexible circuit board. In detail, the required electronic components are mounted on a flexible wiring board provided with the required conductor pattern, and the flexible circuit board base material (B , Summary of the Invention) The flexible circuit board base material of the present invention is obtained by pasting together a wiring board base material before the required wiring parts are punched out and a reinforcing board base material before the required reinforcement parts are punched out, Also,
In the method for manufacturing a flexible circuit board of the present invention, after bonding a wiring board base material and a reinforcing board base material and mounting electronic components in the component mounting area of the flexible wiring section, the surplus portion is removed. By doing this, the rigidity of the flexible wiring section can be increased at least until the electronic components are mounted, without temporarily fixing the flexible wiring section to a special jig. The circuit board can be manufactured easily and manufacturing costs can be reduced.

(C, Prior Art) [Figure 4] (a, General Background) At first, flexible wiring boards, which were made by providing a conductor pattern on a flexible synthetic resin film, were used to connect two or more circuits. It was often used only as a substitute for wire for connection, but today it is being made to have a plug-in connector function by increasing the rigidity of the area where the connection ends of the conductor pattern are gathered. Furthermore, electronic components are mounted to provide predetermined operational functions, and in particular, flexible wiring boards used in electronic devices are increasingly being used in this way.

When electronic components are mounted on a flexible wiring board, it is generally made into a so-called rigid-flex structure, that is, a reinforcing plate is attached to a specific part of the flexible wiring board, for example, the component mounting area. Rigidity is ensured, and electronic components are usually mounted after such reinforcing plates are bonded.

Note that many of the electronic components used in this type of flexible circuit board are of the so-called surface mount type, such as chip-type general electronic components and flat package-type ICs.

(b. Conventional manufacturing method) [Fig. 4] By the way, although reinforcing plates are attached to such flexible circuit boards in areas that require reinforcement such as the component mounting area, the overall shape retention strength is poor. Conventionally, when mounting electronic components, especially when using an automatic electronic component mounting machine, the flexible wiring board is temporarily fixed to a rigid plate-shaped jig. .

FIG. 4 shows an example of a conventional method for manufacturing a flexible circuit board using such a jig.

In the same figure, a is a flexible wiring board on which a predetermined conductor pattern (not shown) is formed, b and C are component mounting areas of the flexible wiring board a, and preliminary solder is applied to the terminal part of the conductor pattern. Or solder paste is applied. d and e are reinforcing plates made of an insulating material and have approximately the same external shape as the component mounting areas I and C; Mounting hole f%f1...
However, the reinforcing plates d and e have the above-mentioned mounting holes f, f,...
Through holes g%g1, . . . are formed at positions corresponding to . h is a jig plate.

Therefore, first, reinforcing plates d and e are bonded to the back surfaces of the component mounting areas S and C of the flexible wiring board a, that is, the surface opposite to the surface on which electronic components are mounted (the state shown in FIG. 3B). Next, the flexible wiring board a to which the reinforcing plates d and e have been adhered in this way is temporarily fixed to a jig board (see Figure (C)
), this jig plate has an outer shape that can be mounted on a predetermined automatic electronic component mounting machine, and has a positioning hole i for positioning in the automatic mounting machine.

A screw hole (not shown) is formed in i, and the flexible wiring board a can be temporarily fixed using screws inserted through the mounting holes f, f, ... and the insertion holes g, g, ... of the reinforcing plates d, e. j, j,
This is done by screwing ... into a screw hole (not shown) in the jig plate.

Then, the jig plate to which the flexible wiring board a is temporarily fixed is mounted on an automatic electronic component mounting machine, and the required electronic components are mounted on the component mounting areas C and C. Since the flexible wiring board a is fixed to the jig board, mounting of electronic components and heating and melting of preliminary solder and solder paste, etc., which are performed for processing such as finishing work, can be carried out stably.

After the electronic components have been installed in this way,
By removing screws Cj, ..., flexible wiring board a is removed from the jig board.

Then, a rigid-flex type is formed by a flexible wiring board a on which a predetermined conductor pattern is formed, reinforcing plates d and e bonded to the component mounting areas S and C, and electronic components (not shown) mounted on the component mounting area b1C. A flexible circuit board k is manufactured.

Since the jig board must be formed in the same positional relationship as that of the flexible wiring board a, the jig plate is usually dedicated to the flexible wiring board a, and in addition, the reinforcing plate d%e is used as the component mounting area, c It is difficult to achieve accurate alignment between these reinforcing plates d and e and component mounting areas s and c when pasting them on the parts, and in order to achieve this accuracy, a special jig for alignment is required. There is a problem in that these factors increase the production cost of the flexible circuit board.

(D. Problem to be Solved by the Invention) [Figure 4] However, in this method of manufacturing a flexible circuit board, when the flexible wiring board a is not fixed to the jig board, the thickness direction Since the shape of the reinforcing plate d%e is not fixed, the pasting of the reinforcing plate d%e, temporary fixing to and removal from the jig plate, etc., must all be done manually, resulting in a problem of extremely poor production efficiency. Also, the screw hole on the jig board is the mounting hole f% fl of the flexible wiring board a.
(Means for solving E, ill!l!) Therefore, in order to solve the above-mentioned problems, the flexible circuit board material of the present invention has a flexible wiring portion provided with a required conductor pattern and a surplus portion. This is a product in which the original wiring board material, in which the parts remain connected, and the original material for the reinforcing board, in which the reinforcing portions corresponding to the areas requiring reinforcement of the flexible wiring part and the surplus portions remain connected, are bonded together.

Therefore, in the flexible circuit board base material of the present invention, the wiring board base material and the reinforcing board base material are bonded together, so that the surplus parts and the areas requiring reinforcement and the reinforcement parts are integrated, respectively. The apparent rigidity of the flexible wiring section makes it possible to mount electronic components extremely stably, whether by hand or by an automatic mounting machine.In other words, it is possible to mount electronic components onto rigid printed wiring boards. This makes it possible to eliminate the need for jigs conventionally used to mount electronic components, thereby reducing production costs. Surplus parts of the wiring board base material and the reinforcing board base material are normally generated as necessary during the manufacturing process when obtaining the required flexible wiring parts and reinforcement parts, so the materials of the wiring board base material and the reinforcing base material are It will not increase.

Further, the method for manufacturing a flexible circuit board of the present invention includes forming a wiring board base material in which a flexible wiring portion provided with a required conductor pattern and a surplus portion are connected via a connecting portion,
A reinforcing plate base material is formed in which a reinforcing part having a shape corresponding to the reinforcement required area of the flexible wiring part and the surplus part are connected via a connecting part, and the wiring board base material and the reinforcing board base material are bonded together. Next, electronic components are mounted on the component mounting area of the flexible wiring section, and finally, the excess portion is cut off at the connecting section.

Therefore, according to the method for manufacturing a flexible circuit board of the present invention, when the wiring board base material and the reinforcing board base material are bonded together, the surplus parts of these parts and the reinforcement required area and the reinforcement part are different from each other. Integration increases the apparent rigidity of the flexible wiring section, making it easier to mount electronic components in the same way as with rigid printed wiring boards, and in particular, to automatically mount electronic components using automatic mounting machines. It is possible to reduce production costs, and
Surplus parts of the base wiring board material and the base material of the reinforcing board are normally generated as a result of material selection when obtaining the required flexible wiring section and reinforcement section. There is no need for an increase in the number of base materials used for the board.

(F. Embodiment) [Figures 1 to 's3] Below the figures, details of the flexible circuit board base material and the method for manufacturing the flexible circuit board of the present invention will be explained according to the illustrated embodiments.

(a Flexible circuit board) [Figure 1 (D), 3
Number 1 in the figure is a flexible circuit board.

(a-1, Flexible Wiring Board) 2 is a flexible wiring board that forms the main part of the flexible circuit board 1, and the flexible wiring board 2 has first and second strip portions 3.4 that extend side by side with each other. and a third strip 5 in which one end of each of these strips 3.4 is continuous and long in a direction perpendicular to the longitudinal direction of the strip 3.4, and a first strip 3.
Three component mounting portions 6.7.8, first, 's2, and third, located on the opposite side of the second strip portion 4 with the second strip portion 4 in between and arranged in a direction substantially parallel to the longitudinal direction of the strip portion 3. and a narrow continuous part 9.9 that is continuous between these component mounting parts 6.7.8,
. . , and a protruding portion 10 protruding laterally from a position near the other end of the first strip portion 3, and three component mounting portions 6.
7. In the first component mounting section 6, which is the narrowest in 8, one end of the side edge facing the strip section 5 of M3 is continuous with the other end of the first strip section 3, and the remaining components are The mounting portion 8 is connected to the component mounting portion 6 of 341 via one or more continuous portions 9.9, . . . .

The flexible wiring board 2 consists mostly of a base film 11 and a conductor pattern 12 made of copper attached to one surface of the base film 11, as shown in Figures 2 and 3. .12, . . . and conductor patterns 12.12, . . . on one side of the base film 11.
The base film 13 is made of a synthetic resin such as polyester or polyimide, and the conductor patterns 12, 12, . . . For example, the overlay film 1 may be formed into a desired pattern by a known plating transfer method or etching method.
3 is bonded to the base film 11 after punching required terminal exposure holes.

Note that the conductor patterns 12.12, . . . are terminal portions 12a112a, .
The second strip portion 4 is formed into a required wiring pattern with a ground pattern, most of which is formed into a ground pattern,
The remaining portions are formed into a large number of line patterns extending parallel to each other, and the connecting ends of such conductive patterns 12, 12, . The part connected to (
In FIG. 1, only the connection ends of the conductor patterns 12, 12, . . . are shown. ) is one end 5a (
(hereinafter referred to as the "connector section") and the first component mounting section 6
The side edge 6a of the second strip 4 side (hereinafter referred to as the "connection end") and the side edge 10a of the protrusion 10 facing the second strip 4 (hereinafter referred to as "the connection end") The connecting end portions (hereinafter referred to as “connecting ends”) are collected separately and exposed without being covered by the overlay film 13.

14.14, . . . are attachment holes formed in the component mounting portion 6.7.8 and the other end of the second strip portion 4.

(a-2, reinforcing plate, electronic component) 15, 16 and 17 are reinforcing plates, for example, they are made of synthetic resin such as epoxy resin and are used to connect the three component mounting parts 6.
．． The insertion holes 1 are formed to have the same outer shape as those of the parts mounting portions 6.7 and 8, respectively, and are located at positions corresponding to the mounting holes 14, 14, and 14 formed in the component mounting portions 6.7 and 8, respectively.
8.18,... are formed.

Such reinforcing plates 15, 16 and 17 are coated with adhesives 19, 19, ... (
(see FIGS. 2 and 3), so that the flexible wiring board 2 has high rigidity only at its component mounting portions 6, 7 and 8.

Then, on the surfaces of the component mounting parts 6.7 and 8, chip components 20, 20, such as chip-type resistors and capacitors,...
and flat package type ICs 21, 21, etc. are installed, and these electronic components 2
0.20, . . . and 21.21, . . . are terminal portions 12a.

The terminal portions 20a, 20a, 12a, .
... 21a, 21a, . . . (see FIG. 3) are soldered to the terminal portions 12a, 12a, .

Thus, the flexible wiring board 2 provided with the required conductor pattern and the component mounting portion 6 of the flexible wiring board 2.
Reinforcing plates 15, 16, 17 attached to the back surfaces of 7 and 8 and electronic components 20 attached to the surface of component mounting section 6.7.8
．． 20, . . . 21, 21, . . . constitute a rigid-flex type flexible circuit board 1 having predetermined operational functions.

Incidentally, such a flexible circuit board 1 has, for example, three component mounting parts 6 to which reinforcing plates 15, 16, and 17 are attached.
．． 7 and 8 are fixed to the chassis or case, and the fixation is as follows:
This is done by screws inserted through the mounting holes 14.14, . . . and the insertion holes 18.18, .

(b. Method for manufacturing a flexible circuit board) [FIGS. 1 to 3] Next, a method for manufacturing a flexible circuit board of the present invention will be described as a method for manufacturing the above-described flexible circuit board 1.

(b-1, Wiring board base material and its formation) 23 is a wiring board base material that is the base material of the flexible wiring board 2.

Incidentally, among the parts of this wiring board base material 23, the same parts as the flexible wiring board 2 and each part thereof are given the same reference numerals as the same parts in the flexible wiring board 2.

The wiring board base material 23 has a substantially rectangular outer shape, and its entirety is made up of at least the base film 11 and the overlay film 13 pasted together.
By providing ,..., the entire flexible wiring section 2 is divided into the flexible wiring section 2 (in FIG. 1(A), it has a satin pattern or diagonal lines) and the remaining outer circumferential section 25 having a substantially frame shape. be done. These flexible wiring portions 2 and outer peripheral portion 25
are connected to each other by a total of seven connecting portions 26, 26, .

The flexible wiring section 2 is connected to 'i41' to the third 3
The continuous parts 9.9, . a protrusion 10 protruding from the first strip 3, and a third strip 5;
, a part of the side edge of the third component mounting area 8 on the anti-strip part 3 side, and three side edges of the first component mounting area 6. 4 of them and the second strip 4
The center part of the other edge is the connecting part 26, 26, . . .
The second component mounting area 7, the first component mounting area 6, and the third component mounting area 8 are connected to the outer peripheral part 25 through They are connected by a wide temporary connection part 27.27.

Note that the conductor patterns 12, 12, . . . are provided only in such a flexible wiring section 2.

Reference numerals 28 and 28' are positioning holes formed at both ends of one side edge extending along the longitudinal direction of the wiring root material 23 in the outer peripheral part 25, and these positioning holes 28 and 28' are This is for positioning when installing.

The wiring root material 23 is formed by, for example, a known plating method or etching method. That is, in the case of the plating method, the metal belt serving as the base material for forming the copper foil is sequentially run through a resist application process, an ultraviolet irradiation process, a plating process, a resist removal process, etc. An ultraviolet curable plating resist is applied outside the conductor pattern formation area by screen printing or the like, the plating resist is cured in an ultraviolet irradiation process, and then copper plating is applied to the conductor pattern formation area in the plating process, followed by a resist removal process. In this way, the plating resist is removed, and the required conductor pattern 12 made of the plating copper foil is thus formed.
12,... is formed on the metal belt, and on the other hand, a heat-pressure activated adhesive in the form of a long roll film is used in the travel path of the metal belt before the resist removal step. The conductor patterns 12, 12, . Next, the overlay film 13, in which the required terminal exposure holes etc. have been formed in advance, is attached to the conductor pattern 12, 12,
The base film 11 and the overlay film 13 are stacked on the side where the conductor patterns 12, 12, . . . Using a punching press etc.,
Cutting grooves 24, 24, ..., mounting holes 14, 14, ..., and positioning holes 28, 28' are punched out, and at the same time, the wiring root material 23 is formed by cutting to form an external shape of a predetermined size. be done.

In addition, when using the etching method, the base film 11
A copper foil such as rolled copper foil is bonded in advance to the entire area of one surface to form a copper clad film, and the copper clad film is passed through a resist application process, an ultraviolet irradiation process, an etching process, and a resist removal process in sequence. While running the copper foil, an etching resist is applied to a portion of the copper foil forming a required conductor pattern in a resist application step, the etching resist is hardened in an ultraviolet irradiation step, and then the copper foil is etched in an etching step, Thereafter, in a resist removal process, the etching resist is removed, and in this way, the required conductor patterns 12, 12, ... tubes are formed on the base film 11.
The overlay film 13 is adhered to the side on which the conductor patterns 12, 12, .

Incidentally, the outer shape of such wiring board base material 23 is made to be the same as the outer shape of the reinforcing plate base material, which will be described later.

(b-2, Reinforcing plate base material and its formation) 29 is a reinforcing plate base material forming the base material of the reinforcing plates 15, 16 and 17.

In addition, among the parts of this reinforcing plate base material 29, reinforcing plates 15 and 16
and 17 are given the same reference numerals.

The reinforcing plate base material 29 is formed of synthetic resin such as epoxy resin into a substantially rectangular plate shape, and its outer shape and size are such that it can be mounted on an automatic electronic component mounting machine to be described later.

Then, three reinforcing parts 15, 16 and 17 are arranged in the longitudinal direction of the reinforcing plate base material 29 in a part of the reinforcing plate base material 29 that is biased toward the negative corner side. It is formed by forming cut grooves 30, 30, . . . in the shape of
have the same external shape as the component mounting areas 6.7 and 8 of the wiring board base material 230, respectively, and two reinforcing parts 15. are located on both sides of the central reinforcing part 16 with the reinforcing part 16 in between.
17 is the surplus part 32, via the connecting parts 31, 31, .
That is, it is connected to the parts of the reinforcing plate base material 29 other than the reinforcing parts 15, 16, and 17, and the central reinforcing part 16 and the reinforcing parts 15.17 on both sides are connected via the temporary connecting parts 33.33. ing.

The connecting portions 31, 31, . . . are the component mounting areas 6 of the connecting portions 26, 26, .
．． The temporary connecting portions 33.33 are provided at positions corresponding to the temporary connecting portions 27.27 on the wiring board base material 23, respectively. ing.

34.34 and 35.35 are long holes, and long holes 34.3
41, grooves 24, 24, and 24 formed in the wiring board base material 23,
... are formed at positions corresponding to the parts on both sides of the connecting part 26 that connects the strip part 5 and the outer peripheral part 25 of 'fS3, and the long holes 35 and 35 are formed in the kerf 24. .24
, . . . are formed at positions corresponding to the portions on both sides of the second strip portion 4 with the connecting portion 26 continuous therebetween. And, between these long holes 34 and 34 and 3
Auxiliary connecting parts 32a and 32b are formed between 5 and 35, and connecting parts 2 corresponding to these auxiliary connecting parts 32a and 32b
6.26 can be easily separated.

36 and 36' are positioning holes, and these positioning holes 3
6.36' is formed at both ends of one side edge extending along the longitudinal direction of the compensating board material 29 of the outer circumferential portion 32a of the surplus portion 32, that is, in the wiring board material 23, and the positioning hole 28. 28
′ and are formed at positions corresponding to each other.

The reinforcing plate base material 29 is formed, for example, by punching an epoxy resin plate with a thickness of about 0.5 mm using a punching die.

(b-3, Bonding of wiring board base material and reinforcing board base material) Therefore, after forming the wiring board base material 23 and the reinforcing board base material 29 in this way, the wiring board base material 23 and the reinforcing base material 29 are bonded together. Paste them together.

This bonding is performed, for example, by applying an adhesive to the reinforcing plate base material 29, and then overlapping the wiring board base material 23 and the reinforcing plate base material 29 and applying pressure.

That is, the satin finish 19 attached to the reinforcing plate base material 29 in FIG. 1(A) is an adhesive (indicated by dashed diagonal lines in FIG. 1(B)), and this adhesive 19 is applied to the reinforcing plate base material 29. The outer peripheral part 32c of the surplus part 32 on one side of the original material 29 and the reinforcing part 1
5.16.1, connecting portions 31.31, ..., temporary connecting portions 33.33, portions along the side edges of the outer peripheral portions 32c of the long holes 34.34 and 35.35, and auxiliary connecting portions 32a,
It is applied to 32b.

Note that the application of the adhesive 19 to the reinforcing base material 29 is performed, for example, by
It is preferable to do this by screen printing or the like.

After applying the adhesive 19 to the reinforcing root material 29, the wiring root material 23 and the reinforcing root material 29 are bonded together.

This bonding is carried out through the two positioning holes 28 and 28' of the wiring root material 23 and the two positioning holes 36 of the reinforcing root material 29.
．． This is carried out by overlapping the wiring root material 23 and the reinforcing root material 29 while aligning the wiring root material 23 and the reinforcing root material 29 with 36', and applying pressure and heat using a press or the like. Note that the wiring root material 23 and the reinforcing root material 29 may be pasted together using double-sided adhesive tape.

Therefore, as shown in FIG. 1(B), the wiring root material 23
and the respective outer peripheral parts 25 and 32c of the reinforcing root material 29, the component mounting area 6.7.8 and the reinforcing part 15.16.17, the connecting part 26.26, ... and the connecting part 31.31, ...and the auxiliary connecting parts 32a, 32b, and the temporary continuous part 27
．． 27 and the temporary connecting portions 33.33 are glued together, and the two positioning holes 28.28' of the wiring root material 23 are glued together.
and the two positioning holes 36 and 36' of the reinforcing root material 29 are aligned with each other, and in this state, the wiring root material 2
3 apparently has the same rigidity as that of the reinforcing root material 29.

The integrated product consisting of the wiring base material 23 and the reinforcing base material 29 bonded together in this manner is referred to as a "substrate base material", and reference numeral 37 is used for this.

(b-4, Mounting electronic components) [Figure 1 (C)] Next,
The substrate base material 37 is mounted on an electronic component automatic mounting machine, and the electronic components 20, 20, . . . , 21, 21, . . . are mounted.

That is, 38 is an electronic component automatic mounting machine (only a part is shown in the drawing), 39 and 39 are guide rails, 40 is a component mounting head (only the tip is shown in the drawing), and the board The raw material 37 is slidably engaged with the guide rails 39.39 at both side edges thereof extending along the longitudinal direction, and is transported on the guide rails 39.39, and when it reaches the component mounting position, its positioning hole 28 and 36 and 28' and 36'
The positioning pins 41 and 41 are inserted into each of the parts separately to position them in the automatic mounting machine 38, and in this state, the component mounting head 40 moves the component mounting area 6 of the wiring root material 23.
．． 7.8 electronic parts 20.20. ...and 21.
21, etc. are loaded.

In addition, electronic parts 20.20, ... and 21.21, ...
・Terminal parts 20a, 20a, ... and 21a, etc.
21a, . . . are solder 22, 22, . . . applied in advance to the terminals 12a, 12a, . The terminal portion 12a is
112a, . . . are soldered.

(b-5, Cutting the connection part) After the mounting and soldering of the electronic components 20.20, . . . and 21.21, . While the root material 29 remains attached, the connecting portions 26, 26, . . . , and 31.
31, . . . and the auxiliary connecting portions 32a, 32b, and the temporary connecting portions 27.27 and 33.33 are cut.

This cutting is performed by cutting off the entire connecting portion or by cutting a portion where the connecting portion and the flexible wiring portion 2 are continuous.

As a result, the board base material 37 is separated into the flexible wiring section 2 to which only the reinforcing sections 15, 16, and 17 of the reinforcing base material 29 are connected, and the remaining portions.

Therefore, the flexible circuit board 1 shown in FIG.
, that is, the flexible wiring portion 2 and its component mounting area 6.7 in which the required conductor patterns 12.12, . . . are formed.
．． Electronic components 20.20,...21.
21, . . . and the reinforcing plate 5.16.17 attached to the component mounting area 6.7.8, a rigid-flex type flexible circuit board 1 is formed.

In the embodiment shown above, the notches 30, 30, and 30 necessary for forming the reinforcing plates 15, 16, 17, etc. are formed in the reinforcing plate top member 29.
...and only the long holes 34, 34, 35, 35 were formed and the entire remaining part was left as the surplus part 32, but
In some cases, the outer peripheral portion 32 described above as the surplus portion may be
It is also possible to leave only c.

(G. Effects of the Invention) As is clear from the above description, the flexible circuit board top material of the present invention has a wiring board base in which the flexible wiring portion provided with the required conductor pattern and the surplus portion remain connected. The present invention is characterized in that the reinforcing plate top material is bonded to the reinforcing portion corresponding to the reinforcement required area of the flexible wiring portion and the reinforcing plate top material in which the surplus portion remains connected.

Therefore, in the flexible circuit board top material of the present invention, the wiring board base material and the reinforcing plate top material are bonded together, so that the surplus parts are integrated with each other, and the reinforcement required area and the reinforcement part are integrated. This increases the apparent rigidity of the flexible wiring section, making it possible to mount electronic components extremely stably, whether by hand or using an automatic mounting machine. This makes it possible to eliminate the need for jigs conventionally used to mount electronic components, thereby reducing production costs. Surplus parts of the base material of the wiring board and the top material of the reinforcing plate are normally generated as necessary during the manufacturing process when obtaining the required flexible wiring parts and reinforcement parts, so the materials of the base material of the wiring board and the top material to be reinforced are It will not increase.

In addition, in the method for manufacturing a flexible circuit board of the present invention, a wiring board base material is formed in which a flexible wiring portion provided with a required conductor pattern and a surplus portion are connected via a connecting portion, and reinforcement of the flexible wiring portion is required. A reinforcing plate top material is formed by connecting a reinforcing part with a shape corresponding to the area through a surplus part or a connecting part, the wiring board base material and the reinforcing plate top material are bonded together, and then the parts of the flexible wiring part are formed. The device is characterized in that electronic components are mounted in the mounting area, and the excess portion is finally cut off at the connecting portion.

Therefore, according to the method for manufacturing a flexible circuit board of the present invention, when the wiring board base material and the reinforcing plate top material are bonded together, the surplus parts of these parts are bonded to each other, and the areas requiring reinforcement and the reinforcing parts are Integration increases the apparent rigidity of the flexible wiring section, making it easier to mount electronic components in the same way as with rigid printed wiring boards, and in particular, to automatically mount electronic components using automatic mounting machines. It is possible to reduce production costs, and
Surplus parts of the base material of the wiring board and the top material of the reinforcing plate are normally generated as a result of material selection when obtaining the required flexible wiring section and reinforcement section. There is no need for an increase in the number of materials used for the top plate.

In the above embodiment, all surface-mounted electronic components were used, but the electronic components used in the present invention may be so-called insertion-mounted electronic components such as lead components. In this case, it is preferable to punch the lead insertion holes after bonding the wiring board base material and the reinforcing plate top material together.

The shape of the flexible wiring section, the shape of the reinforcing plate, the meaning of the area requiring reinforcement, the position and number of connecting parts in the base material of the wiring board and the top material of the reinforcing plate, etc. shown in the above embodiments are determined according to the present invention. It goes without saying that the technical scope of the present invention should not be construed as being limited by these shapes, etc., and these are merely examples.

[Brief explanation of drawings]

Figures 1 to 3 show an example of the implementation of the flexible circuit board top material and the method for manufacturing the flexible circuit board of the present invention, and Figure 1 shows the manufacturing process of the flexible circuit board from (A) to (D). FIG. 2 is a cross-sectional view taken along line II-II of FIG. )'s II summer-
Figure 4 is a cross-sectional view taken along line III and showing an enlarged view of the main parts.
It is a perspective view shown sequentially from (C). Explanation of symbols 1...Flexible circuit board, 2...Flexible wiring section, 6.7.8...Reinforcement required area, 12...Conductor pattern, 15.16.17...Reinforcement section, 20 .21... Electronic component, 23... Wiring board base material, 25... Surplus part (of wiring board base material), 26... Connecting part (of wiring board base material), 29... Reinforcement Board base material, 31.32a, 32b... (reinforcing board base material) connection part,
32... Surplus portion (of the reinforcing plate base material), flexible circuit board top material (Figure A) Figure CB) 50

Claims (2)

[Claims] (1) The wiring board base material with the flexible wiring part provided with the required conductor pattern and the surplus part still connected, and the reinforcing part corresponding to the reinforcement required area of the flexible wiring part with the surplus part still connected. A flexible circuit board base material characterized by laminating a reinforcing plate base material. (2) The flexible wiring section provided with the required conductor pattern and the surplus section form a wiring board base material connected via a connecting section, and the reinforcing section has a shape corresponding to the area requiring reinforcement of the flexible wiring section. and the surplus portion are connected via a connecting portion to form a reinforcing plate base material, the wiring board base material and the reinforcing plate base material are bonded together, and then electronic components are mounted in the component mounting area of the flexible wiring section. , Finally, a method for manufacturing a flexible circuit board, characterized in that the surplus portion is cut at the connecting portion.