JPH03196626A - Semiconductor wafer cleaning equipment - Google Patents

Abstract

PURPOSE:To prevent dust from adhering to the semiconductor cleaner already cleaned so as to improve cleaning effect by providing the outlet of a cleaning room with an electrode, and neutralizing the static electricity generated in the semiconductor wafer already cleaned. CONSTITUTION:In a cleaning room 12, a semiconductor wafer M is cleaned and dried by supplying cleaning water (for example, pure water or aerated water) from a cleaning water supply pipe 12A while sucking and holding it with a rotary holder 12B and rotating it in the arrow X direction. The semiconductor wafer M* cleaned in the cleaning room 12 is given to a transfer guide 13A. Since an electrode 14 is arranged at the outlet of this cleaning room 12, the cleaned semiconductor wafer M* is cleared of static electricity. Hereby, it can prevent dust from adhering to the cleaned semiconductor wafer, and the cleaning effect can be maintained surely.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention provides a semiconductor wafer received from a loader, which is rotated in a cleaning chamber, cleaned with cleaning water, dried, and then sent to an unloader. In this semiconductor wafer cleaning apparatus, in particular, an electrode is disposed at the outlet of the cleaning chamber to neutralize static electricity generated in the cleaned semiconductor wafer.

[Prior Art] Conventionally, in this type of semiconductor wafer cleaning equipment, semiconductor wafers received from a loader are held one by one on a rotating holder in a cleaning chamber and rotated, cleaned with cleaning water, dried, and then transferred to an unloader. It was proposed that the product be sent to the United States.

[Problems to be Solved] However, in conventional semiconductor wafer cleaning equipment, the semiconductor wafer is held in a rotary holder and rotated while being cleaned and dried, so static electricity is generated on the fil semiconductor wafer. This has the disadvantage that dust is deposited on the cleaned semiconductor wafers sent from the cleaning chamber to the unloader, and as a result, the cleaning effect of step 1iii is impaired.

In order to eliminate these drawbacks, the present invention provides a semiconductor wafer cleaning apparatus in which a pole is disposed at the outlet of the cleaning chamber to neutralize static electricity generated on semiconductor wafers in the cleaning solution. This is what we intend to provide.

(2) Composition of the Invention E Means for Solving Problem E] The means for solving the problem provided by the present invention is as follows: [The semiconductor wafer received from the loader is rotated in a cleaning chamber, washed with cleaning water, dried, and then unloaded. A semiconductor wafer cleaning apparatus for sending semiconductor wafers to a semiconductor wafer, characterized in that static electricity generated in cleaned semiconductor wafers is neutralized by disposing an electrode at the outlet of a cleaning chamber. wafer cleaning equipment.

[Function] The semiconductor wafer cleaning apparatus according to the present invention has the configuration specified in the above-mentioned solution to problem r], so that: (i) it functions to remove static electricity from cleaned semiconductor wafers; In turn, it acts to prevent dust from adhering to the semiconductor wafer that has been filtrated, and as a result fiii) maintains the cleaning effect.

[Example] Next, a preferred example of the semiconductor wafer cleaning apparatus according to the present invention will be described, and with reference to the attached drawings,
I will explain in detail. However, the examples described below are described to facilitate or accelerate understanding of the present invention, and are not described to limit the present invention. In other words, each element disclosed in the embodiments described below includes all design changes and equivalent substitutions that fall within the spirit and technical scope of the present invention.

FIG. 1 is a block diagram showing one embodiment of the semiconductor wafer cleaning apparatus of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the configuration of an embodiment of a semiconductor wafer cleaning apparatus according to the present invention will be described in detail with reference to FIG.

Reference numeral 10 denotes a semiconductor wafer cleaning apparatus according to the present invention, in which the semiconductor wafers 8M held against the semiconductor wafer holder 1A are taken out one by one by a transport guide JI.
Loader for feeding against one end of B! 1, and an inlet is provided at the other end of the conveyance guide 1180, and cleaning water (for example, pure water or carbonated water) is supplied from the cleaning water supply pipe 12A.
The semiconductor wafers M given from the loader 11 are held and rotated by the rotary holder 12B while supplying the semiconductor wafers to the cleaning chamber 12 for cleaning and drying them one by one, and to the outlet of the cleaning chamber 12. An unloader 1 disposed via a guide +3A for holding cleaned semiconductor wafers M0 one by one on a semiconductor wafer holder 13B.
3, and an electrode 14 disposed near the transport guide 13A for neutralizing static electricity generated on the cleaned semiconductor wafer 8M0.

The rotating holder 12B holds the semiconductor wafer 8M by vacuum suction.

The electrode 14 is formed of a metal with little metal contamination (for example, tungsten) or conductive silicon in order to avoid contamination of the cleaned semiconductor wafer M0 with metal dust. Further, the electrode 14 is connected to a suitable power source 14^.

Yu! Furthermore, with reference to FIG. 1, the operation of an embodiment of the semiconductor wafer cleaning apparatus according to the present invention will be described in detail.

In the semiconductor wafer cleaning apparatus according to the present invention, while moving the semiconductor wafer holder 11A in the direction of arrow A,
The loader 11 feeds the semiconductor wafers 8M one by one from the semiconductor wafer holder 11A to the transport guide IIB.

The transport guide IIB transports the semiconductor wafer M toward the cleaning chamber 12 in a well-known manner.

In the cleaning chamber 12, the semiconductor wafer M is held on a rotating holder 12B.
While rotating in the direction of the arrow X, wash water (for example, pure water or carbonated water) is supplied from the wash water supply pipe 12A.
Wash and dry by supplying.

The semiconductor wafer M (hereinafter referred to as "M") cleaned in the cleaning chamber 12 is given to the transport guide 13A. At this time, since the electrode 14 is disposed outside the outlet of the cleaning chamber 12, the cleaned semiconductor wafer The wafer M° is destaticized.

The cleaned semiconductor wafer M° is then delivered to the unloader 13 by the transport guide +3A.

In the unloader 13, while moving the semiconductor wafer holder 13B in the direction of arrow B, the cleaned semiconductor wafer M is
0 is held one by one in the semiconductor wafer holder 13B.

In addition to the physical description, the semiconductor wafer cleaning apparatus according to the present invention will be explained using specific numerical values in order to deepen the understanding.

! Semiconductor wafers (silicon wafers in this case) each having a diameter of 5 inches were supplied from the loader to the cleaning chamber one by one while applying a voltage of 20 KV at 50 Hz to the target electrode (conductive silicon in this case) from the power supply. After washing and drying while supplying pure water from the washing supply pipe, the material was sent to an unloader via a transport guide. A total of 25 semiconductor wafers were cleaned.

As a result, all of the cleaned semiconductor wafers given to the unloader had an electrostatic charge voltage of 100 μ or less, and an average of 6.2 pieces of dust j. with a diameter of 0.3 μm or more were removed. . Incidentally, no metal dust was observed on the cleaned semiconductor wafer.

The same cleaning operation as in the example was repeated without applying voltage from the power source to the soil gripping electrode.

As a result, all of the cleaned semiconductor wafers given to the unloader had an electrostatic charging voltage of 3.0 to 4.0 KV, and dust particles with a diameter of 0.3 um or more were on average 5.0 KV.
3g was removed. Incidentally, no metal dust was observed on the cleaned semiconductor wafer.

Compared to the comparative example, the nails and - examples were able to remove an average of 1.9 dust particles with a diameter of 0.3 μm or more per semiconductor wafer.

(3) Effects of the invention As is clear from the above, the semiconductor wafer cleaning apparatus according to the present invention has the configuration specified in the above-mentioned [means for solving problems j]. It has the effect of removing static electricity from the semiconductor wafer, which in turn has the effect of preventing dust from adhering to (iii) cleaned semiconductor wafers, and as a result, it has the effect of maintaining the (iii) il cleaning effect.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing an embodiment of a semiconductor wafer cleaning apparatus according to the present invention. 10... ・Semiconductor wafer cleaning equipment 11... ・・Loader 11A・
... ...Semiconductor wafer holder 11B...
......Transport guide 12...
......Cleaning chamber 12^...Cleaning water supply pipe 12B...Rotary holder 13... ...... Unloader 13
A......Transport guide 13B...
... Semiconductor wafer holder 14 ...
・・・・・・・・・・Electrode 14A・・・・・・・・・・
power supply

Claims (1)

[Claims] In a semiconductor wafer cleaning device, a semiconductor wafer received from a loader is rotated in a cleaning chamber, washed with cleaning water, dried, and then sent to an unloader.
1. A semiconductor wafer cleaning device characterized by neutralizing static electricity generated in a cleaned semiconductor wafer by disposing an electrode at an outlet of a cleaning chamber.